As AI model sizes continue to grow, models will have 100 trillion or more connections, exceeding the technical capabilities of existing AI platforms. New optical interconnect solutions that enable novel system architectures are needed to address the scale, performance and power demands of the next generation of AI. The latest advancements in optical I/O, a new generation of chiplet and multi-wavelength laser solutions, provide dramatically increased bandwidth, at lower latency, over longer distances and at a fraction of the power of existing electrical I/O solutions. In this talk, we present the convergence of trends in compute applications, new optical and advanced packaging technologies, and a scalable supply chain ecosystem, leading to opportunities to build paradigm shifting system architectures addressing AI/ML and cloud computing applications.