OKUNO CHEMICAL INDUSTRIES
For metal finishing and surface finishing fields, OKUNO CHEMICAL INDUSTRIES have a wide variety of products more than 2700. OKUNO propose various chemicals for PWBs, semiconductor packages, aluminum surface finishing, anodizing, aluminum dyeing, plating on plastic, anti-corrosion, functional plating and anything else. Globally, our products have been used to make smartphones, tablets, consumer electronics, portable devices, music players and cars. Now, OKUNO strive to develop new products to satisfy carbon neutral actions, and for semiconductor package in high-speed communication era.
Products & Services
OKUNO CHEMICAL INDUSTRIES celebrates its 120th anniversary and is a leading company with strong research and development capabilities in the field of surface treatment and plating chemicals. It has particular expertise in chemicals and equipment for semiconductor package substrates. OKUNO will provide plating chemicals for applications such as electroless copper plating process for organic or glass substrate, electrolytic copper plating for TGV, RDL (Re-Distribution Layer), bumps for copper/nickel, mega-pillar formation and ENIG/ENEPIG plating process. Through these products, OKUNO supports technological innovation in the next-generation semiconductor packaging industry.
E&R Engineering Corp.
Advanced Laser & Plasma Innovation Provider
Established in 1994 and headquartered in Taiwan, E&R Engineering Corp.(OTC: 8027) has been delivering advanced laser and plasma solutions to the semiconductor industry for 30 years. Evolving from a tool provider to a solutions leader, we focus on TGV, FOPLP, FCBGA, FCCSP, ABF micromachining, and advanced materials like glass, SiC, and GaN, as well as 2.5D/3D Advanced Packaging.
Our strengths include flexibility, customized solutions, and robust global support. With 10+ service bases and 50+ field service engineers across Taiwan, China, Southeast Asia, the US,and Europe, we provide swift support and continuous process optimization.
Products & Services
TGV, FOPLP, FOWLP, FCBGA, FCCSP, Fan-Out, and Fan-In (Wafer Level Packaging),Laser Marking, Laser Cutting, Laser Drilling, Laser Scribing, Laser Grooving, Laser Beveling, Laser Debonding, Laser Ablation,
Plasma Dicing, Plasma Etching and Thinning, Plasma Descum, Plasma Clean, AOI, ABF Drilling, Dry Ice Cleaning, Carrier Tape
Corning Incorporated
Solving the World’s Toughest Optical Challenges with Innovation, Collaboration, and Precision.
Corning’s diverse Advanced Optics portfolio reflects our deep understanding of the properties of light, its interaction with matter, and the instruments used to detect it. For decades, we have been a trusted optics collaborator with leaders in a wide range of markets, including aerospace and defense, semiconductor materials and optics, telecommunications, and glass ceramics. We offer a diverse set of optics technologies providing solutions to full complex systems. Customer collaboration is the hallmark of our operations.
The Semiconductor Technologies & Solutions business is growing its investments to deliver an innovative and diverse set of glass and crystal components, and advanced optical sub-assemblies for modern lithography scanners, optical inspection systems, and advanced packaging substrates.
Learn more:
Semiconductors: Corning doesn’t just chip in; we help lead the way
Corning’s glass innovations help artificial intelligence enhance the way we work, learn, and live.
About Corning Incorporated
Corning is vital to progress – in the industries we shape and in the world we share. We invent life-changing technologies using materials science. Our scientific and manufacturing expertise, boundless curiosity, and commitment to purposeful invention place us at the center of the way the world interacts, works, learns, and lives. Our sustained investment in research, development, and invention means we’re always ready to solve the toughest challenges alongside our customers.
Products & Services
- Optical glass and crystalline materials for lithography tools (Deep-UV lenses and Extreme-UV mirrors and photomask blanks)
- Optical assemblies (modules, objectives) for Deep-UV, UV, Vis optical inspection tools
- Glass substrates for advanced packaging:
- Glass wafer temporary carriers for 2.5D, 3D packaging, Fan-Out, Si/SiC wafer thinning
- Glass panel for panel-level Fan-Out, glass core substrates
ATLANT 3D
ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.
While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.
Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.
Products & Services
ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.
Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.
From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.
Trymax Semiconductor Equipment
Trymax, your partner for plasma
Our core business is to support semiconductor manufacturers throughout the world with innovative plasma-based solutions for ashing, descum, surface preparation, isotropic etch, photoresist curing and charge erase that are used in the fabrication of integrated circuits.
Trymax Semiconductor Equipment designs, manufactures, and markets its own NEO equipment. A wide range of different NEO platforms are available, from single chamber semi-automatic tools, through to multi chamber high volume manufacturing platforms. Trymax offers a number of different plasma technology chambers which are configurable across all NEO platforms. This enables Trymax to offer an extremely wide range of different process capabilities to meet customer’s requirements.
Trymax is a privately held company. It has been on operation since 2003 and has its registered headquarters in Nijmegen, the Netherlands. We are ISO-9001 accredited and operate on a global basis, supporting our customers who operate across Europe, Asia and America.
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