
Advisory Board
Dr. Qingchun Zhang
Dr. Q. Jon Zhang is currently the distinguished professor in Fudan University. He was the Principal Engineer for WBG technologies in Alpha and Omega Semiconductors (AOS), USA, leading R&D and production activities on SiC devices, working with a world-leading CMOS foundry to commercialize MOSFETs and Diodes on SiC. Prior to AOS, he was the director of power device technology at the PowerAmerica Institute reviewing the technical proposals and managing wide bandgap power devices, modules and power electronics projects in order to accelerate the adoption of next generation SiC and GaN power electronics. He also served as the adjunct professor of the Department of Electrical and Computer Engineering at NC State University. Before joining NCSU, he has been the Senior Scientist at Wolfspeed, a Cree company for 13 years, leading various projects in both R&D and production in SiC power devices, playing a critical role in the commercialization of all generations of SiC Schottky diodes and MOSFETs. Among his many milestones are demonstrating the industry’s first reported SiC trench MOSFET, 12 kV IGBTs, trench Schottky diode, drift-free BJT, 12 kV GTOs, SiC CIMOSFETs with the record device performance, latest generation of 650V and 1700V SiC MOSFETs for power modules, etc. He received his B.S. and M.S. degrees from Tsinghua University, China, respectively, and a Ph.D. degree from the University of South Carolina. He is the co-author of over 100 technical papers and conference presentations, and is the first or co-inventor on more than 80 US patents. He serves as a technical committee member of ISPSD, reviewer of various journals, and IEEE member.

Fudan University
Profile coming soon…
More Advisory Board Members
Chairman: Dr. Hamid Azimi
Intel
Joseph Roybal
Wolfspeed
Deputy Chairman: Markus Keil
Nextlens
Dr. Marvin Liao
Deepak Kulkarni
AMD
Dato’ Seri Lee Kah Choon
Aemulus
Dr. Xiaoning Qi
Alibaba Group
Curtis Zwenger
Amkor Technology, Inc.
Jennifer Zhao
ams
Vincent DiCaprio
Applied Materials
Bernard Lim
Appscard Groups AS
CJ Hsieh
Aspeed Technology
Wei Wang
Automotive Research Institute (Suzhou), Tsinghua University (TSARI)
Dr. Xiaoxin Qiu
Axera Technology Co., Ltd
Dr. Marnix Tack
BelGaN
Ralf Bornefeld
Bosch
Arjun Kantimahanti
Broadcom
Martin Weigert
Broadcom
Dr. Yuan Yuan Zhou
DuPont Electronics & Industrial
Najwa Khazal
Edwards Vacuum
Dr. Alex Lidow
EPC
Amy Leong
FormFactor
Andy Chuang
GaN Systems
Jim Witham
GaN Systems
J Philip Vincent
GSH
Farhat Jahangir
GS Microelectronics
Dr. Yongxiang Wen
Hangzhou Silan Microelectronics Co Ltd
Dr. Rainer Kaesmaier
Hitachi Energy
Chang Fu
HLMC
Prof. Shaojun Wei
IME, Tsinghua University
Noorazidi Che Azib
Inari Technology
Denis Marcon
Innoscience Europe
AK Chong
Intel Malaysia
Prof. Tianchun Ye
Institute of Microelectronics, Chinese Academy of Sciences / China Integrated Circuit Innovation Alliance
Dr. Wei-Chung Lo
ITRI
Ray Yang
ITRI
Yaojian Lin
JCET Group
Oreste Donzella
KLA Corporation
Ian Hsu
Mediatek
Dr. Akshay Singh
Micron
Thy Tran
Micron
JY Zhang
MooreElite
Marco Giandalia
Navitas Semiconductor
Carlos Castro
Nexperia
Dr. Naveed Sherwani
OSFPGA Foundation / Rapid Silicon
Jian Zhang
Qualcomm
Edward Wei
Realtek Semiconductor Corp
Santosh Kumar
Reliance Industries Ltd
Dr. Avinash Kashyap
Renesas Electronics