Transistor density in chips continues to follow Moore’s law, but the node to node logic performance improvements have slowed down. Memory and power walls limit compute system performance. Future compute systems will increasingly rely on new materials, new device architectures and system technology co-optimization to realize benefits beyond pure density scaling of compute, connect and store technologies. This talk will highlight technology innovations in logic, memory and 3D integration that will enable continued compute systems scaling. With the anticipated semiconductor industry growth in the next decade, we also need collective action to address the carbon footprint of semiconductor manufacturing.