Moderator
Dr. Hongchao Liu 刘红超
Anhui YOFC Advanced Semiconductor Co. Ltd (YASC)
Dr. Liu has more than 20 years’ semiconductor industry and more than 10 years’ experience with rich experience and unique understanding of technology industrialization and internationalization. His academic in materials science includes Shanghai Institute of Ceramics, Chinese Academy of Sciences, Muenster University in Germany, Nagoya Institute of Technology in Japan. He industry career covered China Resources Microelectronics, ASMC (Now GtaSemi). Dr. Liu received his BS degree in physical chemistry from Sichuan University, PhD in Materials Science from Shanghai Institute of Ceramics, Chinese Academy of Sciences. He held a Postdoc position in Nagoya Institute of Technology, and received a Young Scientist Award by Asian Crystallography Association. He was awarded an Alexander von Humboldt Research Fellowship in 2000. S. He has authored more than 30 papers, and holds over 40 patents. His research covers semiconductor materials, devices and processing.
Company Profile
YASC dedicates to the design, process, and fabrication of devices of SiC and GaN. Currently, we are one of the leading 6-inch fab in mass production with advanced supporting systems, provides turn-key services from chip design, epitaxial processing, wafer manufacturing, probing, assembly, module packaging, reliability and final test.
Panelist
Cheng-Tyng Yen
Fast SiC Semiconductor Inc.
Founder & CEO of Fast SiC Semiconductor. fastSiC is a fabless company dedicated on SiC power devices. Fast SiC Semiconductor has mass produced 650V~1700V SiC MOSFETs with its own proprietary designs, which have been adopted by leading customers in the field of server power supplies, charging piles and PV inverters. He has more than 10 years experiences on the design, process, qualification and application of SiC power devices. He currently serves as the TPC member of ISPSD and has published and filed more than 150 papers and patents.
Company Profile
Fast SiC Semiconductor is a SiC power devices supplier. We supply high performance 650V~1700V SiC MOSFETs and Schottky Barrier Diodes discrete devices and bare chips with our own proprietary designs, for leading customers in applications including PV inverters, EV charging piles, energy storage system, BMS, ATE, motor drive, SMPS for datacenter, OBC and DC/DC for EV, as well as manufacturers of industrial and EV power modules.
General Telephone: +886-3-6590579
General Email: info@fastsic.com
Website: https://fastsic.com
Panelist
Jiemin Cao 曹杰敏
Hangzhou Silan Microelectronics Co., Ltd.
Graduated from Shandong University in 2003
2003~2004 engaged in process development of Ningbo SMIC(Riying&IMP)
From 2004 to today , I worked in Silan Microelectronics, respectively engaged in chip testing, FA&RA ,quality director, Power module product &assembly development .
Now is VP of Silan, in charge of: power module product &package development, IGBT/SIC chip platform management, product quality engineering, RA&FA, etc.
Company Profile
Since 1997
As a high-tech enterprise specializing in the design of IC chip and the manufacturing of semiconductor microelectronics-related products, Hangzhou Silan Microelectronics Co., Ltd. (600460) is located in Hangzhou High-tech Industrial Development Zone. The company was founded in September 1997 and was headquartered in Hangzhou, China. In March 2003, our stock was listed on the Shanghai Stock Exchange and the company is the first IC chip design enterprise listed in China. Thanks to the rapid development of China’s electronic information industry, Silan has become one of the largest IC design and manufacturing enterprises in China, and many indicators such as technical level, business scale, profitability etc. are among the best in the domestic counterparts.
The IC chip production line belonging to Silan built in the Qiantang New District of Hangzhou currently has an actual monthly output of 220,000 pieces, ranking second in the world in production capacity for chips of 6 inches or less. Meanwhile, with the production line for 8-inch chips being constructed in 2015 and going into operation in 2017, the company has become the first domestic company possessing IDM products and production line for 8-inch chips. In 2018, a special process wafer production line for 12-inch chips and an advanced compound semiconductor device production line were constructed in Xiamen. By the end of 2022, the monthly production capacity of the company’s 12-inch chips line has reached 60,000 pieces, and the monthly production capacity of the compound semiconductor device production line has reached 140,000 pieces.
Company Products & Services
Our technologies and products cover many fields of consumer products, and maintain a leading position in many technical fields, such as green power supply chip technology, MEMS sensor technology, LED lighting and screen display technology, high-voltage smart power module technology, the third-generation power semiconductor device technology, digital audio and video technology etc. Moreover, with rich experience in multiple fields of chip design, we can provide customers with solutions on targeted chip product series and systemic applications.
Our product and R&D investment is mainly focused on the following three fields:
Panelist
Dr. Hongliang Shi
Hunan Sanan Semiconductor Co., Ltd.
Dr. Shi Hongliang, Director of SiC Application of Hunan SANAN, is responsible for customer requirement introduction, system level application solutions, technical support and new product definition. He has 10+ years of R&D experience in system application design of SiC power devices, optimized design of high frequency high power magnetic devices, etc. He holds a PhD degree in Electrical Engineering from Tsinghua University.
Company Profile
Sanan Semiconductor is a wholly-owned subsidiary of the listed company Sanan Optoelectronics. Sanan is committed to becoming a world-class R & D, manufacturing and service platform for wide bandgap semiconductors. Sanan Semiconductor extended Sanan Optoelectronics’ 20-year compound semiconductor industrialization experience to the field of power electronics, and became a full-chain integration platform focusing on the wide bandgap semiconductor industry and providing the most comprehensive products and services.
Company Products & Services
Sanan Semiconductor’s silicon carbide (SiC) power products include automotive and industrial SiC Schottky barrier diodes (SBD) and SiC MOSFETs which provide key components with higher power density and higher energy conversion efficiency for the electric vehicles and renewable energy markets. These can then be applied to high-reliability applications such as electric vehicle drivetrains, charging stations, and solar photovoltaic inverters. Sanan Semiconductor is a member of the JEDEC JC-70 Wide Band Gap Semiconductor Standards Committee, which collaborated with the industry to provide process technologies and products with improved reliability and quality. The company also has a portfolio of AEC-Q101 certified products.
