Our advisory boards includes leading experts from across the semiconductor and MEMS sectors including 5G, IoT, Advanced Packaging, AI, Automotive Electronics, and Power Semiconductors.
Xiaoning Qi, Ph.D.
VP
Xiaoning Qi is the Vice President of Alibaba Group. Previously, he held senior management and technical positions in companies such as Intel, designing integrated circuits and systems. He sits on the board of directors at several international organizations including RISC-V International Association, CHIPS Alliance, OpenHW, EEMBC, etc. He is a member of Global Semiconductor Alliance (GSA) Advisory Board, a member of GSA Asia-Pacific Leadership Council and GSA CEO Council. He has published more than fifty technical papers, a book, and has delivered over three dozen invited talks. He holds two US patents. Xiaoning received his Ph.D. degree in Electrical Engineering from Stanford University.
Company Profile
Alibaba Group’s mission is to make it easy to do business anywhere. The company aims to build the future infrastructure of commerce. It envisions its customers will meet, work and live at Alibaba and that it will be a good company lasting for 102 years. We pledged to reach carbon neutrality by 2030. By working with merchants and consumers, the company expects to slash carbon emissions by 1.5 gigatons across its digital ecosystem by 2035.
Hongchao Liu, Ph.D.
SVP/Chief Scientist
Dr. Liu has more than 20 years’ semiconductor industry and more than 10 years’ experience with rich experience and unique understanding of technology industrialization and internationalization. His academic in materials science includes Shanghai Institute of Ceramics, Chinese Academy of Sciences, Muenster University in Germany, Nagoya Institute of Technology in Japan. He industry career covered China Resources Microelectronics, ASMC (Now GtaSemi). Dr. Liu received his BS degree in physical chemistry from Sichuan University, PhD in Materials Science from Shanghai Institute of Ceramics, Chinese Academy of Sciences. He held a Postdoc position in Nagoya Institute of Technology, and received a Young Scientist Award by Asian Crystallography Association. He was awarded an Alexander von Humboldt Research Fellowship in 2000. S. He has authored more than 30 papers, and holds over 40 patents. His research covers semiconductor materials, devices and processing.
Company Profile
YASC dedicates to the design, process, and fabrication of devices of SiC and GaN. Currently, we are one of the leading 6-inch fab in mass production with advanced supporting systems, provides turn-key services from chip design, epitaxial processing, wafer manufacturing, probing, assembly, module packaging, reliability and final test.
Wei Wang
Director of BD
Career
- 2016 – now Assistant president 、 Director of R&D and Operation in TSARI
- 2011 – 2016 General manager in MicRiver Information Systems
- 2001- 2010 AP Manager, BP, PM in Delphi Packard Electric Systems
Study
Graduated from Automotive Engineering Department of Tsinghua University in 1999, and Olin Business School of Washington University in St. Louis in 2008.
Other information
Senior engineer in management domain; Member of JS-SAE automobile intelligent manufacturing committee & Industry Standard Committee of Automotive Intelligent Manufacturing
Company Profile
Tsinghua University Suzhou Automotive Research Institute was established in 2011. It is the first specialized research institute of Tsinghua University for a specific industry. It is also a comprehensive automotive industry research institute jointly built by Tsinghua University and Suzhou Municipal Government. It is committed to the research and development of automotive application technology, transformation of scientific and technological achievements and incubation of high-tech enterprises.
Relying on the technical and talent advantages of Tsinghua University, guided by the major needs of the country and the industry, and with the mission of “leading technological innovation and promoting industrial progress”, we focus on new industries such as intelligent connected vehicles and new energy vehicles, and have established six business platforms: technology research and development, analysis and testing, science and technology finance, talent training, technology transfer, and enterprise incubation. We lead the innovative development of the industry with the research and development of new technologies and new products and industrial transformation, and promote industrial transformation and upgrading with technology, finance and talent services.
We have gradually built a comprehensive industrial innovation platform integrating scientific and technological innovation, industrial services and entrepreneurial incubation functions, forming an innovative industrial ecology where high-end talents gather, science and technology finance is active, and high-tech enterprises gather.
Xiaoxin Qiu, Ph.D.
CEO
Xiaoxin Qiu received her BE and ME degrees from Tsinghua University, P. R. China, in 1990 and 1991, respectively; and her Ph.D. from University of Southern California, Los Angeles, in 1996, all in Electrical Engineering.
From 1996 to 2001, she was with the Broadband Wireless Systems Research Department of AT&T Laboratories in Middletown, NJ, USA. In January 2001, she joined Mobilink Telecom Inc, which became a part of Broadcom Corporation in 2002. During her tenure in Broadcom, she served as the Vice President of Systems Design Engineering, and was responsible for cellular modem development and productization as well as developing next generation cellular IoT/M2M/NB-IoT devices and platforms.
In 2016, she joined WNC, a Taiwanese ODM company, serving as the CTO of Software and Vice President of Technical Marketing. In this capacity, Xiaoxin was in charge of creating the 5G product line from scratch and was responsible for the successful product design-ins in Verizon and a handful of European operators.
In 2018, Xiaoxin joined UniSoC Corp in China as Chief Technology Officer, responsible for defining the company technology and product roadmaps, and leading the R&D effort.
In 2019, she started and served as CEO of Axera Technology Co. Ltd., a start-up company focusing on creating AI enabled, high performance vision processing chips for a variety of public safety, smart city, smart home, smart industrial applications.
Xiaoxin is a senior member of the IEEE, and was elected Broadcom Distinguished Engineer in 2008 due to her outstanding contributions in cellular technology development in Broadcom.
Company Profile
Axera is a high-tech semiconductor company focused on developing world class Artificial Intelligence (AI) SoCs, for high-performance low-power computer vision applications. These chips are particularly suitable for today’s AIoT products, extending the AI intelligence from the cloud to the edge as well as end devices. They can be used in a vast array of applications such as smart cities, smart transportation, smart manufacturing and smart homes, with the goal to convenience people’s life and make our society a better and safer place.
AX630A：A high-performance low-power Computer Vision AI SoC
axerapr@axera-tech.com
https://www.axera-tech.com/
Add: 4th Floor, Raycom Info Tech Tower A, No. 2 Kexueyuan South Road, Haidian District, Beijing, 100190 PRC
General phone number and fax 010-82622584
Qingchun Zhang, Ph.D.
Professor
Dr. Q. Jon Zhang is currently the distinguished professor in Fudan University. He was the Principal Engineer for WBG technologies in Alpha and Omega Semiconductors (AOS), USA, leading R&D and production activities on SiC devices, working with a world-leading CMOS foundry to commercialize MOSFETs and Diodes on SiC. Prior to AOS, he was the director of power device technology at the PowerAmerica Institute reviewing the technical proposals and managing wide bandgap power devices, modules and power electronics projects in order to accelerate the adoption of next generation SiC and GaN power electronics. He also served as the adjunct professor of the Department of Electrical and Computer Engineering at NC State University. Before joining NCSU, he has been the Senior Scientist at Wolfspeed, a Cree company for 13 years, leading various projects in both R&D and production in SiC power devices, playing a critical role in the commercialization of all generations of SiC Schottky diodes and MOSFETs. Among his many milestones are demonstrating the industry’s first reported SiC trench MOSFET, 12 kV IGBTs, trench Schottky diode, drift-free BJT, 12 kV GTOs, SiC CIMOSFETs with the record device performance, latest generation of 650V and 1700V SiC MOSFETs for power modules, etc. He received his B.S. and M.S. degrees from Tsinghua University, China, respectively, and a Ph.D. degree from the University of South Carolina. He is the co-author of over 100 technical papers and conference presentations, and is the first or co-inventor on more than 80 US patents. He serves as a technical committee member of ISPSD, reviewer of various journals, and IEEE member.
Company Profile
Fudan University was established in 1905 as Fudan Public School. It was the first institution of higher education to be founded by a Chinese person. The two characters, fù (“return”) and dàn (“dawn”) were borrowed from A Commentary on The Classic of History （《尚书大传·虞夏传》）, of which the part on the Yu and the Xia dynasties mentions: “Brilliant are the sunshine and moonlight, again the morning radiance returns at dawn.” In 1917, the institution was renamed Fudan University, which has been kept ever since.
Yongxiang Wen, Ph.D. 闻永祥
Process Technology Director
Process Technology Director of Hangzhou Silan Microelectronics Co., LTD., responsible for the manufacturing and development of IC products, With 35 years of experience in integrated circuit manufacturing, responsible for the development of SL’s BICMOS\BCD products and processes, VDMOS, IGBT 、SIC products and processes. There are 6 patents （No.1 writer）authorized in the United States and 70 patents authorized in China.
Company Profile
Since 1997
As a high-tech enterprise specializing in the design of IC chip and the manufacturing of semiconductor microelectronics-related products, Hangzhou Silan Microelectronics Co., Ltd. (600460) is located in Hangzhou High-tech Industrial Development Zone. The company was founded in September 1997 and was headquartered in Hangzhou, China. In March 2003, our stock was listed on the Shanghai Stock Exchange and the company is the first IC chip design enterprise listed in China. Thanks to the rapid development of China’s electronic information industry, Silan has become one of the largest IC design and manufacturing enterprises in China, and many indicators such as technical level, business scale, profitability etc. are among the best in the domestic counterparts.
The IC chip production line belonging to Silan built in the Qiantang New District of Hangzhou currently has an actual monthly output of 220,000 pieces, ranking second in the world in production capacity for chips of 6 inches or less. Meanwhile, with the production line for 8-inch chips being constructed in 2015 and going into operation in 2017, the company has become the first domestic company possessing IDM products and production line for 8-inch chips. In 2018, a special process wafer production line for 12-inch chips and an advanced compound semiconductor device production line were constructed in Xiamen. By the end of 2022, the monthly production capacity of the company’s 12-inch chips line has reached 60,000 pieces, and the monthly production capacity of the compound semiconductor device production line has reached 140,000 pieces.
Our technologies and products cover many fields of consumer products, and maintain a leading position in many technical fields, such as green power supply chip technology, MEMS sensor technology, LED lighting and screen display technology, high-voltage smart power module technology, the third-generation power semiconductor device technology, digital audio and video technology etc. Moreover, with rich experience in multiple fields of chip design, we can provide customers with solutions on targeted chip product series and systemic applications.
Our product and R&D investment is mainly focused on the following three fields:
ICs, Power Module(IPM/ PIM), Discrete Devices and kinds of MCU/ IC power semiconductor solutions based on Silan’s own special process of high voltage, high power and high frequency.MEMS sensors & Digital audio SoC and speech recognition.Optoelectronic products, LED chip Manufacturing and packaging (for indoor and outdoor LED display panel as well as LED illumination applications).
Our technologies and products cover many fields of consumer products, and maintain a leading position in many technical fields, such as green power supply chip technology, MEMS sensor technology, LED lighting and screen display technology, high-voltage smart power module technology, the third-generation power semiconductor device technology, digital audio and video technology etc. Moreover, with rich experience in multiple fields of chip design, we can provide customers with solutions on targeted chip product series and systemic applications.
Our product and R&D investment is mainly focused on the following three fields:
ICs, Power Module(IPM/ PIM), Discrete Devices and kinds of MCU/ IC power semiconductor solutions based on Silan’s own special process of high voltage, high power and high frequency.
MEMS sensors & Digital audio SoC and speech recognition.
Optoelectronic products, LED chip Manufacturing and packaging (for indoor and outdoor LED display panel as well as LED illumination applications).
Chang Fu 傅昶
Advanced Module R&D Dep., Deputy Director
Chang Fu, current Deputy Division Director in Shanghai Huali Microelectronics / Integrated Circuit Corporation , member of Huahong Group, plays a role in Advanced Module Technology Development.
Prior to Huali, Mr. Fu has over 30 years of experiences regarding module process development, R&D, fab operations in multiple fabs. He had made critical contribution to the fab establishment in ASMC Shanghai, Chartered Semiconductor Manufacturing Singapore (now Global Foundry), UMCi (Singapore), convert new technologies into mass production and continuous developing. He also engaged in the Technology Development in GSMC (HHGrace now), another member of Huahong Group.
Mr. Chang Fu obtains a Bachelor’s degree in Electrical Engineering from FuDan University, and a Master of Science degree in Electrical Engineering from National University of Singapore.
Company Profile
HLMC, a subsidiary of Huahong Group, was established in 2010. As a main IC wafer foundry company in the industry, HLMC offers a portfolio of technologies and comprehensive solutions. It is devoted to providing one-stop wafer foundry technical services for technology nodes from 65/55nm to 28/22nm for design companies, IDM companies and other system companies.
HLMC has two 300mm fully-automated wafer fabs in Shanghai, Huahong Fab5 and Huahong Fab6. Headquartered in Zhangjiang Science Park, Shanghai, HLMC also has offices in the US, Japan, and Taiwan, providing sales and technical support for global customers.
Prof. Shaojun Wei
Professor
Dr. Shaojun Wei is the professor of Tsinghua University; Member of the National Integrated Circuit Industry Development Advisory Committee; Vice President of China Semiconductor Industry Association (CSIA) and President of Fabless Chapter CSIA. Dr. Wei was the President & CEO of Datang Telecom Technology Co., Ltd. and the CTO of Datang Telecom Industry Group between 2001-2006.
Dr. Wei has been working on VLSI design methodologies research and reconfigurable computing technology research. He has published more than 200 peer-reviewed papers and 6 monographs. He owns more than 130 patents, including 18 US patents. Dr. Wei is the IEEE Fellow, the Fellow of Chinese Institute of Electronics (CIE), the Fellow of Asia-Pacific AI Association, and the academician of the International Eurasian Academy of Science (IEAS).
Dr. Wei had won many awards including China National Second Award for Technology Invention (2015), China National Second Award for Technology Progress (2001), SIPO & WIPO Patent Golden Award (2003, 2015), First Award for Science and Technology of Ministry of Education (2014, 2019), China, First Award for Technology Invention of CIE (2012, 2017, 2020), EETimes China IC Design Achievement Award (2018), Aspencore Outstanding Contribution Award of the Year/Global Electronic Achievement Awards (2018), SEMI Special Contribution Award (2019) and IEEE CAS Industrial Pioneer Award (2020).
魏少军，现任清华大学教授，国际电气和电子工程师协会会士（IEEE Fellow），中国电子学会会士（CIE Fellow），亚太人工智能学会会士（AAIA Fellow），国际欧亚科学院院士，国家集成电路产业发展咨询委员会委员，北京超弦存储器研究院院长。曾任“核高基”国家科技重大专项技术总师，八六三计划微电子与光电子主题召集人，大唐微电子技术有限公司总经理/董事长、大唐电信科技股份有限公司总裁兼首席执行官、大唐电信科技产业集团总工程师。
魏少军长期致力于超大规模集成电路设计方法学的研究、可重构计算架构研究和通信专用集成电路技术研究，发表学术论文近 300 篇，出版专著 5 册，先后获得国家科技进步二等奖、国家技术发明二等奖、教育部技术发明一等奖（2项）、中国电子学会技术发明一等奖（4 项），国家知识产
权局和世界知识产权组织中国专利金奖（2 项）、国际半导体产业协会（SEMI）突出贡献奖、第五届世界互联网大会全球领先科技成果等。2020 年 5 月，获 IEEE 电路与系统协会产业先驱奖，旨在表彰他为当代计算机和通信系统智能芯片和电子身份证芯片的设计实现和批量生产所做出的开拓性
贡献。魏少军曾获全国五一劳动奖章，中国科协求是青年奖，享受国务院特殊津贴，是百千万人才工程国家级人选.
Company Profile
The campus of Tsinghua University is situated in northwest Beijing on the site of the former imperial gardens of the Qing Dynasty, and surrounded by a number of historical sites.
Tsinghua University was established in 1911, originally under the name “Tsinghua Xuetang”. The school was renamed “Tsinghua School” in 1912. The university section was founded in 1925. The name “National Tsinghua University” was adopted in 1928.
The faculty greatly valued the interaction between Chinese and Western cultures, the sciences and humanities, the ancient and modern. Tsinghua scholars Wang Guowei, Liang Qichao, Chen Yinque and Zhao Yuanren, renowned as the “Four Tutors” in the Institute of Chinese Classics, advocated this belief and had a profound impact on Tsinghua’s later development.
Tsinghua University was forced to move to Kunming and join with Peking University and Nankai University to form the Southwest Associated University due to the Resistance War against the Japanese Invasion in 1937. In 1946 The University was moved back to its original location in Beijing after the war.
After the founding of the People’s Republic of China, the University was molded into a polytechnic institute focusing on engineering in the nationwide restructuring of universities and colleges undertaken in 1952. In November 1952, Mr. Jiang Nanxiang became the President of the University. He made significant contributions in leading Tsinghua to become the national center for training engineers and scientists with both professional proficiency and personal integrity.
Since China opened up to the world in 1978, Tsinghua University has developed at a breathtaking pace into a comprehensive research university. At present, the university has 20 schools and 59 departments with faculties in science, engineering, humanities, law, medicine, history, philosophy, economics, management, education and art.
With the motto of “Self-Discipline and Social Commitment” and the spirit of “Actions Speak Louder than Words”, Tsinghua University is dedicated to the well-being of Chinese society and to world development. As one of China’s most prestigious and influential universities, Tsinghua is committed to cultivating global citizens who will thrive in today’s world and become tomorrow’s leaders. Through the pursuit of education and research at the highest level of excellence, Tsinghua is developing innovative solutions that will help solve pressing problems in China and the world.
Prof. Tianchun Ye
Researcher Professor
Secretary General of China Integrated Circuit Innovation Alliance
Academician of the International Eurasian Academy of Sciences
President of IC branch of China Semiconductor Industry Association
Company Profile
The Institute of Microelectronics (IME) of the Chinese Academy of Sciences (CAS) was established in 1958 as the CAS No. 109 Semiconductor Factory under the former CAS Institute of Applied Physics. Its original goal was to meet the nation’s strategic need to develop a high-frequency transistor computer. After numerous changes and mergers, it assumed its current name in 2003.
The IME is the only comprehensive scientific research institution in China, capable of carrying out full-chain research and development from microelectronic principal devices, integration processes, high-end chips, advanced packaging, and manufacturing equipment to applications.
IME comprises a national key laboratory, two CAS key laboratories, 11 research departments, and three technology research centers, covering all the main research areas of microelectronics. IME has a Ph.D. program in electronics and information; two master’s degree programs in IC engineering, and electronic and communication engineering, respectively; and a postdoctoral program in microelectronics.
IME has established long-term cooperative relationships with many national research institutions, universities, and companies in such countries as the United States, the United Kingdom, Germany, Japan, and Singapore, etc. A large number of delegations visit the institute every year, giving lectures, conducting academic exchange, and undertaking cooperative research projects.
Company website: www.ime.ac.cn
JY Zhang
Chairman and CEO
JingYang Zhang is Founder, Chairman and CEO of MooreElite since 2015. MooreElite is a leading IC Ecosystem company providing “IC design service, supply chain management, talent service”, with mission of “Make IC Design Easy & Efficient”. Mr. Zhang is a Member of Pudong Youth Federation, Pudong Top Ten Outstanding Young Entrepreneurs and Vice President of Southeast University IC Alumni Association.
Mr. Zhang started his career as RFIC Designer of Institute of RF-&OE-ICs; he then joined IBM Microelectronics as Foundry Technical Solution AP Team Lead and moved into IBM Foundry BD Manager. Mr. Zhang was Senior Manager of SEMI (Semiconductor Equipment and Materials International) from 2013 to 2014; Director of Business Development at Shanghai Industrial Technology Research Institute from 2014 to June 2015.
Mr. Zhang holds an M.S. EE from Southeast University, and EMBA of Economics and Management from Tsinghua University.
Company Profile
“MooreElite” under the brand of MooreElite Integrated Circuit Industry Development (Hefei) Co., Ltd. is a leading IC design accelerator, providing IC design service, supply chain management, talent services and enterprise services for over 1500 fabless and 500,000 semiconductor professionals. Our mission is “Make IC Design Easy & Efficient”. We are committed to providing ASIC design and Turnkey solutions, from Spec/FPGA/Algorithm to chip delivery, including chip architecture planning, IP selection, front-end design, DFT, digital verification, physical design, layout, tape out, packaging and testing services to help our customer succeed in the market. Since 2012, our team has been serving customers with knowledge of how to get the most out of silicon, offering flexible service models such as Turnkey, NRE, consulting and onsite support. Head-quartered in Shanghai, China, MooreElite has over 300 employees worldwide, with offices in Beijing, Shenzhen, Hefei, Chongqing, Suzhou, Guangzhou, Chengdu, Xi’an, Nanjing, Xiamen, Hsinchu and San Jose.
Wilson Hong
Senior Director, Power Electronics Design Department & Senior Expert, ECU Product Engineering
Senior Director, responsible for all HV components’ development in NIO, incl. PEU, DCDC, OBC, HV harness etc. Leading Person Award in electric vehicle industry of Anhui Province China. Over 16 years of working experience in electric drive and high voltage system, holds over 50 patents in CN, EU and US. Win the first Prize of Science and Technology Progress of China Association of Automobile Manufactures in 2021.
Company Profile
NIO is a global smart electric vehicle company. Founded in 2014, NIO has been committed to shaping a joyful lifestyle by offering high-performance smart electric vehicles and ultimate experience. NIO is the first car company listed on the NYSE, HKSE and SGX. NIO currently has two major brands under its umbrella: NIO and ONVO. Nine years into establishment, NIO is one of the leading companies in the global premium smart electric vehicle market.
Joseph Chou
General Manager
Company Profile
POMME was established in 2015 and is located in Hsinchu, Taiwan. It is engaged in high-end wafer test integration and design services for the semiconductor industry, focusing on providing you with the most efficient wafer parameter test solutions. Such as IC Design house, foundry, IDM, testing company, assembly and packaging company, etc., to simplify work for engineers in different departments (such as: technology research and development, quality and reliability assurance, failure analysis, manufacturing, etc.). POMME can help turn all the measurement and analysis under numerous test results into a simple job, speeding up product throughput throughout semiconductor production.
POMME is the solution partner of Keysight Technologies, a world-renowned instrument manufacturer. With more than 16 years of long-term cooperation experience, POMME has developed into the only and most reliable partner of customers among semiconductor industry test integration system providers, with the most professional The technical team, adhering to the spirit of quality first and customer satisfaction, grows together with customers and employees.
Since its establishment, it has served the semiconductor industry chain in the Asia-Pacific region, with more than 300 customers. We use experienced teamwork to run your test work quickly and efficiently. We can provide test solutions that meet your unique needs every time.
POMME possesses the leading wide-bandgap semiconductor automotive electronic components and module test solution technology, and has officially become the exclusive distributor of ipTEST LTD. in the UK. It can provide a full range of measurement solutions more efficiently to meet your needs.
main products:
Power semiconductor wafers, chips, components, and power module testing solutions.
Electrical test probe station (manual/semi-automatic/automatic), all electrical test probe station standard/custom configuration.
Electrical test system upgrade/maintenance/calibration/expansion (HP/Agilent/HP/Keysight/Keithley).
OST (Entrusted Measurement)/WBG/Low Current/Reliability/Burn-In.
Tim Yeh, Ph.D.
Technical Director
Tim Yeh holds a Ph.D. in Electrical Engineering from National Central University in Taiwan and serves as a member of the Executive Advisory Committee of the International Semiconductor Executive Summit (ISES China). He has long been engaged in the research and industrialization of compound semiconductor materials and devices, with 25 years of industrial R&D experience, particularly in the field of third-generation semiconductor materials and devices. He is well-versed in the design and industrial manufacturing of compound semiconductor devices.
Dr. Ye has previously worked as a researcher at the Telecommunication Laboratories of Chunghwa Telecom in Taiwan and served as a technical director for a publicly listed company in Taiwan. His research achievements have led to the granting of more than 30 patents across the United States, Japan, Mainland China, and Taiwan, and he has published over 70 papers in international journals. He has led or participated in several major projects under China’s Ministry of Science and Technology and key national R&D programs.
He currently serves as the Technical Director at Hunan Sanan Semiconductor, where he is responsible for the R&D and mass production integration of compound semiconductor power electronic devices. He has successfully established a full industrial chain production line for third-generation semiconductor power electronic devices, covering the entire process from epitaxy to device fabrication.
叶念慈，台湾中央大学电机工程博士，国际半导体高管峰会 (ISES China）执行顾问委员会成员，长期从事化合物半导体材料和器件研究及产业化，特别是在 第三代半导体材料和器件 领域拥有 25 年的产业研发经验，精通化合物半导体器件设计和产业化制造。曾先后任台湾中华电信公司电信研究所研究员及台湾上市公司技术负责人。研究成果获美国、日本、中国大陆和台湾地区专利授权30 余件，发表国际期刊论文 70 余篇，曾作为项目或课题负责人参与数项国家科技部重大专项和国家重点研发计划项目。现担任湖南三安半导体技术总监，负责 化合物半导体功率电子器件研发与量产导入，成功打造从外延到器件全产业链 第三代半导体功率电子器件产线。
Company Profile
Sanan Semiconductor is a wholly-owned subsidiary of the listed company Sanan Optoelectronics. Sanan is committed to becoming a world-class R & D, manufacturing and service platform for wide bandgap semiconductors. Sanan Semiconductor extended Sanan Optoelectronics’ 20-year compound semiconductor industrialization experience to the field of power electronics, and became a full-chain integration platform focusing on the wide bandgap semiconductor industry and providing the most comprehensive products and services.
Sanan Semiconductor’s silicon carbide (SiC) power products include automotive and industrial SiC Schottky barrier diodes (SBD) and SiC MOSFETs which provide key components with higher power density and higher energy conversion efficiency for the electric vehicles and renewable energy markets. These can then be applied to high-reliability applications such as electric vehicle drivetrains, charging stations, and solar photovoltaic inverters. Sanan Semiconductor is a member of the JEDEC JC-70 Wide Band Gap Semiconductor Standards Committee, which collaborated with the industry to provide process technologies and products with improved reliability and quality. The company also has a portfolio of AEC-Q101 certified products.
Yemin Dong, Ph.D.
General Manager
董业民，2004 年毕业于中国科学院上海微系统与信息技术研究 所，获工学博士学位，先后在宏力半导体(华虹宏力)和新加坡 特许半导体(GlobalFoundries)从事研发工作，具有丰富的集 成电路研发和产品量产经验。2016 年 3 月加入中国科学院上海 微系统所，曾先后担任高可靠器件协同创新设计中心主任、硅基 材料与集成器件实验室主任、信息功能材料国家重点实验室(集 成电路材料全国重点实验室)副主任等职务，2021 年 1 月-2023 年 6 月在广东省工业和信息化厅挂职，担任总工程师。承担多项 国家和省部级重大科研项目，从事极端微电子和高性能模拟等 芯片研发和产业化工作，发表学术论文 60 余篇，申请发明专利 80 余项，培养硕士和博士研究生近 20 名。
Dong Yemin graduated from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences in 2004, obtaining a doctoral degree in engineering. He has worked in research and development at Huali Semiconductor (Hua Hong Semiconductor) and GlobalFoundries in Singapore, with rich experience in integrated circuit research and product manufacturing. In March 2016, he joined the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, successively serving as the director of the High-Reliability Device Collaborative Innovation Design Center, director of the Silicon-Based Materials and Integrated Devices Laboratory, and deputy director of the State Key Laboratory of Functional Materials for Information. From January 2021 to June 2023, he served as the chief engineer of the Department of Industry and Information Technology of Guangdong Province. He has undertaken several national and provincial major scientific research projects, engaging in the development and industrialization of chips such as extreme microelectronics and high-performance analog. He has published over 60 academic papers, applied for more than 80 invention patents, and supervised nearly 20 master’s and doctoral students.”
董业民，2004 年毕业于中国科学院上海微系统与信息技术研究 所，获工学博士学位，先后在宏力半导体(华虹宏力)和新加坡 特许半导体(GlobalFoundries)从事研发工作，具有丰富的集 成电路研发和产品量产经验。2016 年 3 月加入中国科学院上海 微系统所，曾先后担任高可靠器件协同创新设计中心主任、硅基 材料与集成器件实验室主任、信息功能材料国家重点实验室(集 成电路材料全国重点实验室)副主任等职务，2021 年 1 月-2023 年 6 月在广东省工业和信息化厅挂职，担任总工程师。承担多项 国家和省部级重大科研项目，从事极端微电子和高性能模拟等 芯片研发和产业化工作，发表学术论文 60 余篇，申请发明专利 80 余项，培养硕士和博士研究生近 20 名。
Dong Yemin graduated from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences in 2004, obtaining a doctoral degree in engineering. He has worked in research and development at Huali Semiconductor (Hua Hong Semiconductor) and GlobalFoundries in Singapore, with rich experience in integrated circuit research and product manufacturing. In March 2016, he joined the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, successively serving as the director of the High-Reliability Device Collaborative Innovation Design Center, director of the Silicon-Based Materials and Integrated Devices Laboratory, and deputy director of the State Key Laboratory of Functional Materials for Information. From January 2021 to June 2023, he served as the chief engineer of the Department of Industry and Information Technology of Guangdong Province. He has undertaken several national and provincial major scientific research projects, engaging in the development and industrialization of chips such as extreme microelectronics and high-performance analog. He has published over 60 academic papers, applied for more than 80 invention patents, and supervised nearly 20 master’s and doctoral students.”
Company Profile
Shanghai Micro-Technology Industrial Research Institute (SITRI) was established in 2013 by Shanghai Science and Technology Commission, Jiading District Government and Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. It is a R&D and transformation functional platform integrating R&D, engineering, industrialization and cultivation, providing in-depth process technology support and services for innovative enterprises and partners. SITRI was established under the guidance of Shanghai Lianhe Investment Co., Ltd.’s strategic mission of serving the national strategy and being a pioneer in scientific and technological development. It relies on the “three-in-one” innovation architecture model of Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. With the support of the technical strength of Shanghai Institute of Microsystem and the investment and operation model of Shanghai Xinwei Technology Group, it has established close cooperative relations with many domestic and foreign production, learning and research organizations, realized the efficient industrialization of innovative achievements, and accelerated the establishment of the “More than Moore” industrial ecosystem.
· SITRI has the first 8-inch “More than Moore” R&D pilot line in China, providing “More than Moore” core process technologies such as MEMS, silicon photonics, and biochips, and providing efficient R&D, pilot and verification services for semiconductor companies such as design, equipment and materials, realizing seamless connection from R&D to small batch production.
· Up to now, SITRI has applied for 877 patents, 697 invention patents, including 56 PCT (international patent) patents. · SITRI is based in Shanghai, facing the Yangtze River Delta, and radiating across the country, and has initially formed an industrial ecosystem in the field of “More Than Moore”.
Dariusz Czaja
Managing Director of TRUMPF Huettinger Asia
Dariusz Czaja先生于2007年加入通快霍廷格电子，目前担任通快霍廷格电子亚洲董事总经理，主要负责中国，日本，韩国以及东南亚市场的业务营运以及拓展。在光伏、半导体、显示面板、玻璃镀膜等多个领域，Dariusz Czaja先生拥有十余年的业务营运和管理经验，其中包括光伏应用项目的重点推广。在通快霍廷格电子任职期间，Dariusz Czaja先生曾先后在波兰和德国工作，并于2017年开始担任通快霍廷格电子中国总经理一职。2023年，因应业务成长需要，荣任亚洲董事总经理
Dariusz Czaja先生拥有波兰卡齐米耶日-普瓦斯基拉多姆技术与人文大学的电子工程学位，他也是世界太阳能大会（World Solar Congress）咨询委员会的成员，同时也是中国国际半导体高层峰会（I.S.E.S.）的执行委员会成员。
Dariusz Czaja joined TRUMPF HUETTINGER Electronics in 2007 and is currently the Managing Director of TRUMPF HUETTINGER Electronics Asia, where he is responsible for business operations and expansion in China, Japan, Korea and Southeast Asia. Mr. Dariusz Czaja has more than 10 years of business operation and management experience in photovoltaics, semiconductors, display panels, glass coatings and other fields, including the key promotion of photovoltaic application projects. During his tenure at TRUMPF Huettinger Electronics, Mr. Czaja worked in Poland and Germany, and in 2017 he became General Manager of TRUMPF Huettinger Electronics China. In 2023, he was appointed Managing Director of Asia in response to business growth needs.
Mr. Czaja holds a degree in Electronic Engineering from the University of Technology and Humanities in Kazimierz-Pułaskiradom, Poland, and is a member of the Advisory Board of the World Solar Congress and a member of the China International Semiconductor Executive Summit (I. S.E.S.).
Company Profile
通快霍廷格电子有限公司成立于1922年，总部设于德国弗莱堡，是世界领先的等离子体电源制造商，产品主要用于：半导体，显示器和太阳能领域，以及光学镀膜，装饰镀膜，工业镀膜，大面积玻璃镀膜等行业的等离子体应用，于1990年正式加入通快集团。通快霍廷格电子致力于开发、制造用于各种沉积和干法刻蚀工艺的等离子电源，在电源领域拥有一百多年的经验积累，在欧洲、美洲和亚洲分别设有销售和服务子公司和分支机构。
2006年，通快霍廷格电子中国成立，至今已经深耕中国市场19年。如今，通快霍廷格在中国设有亚太区应用中心、维修中心、电源及匹配器生产中心，为客户提供所有生产过程中的优质服务。2023年，通快霍廷格中国新工厂在太仓建成开业，这是通快霍廷格继德国、波兰之后布局的全球第三家生产制造基地。
TRUMPF Huettinger is a high-tech company and a leading global manufacturer of DC, medium-frequency, high-frequency and semiconductor-based solid-state microwave generators.
The business units include plasma technology, industrial heating, battery inverter systems as well as microwave generators and amplifiers. These process power supplies are being used in many key processes in research, development and production. As a part of TRUMPF – technology leader of industrial lasers and machine tools – TRUMPF Electronics is headquartered in Freiburg/Germany and has sales and service branches in Europe, US and Asia providing a global IoT based service support.
Product introduction:
1. TruPlasma DC 4000 (G2) Series
TruPlasma DC 4000 (G2) 系列专为金属，金属氧化物，绝缘材料的反应直流溅射而开发。电源以直流脉冲的形式输出，在高要求的膜层质量和大产能的PVD 和PECVD 工艺中证明了它的优势。
The TruPlasma DC Series 4000 (G2) combines the excellent arc handling of TRUMPF Hüttinger with the advantages of DC pulse technology. This means you gain improved coating results with fewer defects, along with a higher deposition rate. The results are brilliant surfaces and a high level of production power.
2. TruPlasma DC 3000 (G2) Series
TruPlasma DC 3000 (G2) 系列适合众多直流溅射工艺，得益于先进的电弧管理和集成水冷装置，该款直流电源同样可用作脉冲式直流电源的高性价比替代方案。此外，极其紧凑的结构使其方便集成至现有应用中。
The TruPlasma DC Series 3000 (G2) is suited to numerous DC sputtering processes. The DC generators also make an interesting cost-effective alternative to pulsed DC generators due to their progressive arc management and the integrated water cooling. The very compact design also enables simple integration into existing applications.
3. TruPlasma RF 1000/3000 (G2/13) Series
全新一代的射频电源TruPlasma RF 1000 / 3000 (G2/13.56M) 系列，对工艺过程中的所有参数进行实时监测，即使在要求严苛的等离子体工艺中，仍能确保可靠供电。其稳定的输出功率和高精度控制确保高效高生产效率的同时，实现最佳工艺效果。
The TruPlasma RF Series 1000 / 3000 (G2/13) are the latest generation of RF generators. Due to innovative functions such as the patented CombineLine coupling technology or real-time measurement of all process parameters, reliable power supply even in demanding plasma processes is guaranteed – the optimal conditions for reproducible results and high productivity.
4. TruPlasma LF Series
TruPlasma LF 1000 系列电源基于创新的平台概念, 频率范围有350k，400k，2M，功率范围1~10kw，适用于各类半导体，光伏，ALD，刻蚀等离子应用。
TruPlasma LF 1000 series are based on an innovative platform concept with frequency ranges of 350k, 400k, 2M and power ranges from 1 to 10kw for all types of semiconductors, photovoltaic, ALD, and etch plasma applications.
5. TruPlasma VHF 3000 series
TruPlasma VHF 3000 系列电源基于创新的平台概念, 频率覆盖27M；40M；60M。功率范围1~10kw。可满足极为苛刻的生产要求。VHF 电源的纯水冷模块化结构与极高的功率密度设计可以确保大功率输出下的稳定性。
TruPlasma VHF 3000 series power supply is based on an innovative platform concept covering frequencies of 27M, 40M, 60M, and power ranges of 1~10kw to meet the most demanding production requirements. the VHF power supply’s pure water-cooled modular construction and extremely high power density design ensure stability at high power outputs.
Alan Zhou, Ph.D.
CEO, Shanghai
Dr. Alan Zhou has over 30 years of executive experience in multinational and startup companies within the semiconductor industry. Currently serving as the CEO of Shanghai Pixelworks Stock Limited Co. Formerly he was the CEO of BelGaN and Chairman of GaNcool. Before that, he was an Executive Vice President (EVP) of Pixelworks and the President of its China subsidiary, he was responsible for corporate restructuring, financing, acquisitions, and preparations for a STAR Market listing; He also served as the managing partner and Chief Strategy Officer (CTO) at the National IC Fund’s Fujian Anxin Capital, overseeing global investments and acquisitions for the third generation compound semiconductors; a Corporate Vice President at Qualcomm in charge of the smartphone chipset business worth over $3 billion; and a Managing Director at Lucent Technologies, where he led the development and design of China’s first local brand GSM mobile phone reference design and chipset. In 1998, he co-founded MEMSIC, a MEMS sensor company listed in NASDAQ around 2007; and in 1994, served as the General Manager of AT&T Bell Laboratories in Wuxi, managing the technology transfer and construction of China’s first sub-micron very large scale integrated circuit (VLSI) manufacturing Fab for the national 908 Project, which led to the establishment of CSMC went public in HongKong, then acquired by China Resources Group, now known as China Resources Microelectronics listed in the STAR exchange. Dr.Zhou graduated from MIT and earned a Master and Doctor degree in Microelectronics and Computer Science.
Company Profile
Pixelworks’ technology and solutions cover end to end, optimized video delivery that is true to its creator’s intent with a highly authentic viewing experience. Our innovations over two decades has resulted in a strong IP portfolio related to the visual display of digital image data. Our vision is that every screen, no matter how big or small, deserves the highest picture quality. This vision has driven us to develop technology that spans the range from digital projection systems and large flat panel displays to small, low power mobile devices such as smartphones. We also develop innovative methods to apply our core technologies to reduce overall system power and help reduce the bandwidth burden that comes with the display of HD and UHD video.
The relentless advancement of display technology and explosive growth of video consumption driven by digital delivery systems and mobile applications are increasing the necessity and demand for Video Display Processing technology. To meet this growing demand, we deliver our technology as IP cores, semiconductors, software and custom ASIC solutions. This flexible approach allows our customers to deliver the highest video quality in a multitude of applications and form factors while also providing the ability for end product differentiation. Our primary target markets include smartphones, tablets and digital projection systems.
We focus our investments on developing video enhancement solutions for Video Delivery, Mobile Devices and Projectors market segments, with particular attention to increasing performance, video quality, device functionality and saving power. Additionally, we look for ways to leverage our research and development investment into products that address other high-value markets where our innovative proprietary technology provides differentiation for us and our customers. We continually seek to expand our technology portfolio through internal development, co-development with business partners.
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