15:35 – 15:55
Advanced Packaging Materials Innovation through Co-creative Activities
In the semiconductor field that supports the evolution of generative AI, innovative packaging technology is attracting increasing attention.
Resonac, a co-creation chemical company, has established a Packaging Solution Center to provide one-stop solutions for its customers,
and has launched the evaluation platform “JOINT2” together with materials, substrate, and equipment manufacturers to accelerate the development of cutting-edge packaging technologies.
In this presentation, we will discuss trends in advanced packaging materials and the latest technologies related to panel interposers. We will also highlight the value and material innovations generated through co-creation activities.
Hidenori Abe
Resonac Corporation
Hidenori Abe is CTO for semiconductor materials and Executive Director of Electronics Business Headquarters at Resonac. He leads R&D and strategy for electronic materials in semiconductors, substrates, and displays. Previously, Mr. Abe served as the head of the Electronics R&D Center and Packaging Solution Center, where he contributed to advanced packaging development through open innovation. Notably, in 2021, he directed the launch of JOINT2, a consortium targeting 2.xD and 3D packaging technologies. He received a master’s degree in chemical engineering from Tokyo Institute of Technology, Japan, and a master’s degree in the Executive MBA program from the University of Oxford, UK.
Resonac Corporation
Company Profile
Resonac defines its purpose as “Change society through the power of chemistry.” Resonac aims to be a world-class functional chemical manufacturer, creating functions necessary for the times, supporting technological innovation, and contributing to the sustainable development of our customers. Resonac is Global Leading semiconductor materials supplier. In order to achieve technological innovation for solving various social issues, it is essential for us to make wide-ranging co-creative efforts with partners, and Resonac is open to collaboration including 1on1 co-development with any partner.
We have opened a Packaging Solution Center and are actively engaged in next-generation semiconductor co-creation activities through JOINT2 with many partner companies. Furthermore, starting this year, we will also seek co-creation opportunities in the United States by launching US-JOINT.
