The IC substrate industry is the foundation of the semiconductor ecosystem, with its innovation and advancements directly affecting the performance, reliability, and efficiency of electronic products. Glass Through-Via (TGV) technology is one of the most promising advancements in this field, offering high electrical performance, improved thermal management, and significant miniaturization potential. However, achieving these advantages entails numerous technical and manufacturing challenges. Glass, as a substrate material, has excellent electrical insulation, low dielectric constant, and better CTE values compared to organic cores, but its brittleness presents significant challenges. Ensuring the mechanical integrity of glass substrates throughout the stages of via formation, metallization, and subsequent stacking requires innovative methods and precise control of processing parameters.