22-23 September 2025
Shanghai
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21-22 April - Silicon Valley


Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
Lam Research Corporation is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry. Our strong values-based culture fuels our progress, and it’s through collaboration, precision, and delivery that we are driving semiconductor breakthroughs that define the next generation. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in Fremont, California, with operations around the globe. Learn more at www.lamresearch.com
We combine superior systems engineering, technology leadership, and a commitment to customer success to advance the global semiconductor industry. Our broad portfolio of market-leading deposition, etch, strip, and wafer cleaning solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand—it’s why nearly every chip today is built with Lam technology.
Teradyne (NASDAQ:TER) brings high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. They solve complex test and automation challenges and enable businesses to achieve higher production volumes, higher quality and higher ROI. Its Industrial Automation offerings include collaborative and mobile robots that help manufacturers of all sizes improve productivity and lower costs. In 2021, Teradyne had revenue of $3.7 billion and today employs over 6,500 people worldwide. For more information, visit teradyne.com.
Corporate Headquarters
+1 978-370-2700
Contact Us
www.teradyne.com
Teradyne delivers manufacturing automation across industries, applications and the world. Teradyne solves complex test and automation challenges and enables businesses to achieve higher production volumes, higher quality and higher ROI. Teradyne designs, develops, and manufactures automatic test equipment used to test semiconductors, wireless products, data storage and complex electronics systems in a number of industries, including consumer electronics, wireless, automotive, industrial, computing, communications, and aerospace and defense. The industrial automation portfolio includes collaborative robotic arms, autonomous mobile robots (“AMRs”) and advanced robotic control software used by global manufacturing, logistics and industrial customers to improve quality, increase manufacturing and material handling efficiency, and decrease manufacturing and logistics costs. The automatic test equipment products include:
AlixPartners is a results-driven global consulting firm that specializes in helping businesses respond quickly and decisively to their most critical challenges—from urgent performance improvement to complex restructuring, from risk mitigation to accelerated transformation. These are the moments when everything is on the line—a sudden shift in the market, an unexpected performance decline, a time-sensitive deal, a fork-in-the-road decision. We stand shoulder to shoulder with our clients until the job is done, and only measure our success in terms of the results we deliver.
Clients call us when they need pragmatism and cut-through to solve their most complex challenges arising from a continually disrupted world. Our services cover Artificial Intelligence, Corporate Strategy & Transformation, Data Governance, ESG, Growth, Investigations, Disputes & Advisory Services, Mergers & Acquisitions, Organizational Transformation, Supply-Chain Management & Operations, Technology, Transformative Leadership and Turnaround and Restructuring.
ASMPT Limited, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.
ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.
Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.
The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.
ATLANT 3D has mastered control of matter at the atomic scale, ushering in a new era in manufacturing. For research teams and manufacturers working at the frontiers of technology, we’ve created what was once thought unattainable: a system that builds materials and devices, atom by atom, with unprecedented precision and speed.
While others are constrained by traditional manufacturing limits, our breakthrough technology makes it possible to create the seemingly impossible, from next-generation quantum computers to devices that can operate in the harsh conditions of space. By replacing complex, resource-heavy processes with precise atomic-scale fabrication, we’re transforming technology while making manufacturing sustainable. We’re providing innovative teams the power to build technologies today that will define tomorrow’s world, using fewer resources to achieve greater possibilities.
Based in Copenhagen and London, with operations in the US, ATLANT 3D partners with research institutions and industrial companies to expand the boundaries of technological possibility.
ATLANT 3D is redefining microfabrication with its patented Direct Atomic Layer Processing (DALP®) technology. Our NANOFABRICATOR™ platform enables localized atomic layer processing for rapid material discovery, prototyping, and scalable device fabrication—bridging the gap from lab to fab.
Beyond hardware, we offer Pilot Projects and Joint Development Services to validate new materials and device architectures. A-HUB, our Microfabrication-as-a-Service (MaaS) centre, provides R&D teams with atomic-scale precision without the need for costly infrastructure.
From concept to fabrication, ATLANT 3D partners with academia and industry to drive next-generation innovations beyond conventional limits.
Solving the World’s Toughest Optical Challenges with Innovation, Collaboration, and Precision.
Corning’s diverse Advanced Optics portfolio reflects our deep understanding of the properties of light, its interaction with matter, and the instruments used to detect it. For decades, we have been a trusted optics collaborator with leaders in a wide range of markets, including aerospace and defense, semiconductor materials and optics, telecommunications, and glass ceramics. We offer a diverse set of optics technologies providing solutions to full complex systems. Customer collaboration is the hallmark of our operations.
The Semiconductor Technologies & Solutions business is growing its investments to deliver an innovative and diverse set of glass and crystal components, and advanced optical sub-assemblies for modern lithography scanners, optical inspection systems, and advanced packaging substrates.
Learn more:
Semiconductors: Corning doesn’t just chip in; we help lead the way
Corning’s glass innovations help artificial intelligence enhance the way we work, learn, and live.
About Corning Incorporated
Corning is vital to progress – in the industries we shape and in the world we share. We invent life-changing technologies using materials science. Our scientific and manufacturing expertise, boundless curiosity, and commitment to purposeful invention place us at the center of the way the world interacts, works, learns, and lives. Our sustained investment in research, development, and invention means we’re always ready to solve the toughest challenges alongside our customers.
Advanced Laser & Plasma Innovation Provider
Established in 1994 and headquartered in Taiwan, E&R Engineering Corp.(OTC: 8027) has been delivering advanced laser and plasma solutions to the semiconductor industry for 30 years. Evolving from a tool provider to a solutions leader, we focus on TGV, FOPLP, FCBGA, FCCSP, ABF micromachining, and advanced materials like glass, SiC, and GaN, as well as 2.5D/3D Advanced Packaging.
Our strengths include flexibility, customized solutions, and robust global support. With 10+ service bases and 50+ field service engineers across Taiwan, China, Southeast Asia, the US,and Europe, we provide swift support and continuous process optimization.
TGV, FOPLP, FOWLP, FCBGA, FCCSP, Fan-Out, and Fan-In (Wafer Level Packaging),Laser Marking, Laser Cutting, Laser Drilling, Laser Scribing, Laser Grooving, Laser Beveling, Laser Debonding, Laser Ablation,
Plasma Dicing, Plasma Etching and Thinning, Plasma Descum, Plasma Clean, AOI, ABF Drilling, Dry Ice Cleaning, Carrier Tape
For metal finishing and surface finishing fields, OKUNO CHEMICAL INDUSTRIES have a wide variety of products more than 2700. OKUNO propose various chemicals for PWBs, semiconductor packages, aluminum surface finishing, anodizing, aluminum dyeing, plating on plastic, anti-corrosion, functional plating and anything else. Globally, our products have been used to make smartphones, tablets, consumer electronics, portable devices, music players and cars. Now, OKUNO strive to develop new products to satisfy carbon neutral actions, and for semiconductor package in high-speed communication era.
OKUNO CHEMICAL INDUSTRIES celebrates its 120th anniversary and is a leading company with strong research and development capabilities in the field of surface treatment and plating chemicals. It has particular expertise in chemicals and equipment for semiconductor package substrates. OKUNO will provide plating chemicals for applications such as electroless copper plating process for organic or glass substrate, electrolytic copper plating for TGV, RDL (Re-Distribution Layer), bumps for copper/nickel, mega-pillar formation and ENIG/ENEPIG plating process. Through these products, OKUNO supports technological innovation in the next-generation semiconductor packaging industry.
Trymax, your partner for plasma
Our core business is to support semiconductor manufacturers throughout the world with innovative plasma-based solutions for ashing, descum, surface preparation, isotropic etch, photoresist curing and charge erase that are used in the fabrication of integrated circuits.
Trymax Semiconductor Equipment designs, manufactures, and markets its own NEO equipment. A wide range of different NEO platforms are available, from single chamber semi-automatic tools, through to multi chamber high volume manufacturing platforms. Trymax offers a number of different plasma technology chambers which are configurable across all NEO platforms. This enables Trymax to offer an extremely wide range of different process capabilities to meet customer’s requirements.
Trymax is a privately held company. It has been on operation since 2003 and has its registered headquarters in Nijmegen, the Netherlands. We are ISO-9001 accredited and operate on a global basis, supporting our customers who operate across Europe, Asia and America.
ACOOL uses a patented process to produce graphene-modified copper, which is a new material after graphene and copper form a covalent-metallic bond.
The world‘s only mass-producible graphene copper material, all properties exceed those of oxygen-free copper, we named ACOOL COPPER, that are transcendent.
It is formed by graphene and copper. It has dozens of excellent characteristics such as improved mechanical properties, electrical conductivity, thermal conductivity, corrosion resistance, oxidation resistance, EMI resistance, bending resistance, fusible current resistance, high voltage and low leakage, and low temperature coefficient.
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications.
Camtek is a developer and manufacturer of high-end inspection and metrology equipment for the semiconductor industry.
With manufacturing facilities in Israel and Germany, and eight offices around the world, Camtek provides state of the art inspection and metrology solutions in line with customers’ requirements.
Camtek has three product lines: Eagle and Hawk for inspection and 3D metrology and MicroProf for metrology.
Camtek’s inspection solutions provide comprehensive coverage for semiconductor manufacturing, supporting front-side inspection at sub-micron defect levels, as well as backside and edge inspection. Camtek’s 3D metrology solutions deliver precise measurements for micro-bump coplanarity and height, handling up to 500 million bumps per wafer. Our advanced metrology capabilities also cover critical parameters such as RDL CD/Overlay, TSV, topography, TTV, warp/bow, and layer thickness, ensuring comprehensive process control and high-quality manufacturing.
When your expedited shipment needs to reach its destination fast, we do whatever it takes to make it happen. We are more than an international courier, we are your partner in emergency logistics. We understand your challenges and work tirelessly to find the perfect solution for every urgent shipment. Delivering customized, reliable, and efficient NFO and hand-carry solutions for time and mission-critical shipments from anywhere to everywhere in the world. CNW is a major supplier in the Semiconductor and Automotive Industry. In an aircraft on ground situation, getting the plane back in the air is priority #1. With global 48 offices worldwide, plus an arsenal of loyal local logistics partners, CNW is ready to take on your logistic challenges.
General email: info@cnwglobal.com
Phone number:
+1.800.852.2282
+1.718.656.7777
NFO
Our Next Flight Out service is what we’re known for. CNW’s longstanding relationships with airlines, paired with our unwavering determination and creative mindset, allow us to get your package to its destination on the fastest route possible – at a substantial cost savings.
We analyze every variable – such as connecting flight schedules, last minute delays, traffic, office operating hours and weather – before determining the fastest route to get your package to its destination. In fact, CNW’s dedicated team monitors each package as it passes through 16 unique milestones to ensure the trip goes smoothly. But you don’t have to worry about the process. We make it simple for you to move your expedited shipments – leave the logistics to us.
OBC
We analyze every variable – such as connecting flight schedules, last minute delays, traffic, office operating hours and weather – before determining the fastest route to get your package to its destination. In fact, CNW’s dedicated team monitors each package as it passes through 16 unique milestones to ensure the trip goes smoothly. But you don’t have to worry about the process. We make it simple for you to move your expedited shipments – leave the logistics to us.
Our On-Board Courier (OBC) service is secure, reliable, and gives your package that extra special care. All CNW couriers are highly trained and will transport your goods using only the best practices. Moving your shipment via On-Board Courier is as easy as making a phone call. Whenever you need us, we’re here.
ACF
Occasionally, there are extreme situations when the only way to get your package to its destination on time is with an air charter. When that happens, CNW has got you covered. We can charter an aircraft dedicated solely to your shipment – large or small – to guarantee on time delivery of any package.
EBARA supplies various products worldwide, including Chemical Mechanical Polishing Systems, CMP, which are imperative for advanced semiconductor manufacturing, dry vacuum pumps, gas abatement systems, and ozonized water generators. Due to their high performance, reliability, and a secure support framework, these products are being adopted widely in various fields. EBARA Group’s products play a role not only in the semiconductor field, but also in other related industries such as solar cells, pharmaceuticals, other manufacturing, and research and development applications.
Chemical Mechanical Polishing Systems, bevel polishing system, electroplating system, dry vacuum pumps, gas abatement systems, ozonized water generators, industrial chiller
FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability.
FormFactor’s leading-edge probe stations, probes, probe cards, advanced thermal subsystems, quantum cryogenic systems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing.
Visit www.formfactor.com or follow us on LinkedIn.
A problem isn’t truly solved until it’s solved for all. Googlers build products that help create opportunities for everyone, whether down the street or across the globe. Bring your insight, imagination and a healthy disregard for the impossible. Bring everything that makes you unique. Together, we can build for everyone.
Hermes-Epitek was founded in 1977. Our vision is to “be a world-class semiconductor and Opto-Electronic company“ by delivering exceptional products and services, uniting the team with the motto ”service by Hermes-Epitek”. Over the 40 years, Hermes-Epitek has been supporting customers in Asia with our partners, serving more than 200 semiconductor and opto-electronic plants. We have successfully developed E-beam inspection, Ion beam implanter, and MOCVD systems. Our service teams are located in Taiwan, Singapore, Malaysia, and China, with more than 1200 employees worldwide. For more information, please visit https://www.hermes.com.tw/en/ Head Office Tel +886-3-579-0022 Fax +886-3-579-0011 Address No.18, Creation Rd., 1, Hsinchu Science Park, Hsinchu 300093, Taiwan
Macquarie Semiconductor and Technology provides innovative financing, second-hand asset solutions, and managed services to improve the operational and capital efficiency of clients. The team is made up of industry professionals around the world who deliver successful outcomes for semiconductor and advanced technology companies.
We focus on innovation, careful risk management and delivering sustained long-term value for our clients, partners, investors, staff and the broader communities in which we operate.
Macquarie’s people are empowered to innovate and invest for a better future.
Pentamaster Group provides automation technology and solutions to multinational manufacturers in the automotive, semiconductor, electro-optical, consumer electronics, and medical sector, spanning across APAC, North America and Europe. Besides the HQ and production plant in Penang, Malaysia, the Group has strategic presence globally with offices located in the USA, Japan, Germany, Singapore and production facilities in China.
With the speed and magnitude of technology progress today, Pentamaster Group will always be bold enough to explore new innovations. For years, the Group has been one of the leading global providers of automated test equipment to suit different requirements and needs of customers from various industries. In the automotive segment, the group has developed a proprietary SiC wafer burn-in system, being one of the top four manufacturers in the world, in creating a niche market space for this growth sub-segment and to solidify the Group’s position in the automotive industry.
Plasmatreat is the key enabler technology for microfine cleaning, surface activation and atmospheric plasma coatings (CVD) of nearly all kinds of materials – from plastics, metals and glass in a wide variety of industries including semiconductors. We prepare surfaces in an environmentally friendly way – replacing the need for chemicals and primers.
Atmospheric plasma equipment enabling state of the art surface preparation – activation, cleaning, reduction and nano-coatings for:
Flux-free Advanced Chip Packaging, Power Modules, Wire Bonding, Display Bonding, LED, PCBA and Consumer Electronics.
Area-selective, inline plasma processes in atmosphere including CVD coatings (dielectric barrier coatings, tie layers and anti-corrosion protection).
TPD offers specialized semiconductor recruitment services tailored to your needs. Rely on our team of industry experts to deliver top semiconductor talent when you need it, guaranteed.
TPD’s Total Workforce Solution is a smart approach to building your semiconductor team. By identifying the optimal balance of contract and direct hire resources, we create workforce flexibility while reducing fixed costs. Our Total Workforce Solution can help in all semiconductor environments:
Direct Hire Recruitment
Contract & Project Staffing
Contractor Payrolling (EOR)
Yamaha Robotics Co., Ltd. is a Yamaha Motor Co., Ltd. group company that handles semiconductor manufacturing equipment (back-end processing) and electronic component assembly equipment businesses.
We can offer to provide a total solution that exceeds our customers’ expectation as the “Turn-Key Provider in Semiconductor Back-end Process Equipment” by integrating the technologies of bonders, molds,surface mounters, Industrial Robots, and various automated equipments.
Development, manufacturing and sales of semiconductor back-end process equipment.”Connecting” technology: die bonding, wire bonding and flip chip bonding; “Solidification” technology: resin encapsulation equipment and molding equipment; “Assembly” technology: electronic component assembly and manufacturing equipment.
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