The presentation explores how advanced integration technologies in PCBs and substrates are key to overcoming critical challenges of the power wall. It highlights the growing energy demands driven by AI and data-centric applications, and the need for efficient power management in high-performance computing. Through innovations like embedded packaging, GaN and SiC modules, and advanced substrates, AT&S demonstrates solutions that enhance thermal performance, reduce electrical losses, and support heterogeneous integration—paving the way for scalable, energy-efficient electronics in automotive, data centers, and beyond.