14:40 – 15:00
Tackling the Power Wall-Next Level of Integration Technologies in PCB and Substrates
突破功率墙：PCB 与基板集成技术的进阶之路
The presentation explores how advanced integration technologies in PCBs and substrates are key to overcoming critical challenges of the power wall. It highlights the growing energy demands driven by AI and data-centric applications, and the need for efficient power management in high-performance computing. Through innovations like embedded packaging, GaN and SiC modules, and advanced substrates, AT&S demonstrates solutions that enhance thermal performance, reduce electrical losses, and support heterogeneous integration—paving the way for scalable, energy-efficient electronics in automotive, data centers, and beyond.
Hong (Rainbow) Yuan
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Rainbow Yuan is a seasoned technology executive with over two decades of experience in the electronics and telecommunications industry. Her leadership roles have spanned various domains including product engineering, front-end engineering, strategic marketing, and business development. Currently she is serving as the Vice President of Technology at AT&S Headquater in Leoben, Austria, she leads global teams in Application Engineering Excellence and Technology Development, driving innovation and aligning technology strategies with business goals.
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Company Profile
Technology and digitalisation are having an ever-growing impact on our lives and are increasingly shaping our daily routines at home and at work. The advances achieved in these fields in recent years are truly breathtaking and have created crucial momentum for growth in every sector of the economy.
As a global technology enterprise, AT&S is actively involved in these developments and plays a decisive role in shaping the digital world of tomorrow. The high-end PCBs and IC substrates AT&S supplies influence future industry standards, products and applications in a number of key industries. Our products’ unrivalled quality and constant innovation secures our customers’ long-term competitiveness. AT&S brings its expertise to bear wherever data is processed, transmitted or stored, or complex systems and machinery need to be controlled or supplied with energy. Thanks to our years of experience in microelectronics, we have the engineers and knowledge needed to overcome any technical challenge. We have developed the best products, processes and technologies in the industry – and constantly strive to develop further and make sure we stay one step ahead.
Company Products & Services
Our printed circuit boards and IC substrates represent the very latest technology and can be found in cars, industrial plants, servers, medical technology products and consumer electronics. Video streaming, apps, social media and other cornerstones of everyday digital life would not be possible without AT&S. Our technologies and products are a driving force behind rapidly advancing miniaturisation in the electronics industry and enable maximum performance in the smallest of spaces. Our products: IC substrates, Substrate-like printed circuit boards and modules, Flexible and rigid-flex printed curcuit boards, Thermally enhanced printed circuit boards, HDI printed circuit boards, Cavity printed circuit boards, ECP printed circuit boards, High-frequency & high-speed printed circuit boards, Multilayer printed circuit boards, Test & reference boards, Double-sided printed circuit boards.
