27-28 August 2025
Suwon
The Kurt J. Lesker Company is a global leader in the design and manufacturing of vacuum technology solutions for research and production applications. Through our four divisions – Vacuum Mart, Process Equipment, Materials and Manufacturing – we provide the most complete line of products and service solutions in the vacuum industry worldwide. From the simplest components and fittings to intricate vacuum chambers and precision computer-controlled deposition systems, our company works with you to devise sound, economical solutions for all your vacuum science needs.
Visit our Website to find out more! www.lesker.com
PLANOPTIK sets global standards with glass-based solutions for the semiconductor industry, microsystems, and microfluidics with manufacturers in over 40 countries. PLANOPTIK creates customized products that support cutting-edge sensors, microelectronics, and medical diagnostics.
In advanced packaging, PLANOPTIK’s glass core substrates enable ultra-compact microchip arrangements, enhancing performance, energy efficiency and device miniaturization. Its high-precision glass micro circuit boards are key for future semiconductor advancements, using copper-coated, lithographically processed glass for critical connections.
PLANOPTIK collaborates with its customers to design and produce high-volume, wafer-based components, offering solutions from glass wafers to thin-wafer handling tools.
PLANOPTIK develops and manufactures Wafers & Panels for business different business areas like Advanced Packaging and Wafer-/Panel-Level-Packaging. PLANOPTIK also creates Carrier & Tools for Thin-Wafer-Handling and processing applications. Furthermore, PLANOPTIK develops and produces Microreactors, Fluidic Chips and syringe pumps for Microfluidics and Flow Chemistry applications.
THE SPECIALIST FOR CHARACTERIZING PIEZOELECTRIC MATERIALS AND DEVICES FOR PRODUCTION AND RESEARCH
When others say it cannot be done, we go ahead and do it. With a combination of experience and a passion for innovation, we have been developing modular measurement systems for characterizing piezoelectric materials and designing integrated system solutions since 1995, always with the needs of our customers in mind.
Our goal: reliable tools, tailored precisely to the respective needs.
We offer our customers unique tools based on own modules and components from our partners that have proven themselves for years.
Combining system integration with automation
We have an experienced team of physicists, engineers, electricians and programmers that combines tried-and-tested modules and components with new developments like suitable sample fixtures. This lets us deliver guaranteed quality to customers like you in the shape of our highly reliable testing and production tools, with short run-up times.
We will always take the latest expert insights into account when designing and producing our systems. Although we always tailor our tools precisely to customer needs, several systems have become established. Two examples of our systems:
aixDBLI Industrial Line
– Only commercial system that allows quality control of the clamped film before further processing for process qualification
– Wafer mapping enables homogeneity testing
– Unique resolution of over 0,5 pm
– Monitoring of other characteristic values, such as breakdown voltage, leakage current, epsilon and loss factor
ScanningHALT
– Fast, automated measurement of a range of samples -> get a high-quality statistical database quicker, e.g. for aging estimations
– Systems are flexible and easy to adapt to your specific requirements
– Measurement support throughout the entire development and production phases
Maybe one of them is the solution you have been looking for. If not, do not hesitate to get in touch!
Trymax, your partner for plasma
Our core business is to support semiconductor manufacturers throughout the world with innovative plasma-based solutions for ashing, descum, surface preparation, isotropic etch, photoresist curing and charge erase that are used in the fabrication of integrated circuits.
Trymax Semiconductor Equipment designs, manufactures, and markets its own NEO equipment. A wide range of different NEO platforms are available, from single chamber semi-automatic tools, through to multi chamber high volume manufacturing platforms. Trymax offers a number of different plasma technology chambers which are configurable across all NEO platforms. This enables Trymax to offer an extremely wide range of different process capabilities to meet customer’s requirements.
Trymax is a privately held company. It has been on operation since 2003 and has its registered headquarters in Nijmegen, the Netherlands. We are ISO-9001 accredited and operate on a global basis, supporting our customers who operate across Europe, Asia and America.
Okmetic, established in 1985, is the 7th largest silicon wafer manufacturer in the world. The company specializes in 150-200 mm silicon and SOI wafers, serving power, MEMS, and RF device industries. Okmetic is a key player in the power device sector, offering optimized silicon wafers for discrete power devices, power management applications, and GaN growth.
Okmetic has worldwide sales organization and headquarters located in Finland, where the majority of its silicon wafers is manufactured. The company’s fab expansion set to be operational in early 2025 will increase 200 mm wafer capacity significantly. Okmetic operations are certified under ISO 9001:2015, ISO 14001:2015, and IATF 16949:2016, highlighting its commitment to quality and sustainability.
Okmetic is the leading supplier of advanced, high value-added silicon wafers for the manufacture of MEMS and sensors, RF filters and devices as well as power devices. We have the most extensive 150 to 200mm wafer portfolio in the market comprising of comprehensive lines of SOI wafers and High Resistivity RFSi® wafers as well as Patterned wafers, SSP and DSP wafers, TSV wafers, Wafers for Power devices and GaN-on-Si applications.
Okmetic’s silicon wafers are tailored to the customer’s product, process and technology needs, and produced in volume production. This ensures optimum wafer performance leading to multiple customer benefits: increased device performance and functionality, more advanced design possibilities, improved yield as well as streamlined and cost-effective manufacturing. Our silicon wafer solutions can be found e.g. in smartphones, portable devices and automotive electronics, and they support applications related to industrial process control, healthcare, the Internet of Things, and power and efficiency improvement.
AP&S International develops and produces wet process solutions for customers worldwide. Among them are many global players, as well as laboratories and midsize companies from the semiconductor-, MEMS- and micro-structuring industries.
The AP&S product range includes manual, semi-automated and fully automated wet process tools. They offer you wet process systems for batch processes as well as for single wafer processing as well as equipment for ensuring purity and maximum productivity in semiconductor production, e.g. B. FOUP, SMIF and box cleaners as well as different chemical management systems. The wet process equipment is used for cleaning, etching, metal etching, PR strip, electroless plating, lift-off, drying, coating and developing processes.
Company’s headquarters is in Donaueschingen, Germany, subsidiaries are located in China, Singapore and Malaysia.
More information at ap-s.de/
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
End of content
End of content