The three major trends of automotive intelligence, electrification, and networking are driving rapid changes in the automotive electronics industry, increasing the demand for high-performance, low-power, and integrated chip solutions. Traditional chip design models are struggling to meet the rapidly evolving market needs. To design specialized chips for different vehicle models and functions, chip design companies often need to tailor appropriate chip solutions to the specific requirements of automotive manufacturers, ensuring optimal balance of functionality, performance, and power consumption. The Zhonghuawei IC technology platform offers full-process services, significantly shortening the chip development cycle. Chiplet technology achieves a balance of performance, cost, and time through modular design and integration, further optimizing the cost structure for efficient modular production. The Zhonghuawei Turnkey platform combines advanced IC technology with rich design experience, encompassing ASIC customization, 2.5D/3D IC design packaging, and Chiplet technology. It provides customers with comprehensive customization services from demand analysis and architecture design to chip mass production. This not only strengthens the hardware foundation for automotive electronics but also assists customers in achieving outstanding product delivery.

汽车智能化、电动化、网联化的三大趋势，促使汽车电子行业快速变革，推动了对高性能、低功耗、集成化芯片解决方案的需求。传统芯片设计模式已难以满足快速变化的市场需求。

为了满足不同车型和功能需求设计专用芯片，往往需要芯片设计公司对汽车厂商的具体要求，量身定制合适的芯片解决方案，确保功能、性能和功耗达到最佳平衡。中茵微IC技术平台提供全流程服务，显著缩短了芯片开发周期。Chiplet技术通过模块化设计和集成，实现了性能、成本和时间的平衡，进一步优化成本结构，实现高效的模块化生产。

中茵微Turnkey平台结合了先进的IC技术和丰富的设计经验，包含ASIC定制、2.5D/3D IC设计封装和Chiplet技术，为客户提供从需求分析、架构设计到芯片量产的全方位定制服务。在为汽车电子提供更强大的硬件基础同时，助力客户实现卓越的产品交付。