MEMS technology has become an integral part of our daily lives, enhancing the safety of our vehicles, empowering our smartphones with advanced sensing capabilities, and paving the way for groundbreaking AR/VR experiences. However, in recent years, fundamental innovation in the field of MEMS has been limited. This presents a prime opportunity for disruption, and Omnitron has risen to the challenge by introducing a revolutionary “New Topology for MEMS” that delivers an order of magnitude improvement in actuation power and sensitivity, heralding a new era in MEMS technology.

Leveraging a clever rearrangement in silicon processing techniques and a novel packaging methodology, Omnitron’s “New Topology for MEMS” offers a 10x improvement in capacitance per unit area, 5x deeper trenches, and a batch-level pretilt offset. On top of that, this topology, which has been proven through fabrication, is a scalable, cost-effective, and high-performance solution for the mass production of advanced sensors.

The speaker will elucidate the significance of this innovative topology by showcasing a 15mm MEMS step-scanning mirror designed for long-range LiDAR applications. This mirror provides a Figure of Merit (FOM) 5x better than any other MEMS mirror on the market.