16:10 – 16:40
Geopolitical Landscape and the Semiconductor Industry Impact Closing Panel Discussion
Moderator
Salah Nasri
I.S.E.S.
Salah Nasri is the CEO & Co-Founder of the International Semiconductor Executive Summits (ISES), a division of the International Semiconductor Industry Group Ltd. an influential organization within the semiconductor industry. With extensive experience in the sector, Nasri has played a pivotal role in fostering global collaboration among semiconductor leaders. Under his leadership, ISES has become a premier platform for industry executives to connect, share insights, and drive innovation across various regions including the United States, Europe, Asia, and the Middle East.
Salah Nasri has been instrumental in expanding the reach and impact of ISES, organizing significant events that bring together decision-makers from across the semiconductor ecosystem. These events provide opportunities for networking, collaboration, and the exchange of ideas crucial for advancing the industry in areas such as semiconductor manufacturing, MEMS, AI, automotive electronics, and more.
His leadership has not only enhanced the visibility of ISES globally but also strengthened partnerships with key industry players, ensuring that ISES remains at the forefront of semiconductor innovation and development. Salah Nasri has previously worked at Goldman Sachs’s, Credit Suisse and International Business Development Group. Salah Nasri graduated from Oxford University and Loughborough University in International Relations and Economics. In 2024, Salah Nasri became a Stanford University Alumni after completing the Stanford Executive Program.
I.S.E.S.
Company Profile
Established in 2010, the International Semiconductor Industry Group (I.S.I.G.) is a prestigious and trusted association within the semiconductor industry, renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.
Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector. Join us today!
Panelist
Matthew Fulco
The Economist Intelligence Unit
The Economist Intelligence Unit
Panelist
Prof. Rao Tummala
Georgia Institute of Technology
Prof. Rao Tummala is a Distinguished and Endowed Chair Professor and Director Emeritus at Georgia Tech in USA. He is well known as an industrial technologist, technology pioneer, and educator. Prior to joining Georgia Tech in 1993, he was an IBM Fellow and Director of Advanced Packaging Lab(APTL), pioneering such major technologies as the industry’s first plasma display in the 1970’s and the first and next two generations of 100-chip MCM package integration, now called chiplet MCMs, in 1980″s for servers, mainframes, and supercomputers. He is the father of System-on-Package(SOP) concept Vs. System-on-chip (SOC.) As an educator, Prof. Tummala was instrumental in setting up the largest and most comprehensive Academic Center funded by NSF as the 1st and only NSF Engineering Research Center in Electronic Systems Packaging at Georgia Tech. Such a Center, under his leadership, pioneered an integrated approach to research, education, and global industry collaborations. It involved about 30 academic and full-time research faculty,200 Ph.D. and MS students and 50-70 industry and academic collaborators from US, Europe, Japan, Korea, India and Taiwan.. It educated thousands of engineers in packaging in classrooms and labs.,and produced more than 1000 engineers with Ph.D., MS and BS degrees,. He has published about 800 technical papers and invented technologies that resulted in over 110 patents and inventions. He has been pioneering glass-based electronics as the most leading-edge packaging technology beyond Silicon interposers that is targeted to go into production In 2023.
He wrote the first modern handbook in packaging, Microelectronics Packaging Handbook( McGraw-Hill,1988); then 1st undergrad textbook, Fundamentals of Microsystem Packaging(2001); the 1st book introducing the concept of SOP, Introduction to System-on-Package( 2006) and the 2nd edition of Fundamentals of Device and Systems Packaging (2020). He received more than 50 Industry, Academic and Professional Society awards, including. 12Invention and 4 Corporate Awards from IBM, IEEE Award David Sarnoff Award for Industry’s First MCM in 1991 ,ASM-International: Engineering Materials Achievement Award for LTCC in 1992,IEEE CPMT: Sustained Technical Achievement Award in 1992,European Electronic Materials Award from DVM in 1995,,International Microelectronic & Packaging Society’s (IMAPS): Dan Hughes Award in 1997,American Ceramic Society’s John Jeppson Award in 1998,IMAPS’: John A. Wagnon’s Award in 1991,IMAPS: John A. Wagnon’s Award , Named by US News and World Report as one of the 50 Stars in US for US competitiveness in 1999,Total excellence in Manufacturing Award from ASE in 2000,Educator of the Year for Excellence in Teaching, Research, and Innovation in Electronics from the India-America Cultural Association in 2002 andTechno-visionary Award from Semiconductor Industry Association of India in 20110. In addition, he is a distinguished Alumni of
Indian Institute of Science, Bangalore in 2000 , India,;University of. Illinois in 1988 and Distinguished Faculty of Georgia Tech in 2002
He is a member of NAE in USA. And NAE in India and IEEE, IMAPS and Am Ceramic Society Fellow, and President of IEEE CPMT and IMAPS Societies. He has been a consultant and advisor to many of Fortune 500 semiconductor and systems companies
IEEE recently named him as the father of modern Packaging and created a technical field award in his name—IEEE Rao Tummala Electrronics Packaging Award’
Georgia Institute of Technology
Panelist
Sunil Banwari
iontra
iontra
Panelist
Mario Morales
IDC
Mario Morales is the group vice president of IDC’s enabling technologies, semiconductor, storage, and DataSphere research.
He is responsible for in-depth analysis, evaluation of emerging markets and trends, forecasting, and research of major semiconductor industry segments such as embedded and intelligent systems, wireless, personal computing, networking and cloud infrastructure, automotive electronics, and AI semiconductors.
BACKGROUND
Mr. Morales is an accomplished program vice president, manager, and industry expert with over 25 years of experience in building a multinational top-tier consulting, sales, and research team and driving a set of established businesses. Solid experience in managing strategic partnerships and advisory services with IDC’s largest multinational clients. Strong analytical, strategic planning skills, and managing complex projects involving strong collaboration across geographies, functional groups, and business units. Proven leadership skills and instrumental at establishing research and business KPIs.
Mr. Morales is a trusted advisor to leading high tech company executives, financial investors, and bankers on market landscape and direction, product and technology positioning, competitive benchmarking, M&A, HW, and SW technology, and brand health and sustainability. Established relationships with technology suppliers including Intel, Samsung, TSMC, Qualcomm, Huawei, HP, AMD, NVIDIA, Microsoft, Facebook, TI, Micron, UMC, SoftBank, ARM, NXP, and others.
Mr. Morales is the leading advisor and expert analyst for IDC’s largest Wall Street clients including investment banking, VC’s, and mutual and hedge funds across every major financial region.
Over his career, Mr. Morales has authored and co-authored over 240 reports and studies in the area of semiconductors, mobile, PC, wireless, embedded, IoT, and IT marketplace. His team is responsible for some of the most interesting and evolving tech in our industry including coverage of microprocessors, accelerated computing, storage, memory, sensors and connectivity. His team has been responsible for initiating coverage of emerging technologies for IDC, and driving new research business practices, and creating leading industry market models in DRAM, NAND, Embedded processors and controllers, AI ML architectures, cellular baseband modems, WiFi, cellular broadband, digital consumer, foundry, EMS, and intelligent systems.
His career includes past positions with NEC Electronics and Dataquest.
EDUCATIONAL ACCOMPLISHMENTS
- B.S. in Finance and Accounting from San Jose State University
- Fluent in English and Spanish
- Frequent presenter and advisor to CEOs and executive teams across his portfolio of clients
- Strong reputation as an advisor and industry expert on Wall Street
- IDC executive analyst for Intel and Qualcomm
- Frequent speaker, presenter, and moderator at IDC Directions events in Asia and semiconductor industy conferences including ISS, GSA, CASPA, CISES, and SEMI
IDC
Company Profile
IDC is the premier global provider of market intelligence, advisory services, and events for the information technology, telecommunications, and consumer technology markets. IDC helps IT professionals, business executives, and the investment community make fact-based decisions on technology purchases and business strategy. More than 1,100 IDC analysts provide global, regional, and local expertise on technology and industry opportunities and trends in over 110 countries worldwide. For more than 50 years IDC has provided strategic insights to help our clients achieve their key business objectives. IDC’s Insights businesses provide industry-focused advice for IT buyers in the Financial, Government, Health, Retail, Manufacturing and Energy verticals. IDC is a subsidiary of IDG, the world’s leading technology media, research, and events company. You can learn more about IDC by visiting www.idc.com.
