About Us

Established in 2010, the International
Semiconductor Industry Group (I.S.I.G.) is a
prestigious and trusted association within the
semiconductor industry

renowned for orchestrating major regional summits across the globe, ranging from the U.S, the Middle East & Asia via our division, the International Semiconductor Executive Summits (I.S.E.S.). Our summits, are fully endorsed by local governments and leading companies in all areas of the semiconductor supply chain.

Moreover, I.S.E.S. serves as the Premier platform for senior executives in technology, manufacturing, and R&D from diverse semiconductor companies, technology providers, and affiliated industries. Our events are instrumental helping to shed light onto key industry trends, drive innovation and influence key decisions to help shape, and advance the growth of the semiconductor sector.

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Meet the Team

Salah Nasri
CEO & Co-Founder
Salah Nasri
CEO & Co-Founder
Salah Nasri is the CEO & Co-Founder of the International Semiconductor Executive Summits (ISES), a division of the International Semiconductor Industry Group Ltd. an influential organization within the semiconductor industry. With extensive experience in the sector, Nasri has played a pivotal role in fostering global collaboration among semiconductor leaders. Under his leadership, ISES has become a premier platform for industry executives to connect, share insights, and drive innovation across various regions including the United States, Europe, Asia, and the Middle East.
Salah Nasri has been instrumental in expanding the reach and impact of ISES, organizing significant events that bring together decision-makers from across the semiconductor ecosystem. These events provide opportunities for networking, collaboration, and the exchange of ideas crucial for advancing the industry in areas such as semiconductor manufacturing, MEMS, AI, automotive electronics, and more.
His leadership has not only enhanced the visibility of ISES globally but also strengthened partnerships with key industry players, ensuring that ISES remains at the forefront of semiconductor innovation and development. Salah Nasri has previously worked at Goldman Sachs’s, Credit Suisse and International Business Development Group. Salah Nasri graduated from Oxford University and Loughborough University in International Relations and Economics. In 2024, Salah Nasri became a Stanford University Alumni after completing the Stanford Executive Program.
Kevin Dei
VP & Founding Partner
Kevin Dei
VP & Founding Partner
Mr. Dei is a founding partner of I.S.I.G., and is currently serving as Vice President overseeing strategy and business development. Mr. Dei has over 15 years of corporate sales and consulting experience in the High-Tech services sector spanning markets such as Solar PV, OLED, MEMS and Semiconductors.
Throughout his tenure at I.S.I.G., he has served multinational clients helping them to expand and deepen their commercial channels and customer relationships at the executive level through strategic partnerships.
Jubed Miah
VP Programs & Director
Mia Chen
VP & Taiwan GM
Ellen Wendelin-Loh
GM Southeast Asia
Ellen Wendelin-Loh
GM Southeast Asia
Ellen Wendelin is the General Manager of the International Semiconductor Executive Summit Southeast Asia (I.S.E.S. SEA), a role in which she excels at bringing together industry leaders to foster collaboration within the semiconductor sector. With a passion for orchestrating high-profile summits that merge innovation, strategy, and growth, Ellen is known for her expertise in event management, business development, and networking. She has successfully led initiatives that connect semiconductor executives globally, creating strategic partnerships and opportunities that drive the future of the industry. Her work is centered on delivering exceptional event experiences and fostering meaningful dialogue among stakeholders.
Michelle Yan
GM China
Michelle Yan
GM China
Michelle Yan is a seasoned executive with over 16 years of proven leadership in the meetings and events industry. As the General Manager of I.S.I.G. China, she brings a track record of delivering high-impact, large-scale events while driving sustained growth and fostering strong collaborations in diverse cultural and professional environments.
Throughout her career, Michelle has spearheaded cross-functional teams to execute complex, high-profile events for international conferences, corporate summits, and association-driven gatherings. Her meticulous planning and seamless execution consistently exceed client expectations, while her strategic insight ensures that each event achieves its objectives—be it brand elevation, stakeholder engagement, or global market expansion.
A visionary marketer, Michelle possesses a deep understanding of market trends and leverages targeted campaigns to amplify event visibility, engagement, and return on investment. Her initiatives have significantly increased brand awareness, attracted industry-leading participants, and solidified key partnerships on a global scale.
Committed to forging robust industry networks, Michelle has played a pivotal role in expanding the international presence of associations in China. She cultivates lasting collaborations and strategic alliances that drive long-term success, ensuring that every partnership delivers mutual value and measurable impact.
Renowned for her innovative spirit, Michelle integrates cutting-edge technology and creative solutions to enhance the attendee experience. Under her leadership, events not only captivate audiences but also generate tangible business outcomes. Her passion for pushing boundaries, coupled with her unwavering attention to detail, continues to set new standards of excellence in the meetings and events industry.

Honorary Board Members

Hamid Azimi, Ph.D.
Senior Vice President, Advanced Packaging and Foundry
Hamid Azimi, Ph.D.
Senior Vice President, Advanced Packaging and Foundry
Dr. Hamid R. Azimi is Senior Vice President of Advanced Packaging and Foundry at Marvell. In this role, he leads the development and deployment of next-generation packaging technologies and foundry strategies to support Marvell’s data infrastructure products.
Prior to joining Marvell, Hamid spent nearly 30 years at Intel, where he most recently served as Corporate Vice President and Director of Substrate Packaging Technology Development. He led global R&D and manufacturing teams and delivered industry-leading innovations including die-embedded panel level fanout, EMIB and glass packaging for AI and high-performance computing.
A recognized pioneer in semiconductor packaging, Hamid holds over 40 U.S. patents, including the patent on first-generation organic flip-chip ABF-based substrate. He has received multiple Intel Achievement Awards and is widely known for building high-performing, inclusive teams and mentoring future industry leaders.
Hamid earned a Ph.D. and M.S. in Materials Science from Lehigh University and a B.S. in Materials Engineering from Sharif University of Technology.
Marvin Liao, Ph.D.
Advisory Board Member
Marvin Liao, Ph.D.
Advisory Board Member
Education :
Ph.D., Materials Science, University of Texas, USA, 1989
Bachelor, Materials Science, Tsing Hua University, Taiwan, 1979
Experience :
TSMC, Advanced Packaging Technology and Service, 2011 ~ 2022
TSMC, Special Project, 2009 ~ 2010
TSMC, Fab 6 Director, 2003 ~ 2009
Chartered Semiconductor, 1997 ~ 2002 (Singapore)
Applied Materials, 1994 ~ 1997 (USA)
SGS Thomson Microelectronics, 1990 ~1994 (USA)
Markus Keil
Sr. VP FeoL Operations
Markus Keil
Sr. VP FeoL Operations
Markus holds an advanced degree as Dipl. Ing. in Applied Physics from the FH Wiesbaden. He is serving for the last 30 years in different Operations and technology functions at various multinational Semiconductor Companies.
After 16 years at AMD / Globalfoundries and after that as the President and CEO of HSEB, he was responsible for the global operations footprint of a US-based Semiconductor iDM.
2021 he joined Optotune AG, a swiss SME specialist in optical Microsystems as the VP Global Operations / GM.
Markus has extended experience in high-volume Semiconductor Operations and technology development. He has served as Deputy Chairman of the International Semiconductor Executive Summits part of the ISIG Group for over a decade and as of 2025, EU Advisory Board President.

Regional Presidents

Bernard Lim
President of South East Asia
Bernard Lim
Vice President Operations
Ir Bernard Limis currently the Vice Presidentand co-founder of Appscard Group AS and Appscard Global Research & Innovation Center, a technology startup company working on biometric smartcard with R&D and Operation facility based out Penang, Malaysia. He has over 27 years’ experience and have held various senior management rolesin manufacturing in different industry. He was also co-founder in multiple technology startup companies in Penang. He obtained his bachelor’s degree (B. Eng (Hons) In Electrical & Electronics) at Nottingham Trent University, United Kingdom and is currently pursuing his Doctorate in Business Administration at Wawasan Open University. He is a Professional Engineer and Fellow of Institution of Engineers, Malaysia, a senior member of the IEEE and an Associate Fellow of ASEAN Academy of Engineering and Technology (AAET). Ir Bernard is currently the Management Council of Penang Skill Development Center, the Chair-elect IEEE Malaysia Section, the Chairman of The Institution of Engineers Malaysia (Penang Branch), Executive Committee of IEM, IEM Council Member, Committee Member of IEM Material Engineering Technical Division. At IEM, he is also the Deputy Chair of Standing Committee of activity. Ir Bernard is also an ASEAN Engineer Register (AER) Executive Committee and the permanent member for the technical committee on Innovation Management (NSC Y/TC11).
For more information please visit: https://www.linkedin.com/in/bernard-lim-18893510/
Christine Dunbar
President of USA
Christine Dunbar
Head of Strategic Business Development
Christine Dunbar formerly Head of Strategic Business Development at Natcast, the non-profit entity designated by the U.S. Department of Commerce to operate the National Semiconductor Technology Center (NSTC). In this role, she leads strategic initiatives to advance the U.S. semiconductor ecosystem, fostering collaboration between industry, government, and academia.
Before joining Natcast in March 2025, Christine served as Senior Vice President of Global Sales at IQE, a leading provider of compound semiconductor wafer products and advanced materials solutions. Prior to joining IQE in 2022, she held key executive roles at GlobalFoundries and IBM’s Microelectronics Division.
A Cornell University graduate with a bachelor’s degree in Materials Science and Engineering, Christine has dedicated her entire career to advancing the global semiconductor industry. In recognition of her leadership, she was nominated for the Global Semiconductor Association’s inaugural “Rising Woman of Influence” award in 2018.
Beyond her executive roles, Christine is a recognized thought leader and sought-after speaker on the critical issues shaping the future of the semiconductor industry. She is frequently called upon to present at global industry forums, where she has provided insights on technology innovation, supply chain resilience, workforce development, and global policy. A longtime advocate for diversity in tech, she is also deeply committed to mentoring and inspiring the next generation of leaders, helping to shape a more inclusive and dynamic semiconductor ecosystem.
Eric Lee
President of Taiwan
Eric Lee
CEO
Eric Lee is the CEO of Scientech Corp. and Chairman of Yayatech. He joined Scientech in 2004, following nearly a decade at UMC, where he held positions in both Taiwan and Singapore from 1995 to 2004.
In addition to his leadership roles at Scientech and Yayatech, Eric serves as President of the International Semiconductor Executive Summit (ISES) Taiwan. He is also a part-time professor in the Advanced Packaging Master’s Program at National Taiwan University of Science and Technology.
Eric contributes actively to the industry through his roles as a member of the SEMI Taiwan Advanced Packaging Committee and as a director of the Taiwan Electronic Equipment Industry Association.
Joshua Yoo
President of Korea
Joshua Yoo
President
Yong Hoon (Joshua) Yoo has been involved in the static control industry since 1994 for ionization, ESD measurement and high voltage power business operation in semiconductor, flat panel displays and automotive industry. He has been a member of EOS/ESD Association since 2000 and served as an Elected Board of Director in 2016 – 2018. He is the founder and president of Korea EOS/ESD Association since 2011. He is a member of Institute of Electronics and Information Engineers (Korean IEEE) since 2021. He is serving industry as Korea President of International Semiconductor Executive Summits (ISES) since 2024.
He started his volunteering activities on EOS/ESD Association since 2013 as an active working group members and technical program committee members of annual symposium for multiple events of ESD Association. With his leadership, Korea EOS/ESD Association very strongly presents and annual events over 10 years. He is pioneer for flat panel display (FPD) static issue analysis and resolved problems. In recently, he found a root cause of ESD yield losses in AI chip manufacturing environment and improved yield over double digits.
He is an iNARTE certified ESD Engineer in 2007 and the EOS/ESD Association certified Professional ESD Program Manager in 2011. He has 14 patents for ionization system and ESD testing technologies.
Markus Keil
President of EU
Markus Keil
Sr. VP FeoL Operations
Markus holds an advanced degree as Dipl. Ing. in Applied Physics from the FH Wiesbaden. He is serving for the last 30 years in different Operations and technology functions at various multinational Semiconductor Companies.
After 16 years at AMD / Globalfoundries and after that as the President and CEO of HSEB, he was responsible for the global operations footprint of a US-based Semiconductor iDM.
2021 he joined Optotune AG, a swiss SME specialist in optical Microsystems as the VP Global Operations / GM.
Markus has extended experience in high-volume Semiconductor Operations and technology development. He has served as Deputy Chairman of the International Semiconductor Executive Summits part of the ISIG Group for over a decade and as of 2025, EU Advisory Board President.
Tadahiro Suhara
President of Japan
Tong Wu, Ph.D.
President of China
Tong Wu, Ph.D.
Leader of China Automotive Solution Team
吴桐，安森美（onsemi）中国区汽车市场负责人，上海交通大学半导体物理专业，数学专业辅修本科毕业，美国田纳西大学电气工程博士学位。吴博士在半导体封装，碳化硅设计应用方面拥有 10 余年的研发和工业经验。目前在安森美负责中国区汽车技术与市场，覆盖产品设计，制造，市场及应用，了解新能源行业的市场、供应链、开发流程以及解决方案。与国内多家车厂、Tier 1 保持着深度合作以及技术支持。曾就职于美国田纳西州橡树岭橡树岭国家实验室（ORNL），以及车厂研发团队，共在国际会议和期刊上发表了 40 多篇论文，同时获得了多项半导体方面的美国专利。
Dr. Tong Wu is onsemi SiC Expert & Leader of China Auto Marketing & Technical Team, responsible for developing the SiC market in China, as well as providing technical support for car OEMs and Tier1s, and participating in multiple NPIs. He has more than 10 years of R&D and industrial experience in wide band-gap devices and its applications. Prior to joining onsemi, Dr. Wu conducted his research at Oak Ridge National Laboratory(ORNL) for multiple DOE-funded SiC-related projects.
Dr. Wu received his B.S. degree from Shanghai Jiao Tong University, majoring in semiconductor physics and minoring in mathematics. Dr. Wu received his Ph.D. in Power Electronics from the University of Tennessee, USA. He conducted his doctoral research at the Power Electronics and Electric Machinery Research Center of Oak Ridge National Laboratory(ORNL). Dr. Wu has authored/co-authored more than 40 papers in international conferences and journals and awarded several U.S. patents in SiC area.

Meet the Advisory Board

Aasutosh Dave
Chief Commercial Officer
Aasutosh Dave
Chief Commercial Officer
Aasutosh Dave has served as Chief Commercial Officer since 2024 at FormFactor. Aasutosh has more than 20 years of experience in semiconductors with a focus on developing global field teams, as well as business revenue growth and customer management. Prior to joining FormFactor, Aasutosh held various leadership and management positions at ASML. Most recently, he served as the Head of Global Sales and Applications leading their eBeam business. Aasutosh has held positions from R&D process engineer, Product Marketing, Product Development, and Sales at Hybond, AMD and Mentor Graphics (now Siemens).
Aasutosh received his M.S. in Electrical Engineering from The University of Texas at Arlington and his B.E. from Gujarat University in India.
LinkedIn Profile: https://www.linkedin.com/in/aasutosh-dave-646a11/
FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability.
FormFactor’s leading-edge probe stations, probes, probe cards, advanced thermal subsystems, quantum cryogenic systems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing.
Visit www.formfactor.com or follow us on LinkedIn.

Aasutosh Dave
Chief Commercial Officer
Aasutosh Dave
Chief Commercial Officer
Aasutosh Dave has served as Chief Commercial Officer since 2024 at FormFactor. Aasutosh has more than 20 years of experience in semiconductors with a focus on developing global field teams, as well as business revenue growth and customer management. Prior to joining FormFactor, Aasutosh held various leadership and management positions at ASML. Most recently, he served as the Head of Global Sales and Applications leading their eBeam business. Aasutosh has held positions from R&D process engineer, Product Marketing, Product Development, and Sales at Hybond, AMD and Mentor Graphics (now Siemens).
Aasutosh received his M.S. in Electrical Engineering from The University of Texas at Arlington and his B.E. from Gujarat University in India.
LinkedIn Profile: https://www.linkedin.com/in/aasutosh-dave-646a11/
FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability.
FormFactor’s leading-edge probe stations, probes, probe cards, advanced thermal subsystems, quantum cryogenic systems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing.
Visit www.formfactor.com or follow us on LinkedIn.
Achim Strass, Ph.D.
Senior Director Technology Scouting and Cooperation
Achim Strass, Ph.D.
Senior Director Technology Scouting and Cooperation
Dr. Achim Strass is a visionary leader in semiconductor technology, with a career spanning global giants like Siemens, Qimonda, Infineon, Huawei, and Nexperia. From pioneering copper wire integration in automotive semiconductors to founding competence centers across the globe, his expertise has shaped the industry. With a PhD in Silicon Process Technology and a passion for innovation, he has led groundbreaking projects in yield management, electrification, and advanced power electronics. Now, as Head of Worldwide Technology Scouting at Nexperia and an active member of multiple boards, he connects global semiconductor ecosystems, driving collaboration and progress. His leadership continues to influence cutting-edge developments in semiconductor technology.
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia’s commitment to innovation, efficiency and stringent industry requirements are evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.
Akshay Singh Ph.D.
VP, Advanced Packaging Technology Development
Akshay Singh Ph.D.
VP, Advanced Packaging Technology Development
Dr. Akshay Singh is vice president of Advanced Packaging Technology Development at Micron Technology. He leads a global team that is responsible for delivering advanced memory packaging solutions for HBM, high performance compute and AI/ML applications. Dr. Singh joined Micron in 2006 as an interposer materials engineer and since then has held number of positions of increasing responsibility in packaging design, integration and technology development. Prior to joining Micron, Dr. Singh held product development positions at Artificial Muscle, Inc. and USDA.
Dr. Singh has authored several keynote publications and patents and has served as an invited panel speaker at several conferences. Dr. Singh holds master’s and doctorate degrees in mechanical engineering from Louisiana State University, bachelor’s degree in mechanical engineering from Maharaja Sayajirao University and is a graduate of the Stanford Graduate School of Business Executive Program.
Education:
Stanford Graduate School of Business Executive Program, Stanford University
PhD and MS, Mechanical Engineering, Louisiana State University
BE, Mechanical Engineering, Maharaja Sayajirao University
Alan Zhou, Ph.D.
CEO
Alan Zhou, Ph.D.
CEO
Dr. Alan Zhou has over 30 years of executive experience in multinational and startup companies within the semiconductor industry. Currently serving as the CEO of Shanghai Pixelworks Stock Limited Co. Formerly he was the CEO of BelGaN and Chairman of GaNcool. Before that, he was an Executive Vice President (EVP) of Pixelworks and the President of its China subsidiary, he was responsible for corporate restructuring, financing, acquisitions, and preparations for a STAR Market listing; He also served as the managing partner and Chief Strategy Officer (CTO) at the National IC Fund’s Fujian Anxin Capital, overseeing global investments and acquisitions for the third generation compound semiconductors; a Corporate Vice President at Qualcomm in charge of the smartphone chipset business worth over $3 billion; and a Managing Director at Lucent Technologies, where he led the development and design of China’s first local brand GSM mobile phone reference design and chipset. In 1998, he co-founded MEMSIC, a MEMS sensor company listed in NASDAQ around 2007; and in 1994, served as the General Manager of AT&T Bell Laboratories in Wuxi, managing the technology transfer and construction of China’s first sub-micron very large scale integrated circuit (VLSI) manufacturing Fab for the national 908 Project, which led to the establishment of CSMC went public in HongKong, then acquired by China Resources Group, now known as China Resources Microelectronics listed in the STAR exchange. Dr.Zhou graduated from MIT and earned a Master and Doctor degree in Microelectronics and Computer Science.
Pixelworks’ technology and solutions cover end to end, optimized video delivery that is true to its creator’s intent with a highly authentic viewing experience. Our innovations over two decades has resulted in a strong IP portfolio related to the visual display of digital image data. Our vision is that every screen, no matter how big or small, deserves the highest picture quality. This vision has driven us to develop technology that spans the range from digital projection systems and large flat panel displays to small, low power mobile devices such as smartphones. We also develop innovative methods to apply our core technologies to reduce overall system power and help reduce the bandwidth burden that comes with the display of HD and UHD video.
The relentless advancement of display technology and explosive growth of video consumption driven by digital delivery systems and mobile applications are increasing the necessity and demand for Video Display Processing technology. To meet this growing demand, we deliver our technology as IP cores, semiconductors, software and custom ASIC solutions. This flexible approach allows our customers to deliver the highest video quality in a multitude of applications and form factors while also providing the ability for end product differentiation. Our primary target markets include smartphones, tablets and digital projection systems.
We focus our investments on developing video enhancement solutions for Video Delivery, Mobile Devices and Projectors market segments, with particular attention to increasing performance, video quality, device functionality and saving power. Additionally, we look for ways to leverage our research and development investment into products that address other high-value markets where our innovative proprietary technology provides differentiation for us and our customers. We continually seek to expand our technology portfolio through internal development, co-development with business partners.
Aly Mashaly
Founder & CEO
Aly Mashaly
Founder & CEO
Aly Mashaly is the Founder and CEO of Verotera, a German company pioneering next-generation power semiconductor technologies. With over 20 years of experience in power electronics, Aly is a renowned expert in power electronic systems and semiconductors. He holds several patents in the field and is a keynote speaker at numerous international conferences.
Aly earned his degree in Electrical Engineering with a focus on Power Electronics from Ain Shams University in Cairo and moved to Germany in 2002 to pursue his master’s degree at the University of Hanover.
He began his career pioneering the development of power electronic systems for avionic applications before focusing on advancing power electronics for electric mobility. In his most recent role as Technical Director at ROHM Semiconductor Europe, he played a key role in driving the company’s vision to become a global leader in power devices and contributed to growing the business through multi-billion-dollar projects.
Verotera is a German startup and a next-generation semiconductor company driven by deep system-level expertise and a vision for a smarter, cleaner world. Our team brings hands-on experience in inverter development, semiconductor design, and real-world system integration. We operate across the full stack — from chip physics to complete systems — designing technologies that address the actual needs and constraints of modern applications.
This unique positioning allows us to reduce integration costs, accelerate design cycles, and deliver higher system efficiency. With strong industry networks and credibility in both the OEM and semiconductor domains, we bridge the gap between demand and innovation — enabling faster validation, strategic partnerships, and more effective go-to- market execution.
Please visit Verotera’s website for more information: www.verotera.com
Amr Darwish
Senior Director of Product Marketing & Market Development
Amr Darwish
Senior Director of Product Marketing & Market Development
Mr. Amr Darwish has over 18+ years of experience in the technology and semiconductor fields. Previously during his time at Integrated Device Technology (IDT), Amr served in various Product Marketing and Technical roles, which spanned over North America, Europe, and Asia. Amr was a Cofounder of MaxPower Semiconductor, where he served as the COO. MaxPower was acquired by Vishay Siliconix in October 2022, where Amr was formerly the Senior Director of Product Marketing & Market Development for the Silicon Carbide division of Vishay.
With a Bachelor of Science in Electrical Engineering (BSEE) and a Master in Business Administration (MBA), Amr has been able to use his blend of disciplines to create effective corporate & sales strategies and key strategic relationships, which have proliferated MaxPower’s (now Vishay’s) products into consumer, industrial, and automotive marketplaces.
In addition, Amr currently serves as the Chair of the Santa Clara University (SCU) Graduate Business Program Alumni Board, is a lead-investor and board member of several technology companies, serves as a start-up advisor in the Bronco Venture Accelerator and is a Partner in the Bronco Venture Capital Fund.
Ariel Meyuhas
Founding Partner & COO
Ariel Meyuhas
Founding Partner & COO
At the helm of The MAX Group, Ariel brings over 25 years of experience in the semiconductor industry, working closely with leading Frontend Fabs and Backend OSATs. Known for his vision, innovation, and strong business relationships, he excels in leading teams with positive energy and passion. His expertise lies in driving operational turnarounds and transformative strategies for semiconductor companies, consistently delivering significant financial returns for clients. He is committed to excellence in every aspect of his work.
We are MAX, for over two decades we have been creating faster and smarter global operations!
Our business philosophy and our key to success are founded on never taking your business for granted and always following you every step of the journey where everything happens, sharing responsibility for any outcomes. Our expert teams will work in perfect synergy with you, zealously improving your bottom line. Clients credit us for accelerating their factories’ path for demonstrating world-class performance results – higher productivity and output, shortened Cycle Times, and reduced Operational Costs. As tough as the challenge may be, we will bring skills and cutting-edge tools to help you succeed.
The MAX Group is a leading global consulting firm with special expertise in Benchmarking and Operational Improvements in the Semiconductor industry. While primarily focusing on the Semiconductors and Electronics industries, we are proudly serving our Clients operating in wide variety of industrial spaces including Automotive, Aerospace, Bio-Medical and more.
Avinash Kashyap Ph.D.
SVP & Division Head
Avinash Kashyap Ph.D.
SVP & Division Head
Dr. Avinash Kashyap is the Senior Vice President & Division Head of the MOSFETs Division at Vishay Intertechnology. He leads a global organization overseeing P&L, engineering, marketing, applications, and revenue generation for power products, including Si MOSFETs, Power ICs, and SiC, with a strong focus on automotive, industrial, and data center applications.
Previously, Dr. Kashyap served as Vice President & General Manager of the Discrete & Wide Bandgap Power Business Unit at Renesas Electronics, where he led multiple product lines, including IGBTs, SiC, Si MOSFETs, and GaN, catering to high-volume markets.
Throughout his career, Dr. Kashyap has held leadership roles at Microchip Technology and GE Global Research, where he played a pivotal role in advancing wide bandgap technologies and successfully bringing them to market.
An accomplished innovator, he has authored over 35 peer-reviewed publications and holds more than 20 patents (granted or pending). Dr. Kashyap earned his M.S. and Ph.D. in Electrical Engineering from the University of Arkansas, Fayetteville. He is a Senior Member of IEEE and a distinguished member of the Arkansas Academy of Electrical Engineers.
Vishay Intertechnology, Inc., a Fortune 1000 Company listed on the NYSE (VSH), is one of the world’s largest manufacturers of discrete semiconductors (diodes, rectifiers, MOSFETs, optoelectronics, and selected ICs) and passive electronic components (resistors, inductors, and capacitors). These components are used in virtually all types of electronic devices and equipment, in the industrial, computing, automotive, consumer, telecommunications, military, aerospace, power supplies, and medical markets. Vishay’s product innovations, successful acquisition strategy, and “one-stop shop” service have made it a global industry leader.
Bernard Lim
Vice President Operations
Bernard Lim
Vice President Operations
Ir Bernard Limis currently the Vice Presidentand co-founder of Appscard Group AS and Appscard Global Research & Innovation Center, a technology startup company working on biometric smartcard with R&D and Operation facility based out Penang, Malaysia. He has over 27 years’ experience and have held various senior management rolesin manufacturing in different industry. He was also co-founder in multiple technology startup companies in Penang. He obtained his bachelor’s degree (B. Eng (Hons) In Electrical & Electronics) at Nottingham Trent University, United Kingdom and is currently pursuing his Doctorate in Business Administration at Wawasan Open University. He is a Professional Engineer and Fellow of Institution of Engineers, Malaysia, a senior member of the IEEE and an Associate Fellow of ASEAN Academy of Engineering and Technology (AAET). Ir Bernard is currently the Management Council of Penang Skill Development Center, the Chair-elect IEEE Malaysia Section, the Chairman of The Institution of Engineers Malaysia (Penang Branch), Executive Committee of IEM, IEM Council Member, Committee Member of IEM Material Engineering Technical Division. At IEM, he is also the Deputy Chair of Standing Committee of activity. Ir Bernard is also an ASEAN Engineer Register (AER) Executive Committee and the permanent member for the technical committee on Innovation Management (NSC Y/TC11).
For more information please visit: https://www.linkedin.com/in/bernard-lim-18893510/
APPSCARD is a Norwegian company with its global operation based out of Malaysia. Appscard provides the World’s first “Government Grade Biometric Computer on Card”. The solution integrated in an ISO-standard smart card format with a large and physically flexible fingerprint sensor designed for use throughout entire populations. A complete local ID-system that does not compromise security or user privacy and works conveniently and securely for very close to 100% of any given population. APPSCARD replaces all of today’s identity keys, including pin codes, passwords, code tokens, simple non-biometric access cards, signatures, physical keys etc, all of which are easily compromised. And, the system is not dependent on databases or communication lines, only the user’s biometrics. Thus, all dominant sources of the massive challenges facing us today are effectively removed.
For more information please visit: www.appscard.com
Boon Soo Lim
Vice President & General Manager, SDSM, Global Operations
Boon Soo Lim
Vice President & General Manager, SDSM, Global Operations
BS Lim is the Vice President and General Manager of Sandisk Batu Kawan Manufacturing Operations. With over 25 years of experience in operations, process management, equipment, and planning, he plays a critical role in advancing Sandisk Storage Malaysia (SDSM) Solid State Drive Storage Operations.
He began his career in process engineering and rose through various roles, ultimately serving as Factory Manager in his previous company before joining Sandisk as a Senior Manager of Operations. Throughout his career, he has managed engineering in process, equipment, and new product introductions (NPI), as well as overseeing planning, warehousing, logistics, and overall operations. He also held full responsibility for operational cost control. Over his decade-long tenure at Sandisk/Western Digital, his exceptional leadership and expertise led to his progression through roles as Director, Senior Director, and now Vice President and General Manager of Operations, overseeing core areas of Manufacturing Operations, Process Engineering, Equipment Engineering, Planning & IE, Test Engineering, Automation & Analytics, WH/FG Management and Sustainability, driving high standards of efficiency and innovation.
He is a seasoned leader dedicated to elevating manufacturing processes and innovation. He continues to drive advancements in Sandisk Storage Malaysia (SDSM), helping to position the Penang facility as a leading center for high-quality flash memory production to meet global demand.
Sandisk, a global Flash and advanced memory technology innovator, understands how people and businesses consume data and relentlessly innovates to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in memory and storage semiconductors, we keep people and businesses moving forward with inspired innovations to actualize their potential.
As Sandisk embarks on its journey with its new corporate branding, the company continues to keep aspirations moving and pushing possibility forward, empowering people and businesses with data everywhere. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized for innovation, performance and quality.
Sandisk is on a journey to be an industry leader in sustainability, building from a strong foundation. Our commitment to environmental, social and responsible business has always been an integral part of Sandisk’s DNA. These focus areas guide the company to make meaningful decisions that benefit the business and have a positive impact on the environment, society, and key stakeholders.
Christina Hirschl, Ph.D.
CEO
Christina Hirschl, Ph.D.
CEO
Christina Hirschl, PhD in physics, has extensive expertise in R&D and in building and leading large teams in applied research. Her career is driven by enabling innovation, digitalization, and new business opportunities through cross-industry collaboration. Since June 2023, she has been CEO of Silicon Austria Labs GmbH, after managing the Villach site and heading the Sensor Systems Division. She combines scientific expertise with strong leadership to drive growth and international collaboration.
Christine Dunbar
Head of Strategic Business Development
Christine Dunbar
Head of Strategic Business Development
Christine Dunbar formerly Head of Strategic Business Development at Natcast, the non-profit entity designated by the U.S. Department of Commerce to operate the National Semiconductor Technology Center (NSTC). In this role, she leads strategic initiatives to advance the U.S. semiconductor ecosystem, fostering collaboration between industry, government, and academia.
Before joining Natcast in March 2025, Christine served as Senior Vice President of Global Sales at IQE, a leading provider of compound semiconductor wafer products and advanced materials solutions. Prior to joining IQE in 2022, she held key executive roles at GlobalFoundries and IBM’s Microelectronics Division.
A Cornell University graduate with a bachelor’s degree in Materials Science and Engineering, Christine has dedicated her entire career to advancing the global semiconductor industry. In recognition of her leadership, she was nominated for the Global Semiconductor Association’s inaugural “Rising Woman of Influence” award in 2018.
Beyond her executive roles, Christine is a recognized thought leader and sought-after speaker on the critical issues shaping the future of the semiconductor industry. She is frequently called upon to present at global industry forums, where she has provided insights on technology innovation, supply chain resilience, workforce development, and global policy. A longtime advocate for diversity in tech, she is also deeply committed to mentoring and inspiring the next generation of leaders, helping to shape a more inclusive and dynamic semiconductor ecosystem.
Christophe Maleville, Ph.D.
Chief Technology Officer and Senior Executive Vice President of Soitec’s Innovation
Christophe Maleville, Ph.D.
Chief Technology Officer and Senior Executive Vice President of Soitec’s Innovation
Christophe Maleville has been appointed Chief Technology Officer and Senior Executive Vice President of Soitec’s Innovation.
He joined Soitec in 1993 and was a driving force behind the company’s joint research activities with CEA-Leti. For several years, he led new SOI process development, oversaw SOI technology transfer from R&D to production, and managed customer certifications. He also served as vice president, SOI Products Platform at Soitec, working closely with key customers worldwide.
Maleville has authored or co-authored more than 30 papers and also holds some 30 patents. He has a PhD in microelectronics from Grenoble Institute of Technology and obtained an executive MBA from INSEAD.
Soitec is a world leader in the production of innovative semiconductor materials. The company leverages its unique technologies to serve the electronics markets.
In meeting the technical and economic challenges of mainstream electronics, Soitec is helping to speed up the mobile and digital revolutions. Its products are used to manufacture chips that go into smartphones, tablets, computers, IT servers and data centers as well as electronic components in cars, connected devices, and industrial and medical equipment.
With more than 4,000 patents, the company pursues a strategy of disruptive innovation to provide its customers with products that combine performance, energy efficiency and competitiveness.
Soitec is headquartered in Bernin France. The company was founded 30 years ago in Grenoble’s high-tech ecosystem and has manufacturing facilities, R&D centers and sales offices in Europe, the United States and Asia. Soitec is listed on the CAC NEXT 20, in Paris.
For more information visit: www.soitec.com.
Chun Sheng Tan
Board Member
CJ Hsieh
COO
CJ Hsieh
COO
Experiences:
Advisory board, ISES Taiwan
Co-chair of Test Committee, SEMI Taiwan
General Manager, INTEL Innovation Tech. Ltd.
Spokesperson, INTEL Taiwan
Consulting Committee, National QUEMOY University
VP of Global Operations, LANTIQ Deutschland GmbH
GM & VP of Professional Services Lab, SPIROX Corp.
AVP of ASIC Design Services and Production Turnkey, FARADAY Tech. Corp.
Technical Manager of CPU / Memory Design, UMC
Project Leader of EDA DFT, SYNTEST Tech. Ltd.
Education:
MSEE, University of Southern California, Los Angeles, USA
Founded in 2004, ASPEED Technology Inc. is a leading fabless IC design company headquartered in Hsinchu, Taiwan. With a focus on niche markets, ASPEED specializes in Cloud & Enterprise Solutions, including Baseboard Management Controller (BMC) SoC, Bridge IC, and PFR SoC, and Smart AV Solutions, including AVoIP SoC, Cupola360 spherical image stitching processor and Cupola360+
Software Kit.
ASPEED is devoted to developing innovative technologies in order to quickly respond to customer needs. In 2016, ASPEED acquired Broadcom’s Emulex Pilot™ remote server management chip business and it’s currently the world’s No. 1 BMC SoC provider. Also, ASPEED expanded its product portfolio by launching Cupola360 spherical image stitching processor and Cupola360+ software solutions in 2018.
Recognized as a trusted and reliable partner for customers, ASPEED has been awarded “Forbes Asia’s 200 Best Under a Billion” for nine consecutive years since 2014. The company was also recognized as “Taiwan Best-in-Class 100” by Taiwan Institute of Directors and CDRC Consulting Group in 2022.
Fore more information, please visit https://www.aspeedtech.com/ and https://cupola360.com/.
Coralie Gallis Ph.D.
Co-Founder & Chief Technology Officer
Coralie Gallis Ph.D.
Co-Founder & Chief Technology Officer
Coralie, a PhD in Materials Sciences from Paris University with an engineering degree in Physic- Chemistry, has over 25 years of experience in wearable sensing, medical and sports technology, semiconductors, and automotive industries. Previously in Silicon Valley and now in Las Vegas, Coralie has led business development and strategic partnerships in AI, biomedical tech, and wearable electronics. She is a co-founder and CTO of SM24, a wearable start-up, a non-invasive continuous biomarker monitoring system for metabolic health for the femtech, wellness and sport sector. Previous to the creation of the start-up, Coralie has been working in consumer technology industry within 2 different European semiconductors research centers dedicated to developing prototypes for industry partners. She has been a judge for the CES innovation awards the last 2 years. Since 2024, Coralie has also supported Vibra-Nova’s ultrasonic haptic technology expansion in the U.S.
Curtis Zwenger
Curtis Zwenger
Curtis joined Amkor in 1999 and has held leadership roles in developing Amkor’s Fine Pitch Copper Pillar, Through Mold Via, and Wafer Level packaging technologies. He was formerly responsible for Advanced System in Package product development. Curtis has authored numerous technical articles and papers, and he currently serves on the IMAPS Executive Council as Director of Membership. Curtis has been issued 35 US patents and holds a degree in mechanical engineering from Colorado State University and an MBA from the University of Phoenix.
Dariusz Czaja
Managing Director of TRUMPF Huettinger Asia
Dariusz Czaja
Managing Director of TRUMPF Huettinger Asia
Dariusz Czaja先生于2007年加入通快霍廷格电子，目前担任通快霍廷格电子亚洲董事总经理，主要负责中国，日本，韩国以及东南亚市场的业务营运以及拓展。在光伏、半导体、显示面板、玻璃镀膜等多个领域，Dariusz Czaja先生拥有十余年的业务营运和管理经验，其中包括光伏应用项目的重点推广。在通快霍廷格电子任职期间，Dariusz Czaja先生曾先后在波兰和德国工作，并于2017年开始担任通快霍廷格电子中国总经理一职。2023年，因应业务成长需要，荣任亚洲董事总经理
Dariusz Czaja先生拥有波兰卡齐米耶日-普瓦斯基拉多姆技术与人文大学的电子工程学位，他也是世界太阳能大会（World Solar Congress）咨询委员会的成员，同时也是中国国际半导体高层峰会（I.S.E.S.）的执行委员会成员。
Dariusz Czaja joined TRUMPF HUETTINGER Electronics in 2007 and is currently the Managing Director of TRUMPF HUETTINGER Electronics Asia, where he is responsible for business operations and expansion in China, Japan, Korea and Southeast Asia. Mr. Dariusz Czaja has more than 10 years of business operation and management experience in photovoltaics, semiconductors, display panels, glass coatings and other fields, including the key promotion of photovoltaic application projects. During his tenure at TRUMPF Huettinger Electronics, Mr. Czaja worked in Poland and Germany, and in 2017 he became General Manager of TRUMPF Huettinger Electronics China. In 2023, he was appointed Managing Director of Asia in response to business growth needs.
Mr. Czaja holds a degree in Electronic Engineering from the University of Technology and Humanities in Kazimierz-Pułaskiradom, Poland, and is a member of the Advisory Board of the World Solar Congress and a member of the China International Semiconductor Executive Summit (I. S.E.S.).
通快霍廷格电子有限公司成立于1922年，总部设于德国弗莱堡，是世界领先的等离子体电源制造商，产品主要用于：半导体，显示器和太阳能领域，以及光学镀膜，装饰镀膜，工业镀膜，大面积玻璃镀膜等行业的等离子体应用，于1990年正式加入通快集团。通快霍廷格电子致力于开发、制造用于各种沉积和干法刻蚀工艺的等离子电源，在电源领域拥有一百多年的经验积累，在欧洲、美洲和亚洲分别设有销售和服务子公司和分支机构。
2006年，通快霍廷格电子中国成立，至今已经深耕中国市场19年。如今，通快霍廷格在中国设有亚太区应用中心、维修中心、电源及匹配器生产中心，为客户提供所有生产过程中的优质服务。2023年，通快霍廷格中国新工厂在太仓建成开业，这是通快霍廷格继德国、波兰之后布局的全球第三家生产制造基地。
TRUMPF Huettinger is a high-tech company and a leading global manufacturer of DC, medium-frequency, high-frequency and semiconductor-based solid-state microwave generators.
The business units include plasma technology, industrial heating, battery inverter systems as well as microwave generators and amplifiers. These process power supplies are being used in many key processes in research, development and production. As a part of TRUMPF – technology leader of industrial lasers and machine tools – TRUMPF Electronics is headquartered in Freiburg/Germany and has sales and service branches in Europe, US and Asia providing a global IoT based service support.
Dato’ KL Bock
SVP Global Flash Backend Operations
Dato’ KL Bock
SVP Global Flash Backend Operations
KL Bock joined Western Digital or known as SanDisk in June 2010 after 21 years in Motorola and STATSChipPAC. He brings with him more than 30 years of vast experience in various functions inclusive of QRA, Operations, Supply Chain, factory GM, greenfield construction and start-up in China & Malaysia. He is currently the SVP of Western Digital Global Flash Backend Operations, managing the end-to-end Supply Chain, Operations, Fulfillment and Packaging Technology Development of both the captive factories and contract manufacturing with footprint across six countries.
KL has a proven track record in transforming conventional factory to “Lean 6 Sigma Automation – achieved industry pioneer in fully integrated Lights-Out manufacturing and industry pioneer in vertically integrated Wafer-In-Drive-Out manufacturing.” With this transformation, all the captive factories, SanDisk Semiconductor Shanghai (SDSS) and SanDisk Storage Malaysia (SDSM) has been designated the Lighthouse status, with SDSS being recognized as the first factory to achieve in one cohort, both the Advanced 4IR Manufacturing Lighthouse and China 1st Sustainability Lighthouse and SDSM being recognized as the Asia 1st Sustainability Lighthouse and Malaysia 1st Advanced 4IR Manufacturing Lighthouse by the World Economic Forum.
KL has received numerous awards such as Executive of The Year for Malaysia Management Excellence Award, featured in CEO Magazine and also was appointed as a 4IR Technical Advisor for MIDA, a beacon to share the 4IR journey to various industry captains. He is also a Certified Chief Master Coach by ITD World and SEMI SEA board member and Regional Advisory Board member of SEMI SEA.
KL holds a Bachelor’s degree in Electronic Engineering from Tunku Abdul Rahman University and a Master’s degree in Business Administration from University of Keele, United Kingdom.
David Lacey, Ph.D.
Director External Affairs