22-23 September 2025
Shanghai
Kurt J. Lesker Company® (KJLC®) is the leading global provider of exceptional customer service and high-quality vacuum equipment, with a goal of enabling the innovation, creation, and advancement of a vast array of products.
The depth and breadth of the markets we serve include: Semiconductor, LEDs, Optics, UHV/Synchrotrons, Wear and Decorative Coatings and R&D. Working side by side with our customers, we’re making an impact on the world today as well as a better tomorrow.
We help our customers compete and succeed on the leading edge of technology. Built on a tradition of customer service and quality, KJLC has grown from a regional manufacturer and distributor of vacuum components into today’s worldwide supplier in virtually every market.
As a manufacturer and distributor of all things vacuum, focus is critical. That’s why KJLC has four divisions—each relentlessly tackling challenges that a specific application demands. But rest assured, even with our focus on progress and innovation that helps to create the future, we always keep sight of quality and environmental stewardship of resources, as well as an embedded commitment to customer satisfaction—that’s in our foundation.
Founded in 1954, the Kurt J. Lesker Company® (KJLC®) is a manufacturer of vacuum equipment and systems to research laboratories and high technology industries from our facilities around the world. We are a leading manufacturer custom vacuum chambers, weldments, and components, recognized worldwide for specializing in both R&D and production environments.
From smaller, spherical chambers several inches in diameter for R&D, to large box chambers over 14′ long for production coatings, our expansive facilities are poised to service any and all custom vacuum chamber needs.
KJLC® also provides the very building blocks of the vacuum industry. We maintain the largest inventory of vacuum products available anywhere, so no matter the need, finding your part at KJLC® is a simple, straight forward process from start to finish. KJLC® has the most comprehensive inventory in the industry strategically located in our global distribution centers, providing the benefit of “buying locally” from a global supplier. Let us provide streamlined solutions to your complex supply chain and logistic issues.
Specifically, KJLC® offers the widest selection of internationally compatible flanged components, feedthroughs, valves, and components, along with a wide range of vacuum pumps, gauging, and vacuum fluids.
Since its foundation in 1970, PI (Physik Instrumente) has established itself as a leading manufacturer of precision positioning technology. The key element and motivation of the entrepreneurial behavior have always remained the same: Finding the best possible solution for the customer.
PI is well known for the quality of its products and has been one of the leading players in the global market for precision positioning technology for many years. One of the most important building blocks for this is the team spirit within the international PI family, which is based on mutual understanding and support that goes beyond international borders and functional restrictions.
PI is a privately owned company with healthy growth, 1,790 employees worldwide and a flexible, vertically integrated organization, which enables it to fulfill almost any request in the field of innovative precision positioning technology. The foremost priority for PI is to be a reliable and highly qualified partner for the customer.
PI Supports Semiconductor Equipment Suppliers Worldwide with High-Precision and Reliable Motion and Control Solutions for Applications Such As:
PLANOPTIK sets global standards with glass-based solutions for the semiconductor industry, microsystems, and microfluidics with manufacturers in over 40 countries. PLANOPTIK creates customized products that support cutting-edge sensors, microelectronics, and medical diagnostics.
In advanced packaging, PLANOPTIK’s glass core substrates enable ultra-compact microchip arrangements, enhancing performance, energy efficiency and device miniaturization. Its high-precision glass micro circuit boards are key for future semiconductor advancements, using copper-coated, lithographically processed glass for critical connections.
PLANOPTIK collaborates with its customers to design and produce high-volume, wafer-based components, offering solutions from glass wafers to thin-wafer handling tools.
PLANOPTIK develops and manufactures Wafers & Panels for business different business areas like Advanced Packaging and Wafer-/Panel-Level-Packaging. PLANOPTIK also creates Carrier & Tools for Thin-Wafer-Handling and processing applications. Furthermore, PLANOPTIK develops and produces Microreactors, Fluidic Chips and syringe pumps for Microfluidics and Flow Chemistry applications.
We are a MEMS design house offering both MEMS design consulting and software specifically for MEMS design, the i-ROM MODELBUILDER.
If you have an idea for a MEMS sensor – we have the way to get there. Whether it’s micromirrors, angular rate sensors or gyroscopes. We help you with the design until your MEMS sensor meets the desired requirements. Our software covers the entire design process, from the idea for a sensor to the complete manufacturing-ready GDS interface. All process data kits (PDK) are also taken into account right from the beginning.
With our software you can shorten the expensive and lengthy design process from an average of 3 to up to 1.5 years. Time that is worth a tremendous amount of money.
i-ROM MODELBUILDER is the new generation of simulation software. It is suitable for both experienced engineers and beginners. Its graphical user interface and intuitive operation make it a must for every MEMS company. The i-ROM software toolbox has its own FEM core, electronics and GDS interfaces. Easy to use – easy to start.
MEMS Consulting Services and MEMS simulation software
THE SPECIALIST FOR CHARACTERIZING PIEZOELECTRIC MATERIALS AND DEVICES FOR PRODUCTION AND RESEARCH
When others say it cannot be done, we go ahead and do it. With a combination of experience and a passion for innovation, we have been developing modular measurement systems for characterizing piezoelectric materials and designing integrated system solutions since 1995, always with the needs of our customers in mind.
Our goal: reliable tools, tailored precisely to the respective needs.
We offer our customers unique tools based on own modules and components from our partners that have proven themselves for years.
Combining system integration with automation
We have an experienced team of physicists, engineers, electricians and programmers that combines tried-and-tested modules and components with new developments like suitable sample fixtures. This lets us deliver guaranteed quality to customers like you in the shape of our highly reliable testing and production tools, with short run-up times.
We will always take the latest expert insights into account when designing and producing our systems. Although we always tailor our tools precisely to customer needs, several systems have become established. Two examples of our systems:
aixDBLI Industrial Line
– Only commercial system that allows quality control of the clamped film before further processing for process qualification
– Wafer mapping enables homogeneity testing
– Unique resolution of over 0,5 pm
– Monitoring of other characteristic values, such as breakdown voltage, leakage current, epsilon and loss factor
ScanningHALT
– Fast, automated measurement of a range of samples -> get a high-quality statistical database quicker, e.g. for aging estimations
– Systems are flexible and easy to adapt to your specific requirements
– Measurement support throughout the entire development and production phases
Maybe one of them is the solution you have been looking for. If not, do not hesitate to get in touch!
We’re all about making hardware development faster, more efficient, and more sustainable.
As such, our team consists of people passionate about using technology to make an impact
We write top-notch code, state-of-the-art algorithms, conduct world-leading research, drink first-rate coffee and come up with awe-inspiring hyphenations.
EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes.
EVG’s products, which include wafer bonding, lithography, thin-wafer processing and metrology equipment, enable advances in semiconductor front-end scaling, 3D integration and advanced packaging, as well as in other electronics and photonics applications.
With application labs and cleanrooms in Europe, North America and Asia, EVG is focused on delivering superior process expertise to its global R&D and production customer and partner base.
Founded in 1980, the company is headquartered in Austria, with fully-owned subsidiaries in the U.S., Japan, South Korea, China, Singapore and Taiwan. The company employs more than 1600 people worldwide.
EVG’s products, which include lithography, bonding, nanoimprint and metrology systems, play an essential role in enabling today’s leading device makers to develop and manufacture tomorrow’s technology innovations.
EVG holds the dominant market share for all types of wafer bonding equipment and is a technology leader in lithography for advanced packaging and nanotechnology. Our metrology systems are optimized to ensure the tightest process control and highest yields for our industry-leading process equipment.
With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in the U.S. and Japan, EVG’s process engineering team offers comprehensive technical support and advice to the semiconductor industry. We are focused on delivering superior process expertise to our global R&D and production customer and partner base. Our process development teams work hand-in-hand with customers, from the initial process development through to the final integration at their production sites. Services range from equipment demonstrations and feasibility studies to small-to-medium-scale pilot-line production to shorten time to market.
Customer satisfaction is critically important for EVG. Our worldwide customer support centers and spare parts supply network deliver on our commitment to provide on-demand, quality service that our local customers and partners have come to expect from EVG.
ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.
While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.
Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.
ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.
Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.
From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.
Trymax, your partner for plasma
Our core business is to support semiconductor manufacturers throughout the world with innovative plasma-based solutions for ashing, descum, surface preparation, isotropic etch, photoresist curing and charge erase that are used in the fabrication of integrated circuits.
Trymax Semiconductor Equipment designs, manufactures, and markets its own NEO equipment. A wide range of different NEO platforms are available, from single chamber semi-automatic tools, through to multi chamber high volume manufacturing platforms. Trymax offers a number of different plasma technology chambers which are configurable across all NEO platforms. This enables Trymax to offer an extremely wide range of different process capabilities to meet customer’s requirements.
Trymax is a privately held company. It has been on operation since 2003 and has its registered headquarters in Nijmegen, the Netherlands. We are ISO-9001 accredited and operate on a global basis, supporting our customers who operate across Europe, Asia and America.
Okmetic, established in 1985, is the 7th largest silicon wafer manufacturer in the world. The company specializes in 150-200 mm silicon and SOI wafers, serving power, MEMS, and RF device industries. Okmetic is a key player in the power device sector, offering optimized silicon wafers for discrete power devices, power management applications, and GaN growth.
Okmetic has worldwide sales organization and headquarters located in Finland, where the majority of its silicon wafers is manufactured. The company’s fab expansion set to be operational in early 2025 will increase 200 mm wafer capacity significantly. Okmetic operations are certified under ISO 9001:2015, ISO 14001:2015, and IATF 16949:2016, highlighting its commitment to quality and sustainability.
Okmetic is the leading supplier of advanced, high value-added silicon wafers for the manufacture of MEMS and sensors, RF filters and devices as well as power devices. We have the most extensive 150 to 200mm wafer portfolio in the market comprising of comprehensive lines of SOI wafers and High Resistivity RFSi® wafers as well as Patterned wafers, SSP and DSP wafers, TSV wafers, Wafers for Power devices and GaN-on-Si applications.
Okmetic’s silicon wafers are tailored to the customer’s product, process and technology needs, and produced in volume production. This ensures optimum wafer performance leading to multiple customer benefits: increased device performance and functionality, more advanced design possibilities, improved yield as well as streamlined and cost-effective manufacturing. Our silicon wafer solutions can be found e.g. in smartphones, portable devices and automotive electronics, and they support applications related to industrial process control, healthcare, the Internet of Things, and power and efficiency improvement.
For over 20 years, we have been supplying high-performance wet process equipment for the surface treatment of wafers to the world’s leading semiconductor manufacturers. Our modular product range is perfectly tailored to the needs of the semiconductor industry, whether standard wet process equipment or a customized solution is required.
Chemical wet processes are our passion. As a leading supplier for the semiconductor, MEMS and microelectronics industry, we offer wet process equipment for batch and single wafer processes as well as process supporting equipment!
Far-sighted, customer-oriented, innovative and committed to continuous progress – this is AP&S and its wet process equipment. At home in the semiconductor industry worldwide, we help shape the future of semiconductor production!
Efficient wet process solutions for your semiconductor production. Whether you need a standard system or a customized wet process solution: Our modular product range is perfectly tailored to your needs!
AP&S offers the complete range of wet process equipment from single wafer systems to wet benches for batch processes as well as fab logistics equipment.
The AP&S product range includes manual, semi-automatic and fully automatic wet process solutions for the semiconductor, MEMS and microstructuring industries as well as for the R&D sector. Among others, AP&S equipment covers the following wet processes: cleaning, etching, metal etching, PR stripping, electroless metal deposition, lift-off process, drying, developing and others.
We offer wet process equipment for batch processes as well as for single wafer processing and equipment for ensuring cleanliness and maximum productivity in semiconductor production such as FOUP, SMIF and box cleaners as well as various chemical management systems. AP&S equipment is used in front-end-of-line (FEOL) and back-end-of-line (BEOL) processes.
ULVAC GmbH which was established in 1987 as the European subsidiary of ULVAC, Inc. headquartered in Munich, Germany. ULVAC’s solutions diversely incorporate equipment, materials, and services for Semiconductors, MEMS, Flat Panel Displays, Electronic Components, PCB, TFB, and other Vacuum Equipment for the European Markets.
ULVAC is the global leader for thin film PZT deposition and etch.
ULVAC GmbH
Klausnerring 4
85551 Kirchheim b. München
Germany
Fon: +49 – 89 – 96 09 09 – 0
Fax: +49 – 89 – 96 09 09 – 96
Email: ulvac@ulvac.de
http://www.ulvac.eu
For MEMS application ULVAC has developed systems dedicated to MEMS sensors, actuators, switches, lab-on-chip and micromirror manufacturing. This equipment range includes sputtering and etching for piezo electric materials like PZT, AlN and ScAlN, glass and metal etching, thick resist ashing, resist and polymer removal within trench structures, and others.
Piezoelectric materials can be used to further miniaturize a range of devices, including inertial sensors, tuneable RF devices, inkjet print heads, micromirrors, microphones, autofocus lenses and others. The integration of thin film deposition directly on CMOS-processed wafers is key for highly-integrated devices. ULVAC has developed high-volume processing sputtering method that allows sub 500°C processing temperatures, is configured to pole the piezoelectric crystals during the deposition process and is compatible with other CMOS processes.
Evatec delivers complete thin film deposition solutions in Advanced Packaging, Semiconductor, Optoelectronics and Photonics – from UBM /RDL processes in FOWLP and FOPLP applications, to deposition of high performance piezoelectrics like AlScN for 5G networks or NIR bandpass filters for 3D sensing, face and gesture recognition in our smart devices. We deliver tailored production solutions with batch, cluster or inline architecture according to your substrate format, throughput, process and fab integration requirements. Evatec’s Advanced Process Control (APC) technologies set new standards in deposition through ‘in situ” capability for control of film properties during the deposition cycle. Reduce your process development times, enhance repeatability and yields or increase tool throughput.
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