Our advisory boards includes leading experts from across the semiconductor and MEMS sectors including 5G, IoT, Advanced Packaging, AI, Automotive Electronics, and Power Semiconductors.

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Jennifer Zhao

  • GM & EVP for Advanced Optical Sensors Division
  • ams

Jennifer Zhao joined ams as EVP and GM for Advanced Optical Sensors Division in 2017. She served as SVP, Global Sales and Marketing at Nexperia and held multiple management positions at NXP Semiconductors and Tyco International before that. Jennifer has managed various businesses including System Management, Logic and Microcontrollers and worked with leading OEM’s worldwide in Mobile and Consumer, Automotive and Industrial segments. Currently Jennifer manages a global team with R&D, Operations, Marketing and Application resources in US, Europe, Greater China and South East Asia.

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ams

ams is a global leader in the design and manufacture of advanced sensor solutions. Our mission is to shape the world with sensor solutions by providing a seamless interface between humans and technology. ams’ high-performance sensor solutions drive applications requiring small form factor, low power, highest sensitivity and multi-sensor integration. Products include sensor solutions, sensor ICs, interfaces and related software for consumer, communications, industrial, medical, and automotive markets. With headquarters in Austria, ams employs about 9,000 people globally and serves more than 8,000 customers worldwide.

Leading manufacturers around the globe rely on ams’ sensing know-how for advanced systems design. For ams, “Sensing is Life” and our passion is in creating the sensor solutions that make devices smarter, safer, convenient and more environment-friendly. ams’ sensor solutions are at the heart of the products and technologies that define our world today –from smartphones and mobile devices to smart homes and buildings, industrial automation, medical technology, and connected vehicles. Our products drive applications requiring small form factor, low power, highest sensitivity and multi-sensor integration. We offer sensors (including optical sensors), interfaces and related software for consumer, communications, industrial, medical, and automotive markets.

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Wei Wang

Career

  • 2016 – now Assistant president 、 Director of R&D and Operation in TSARI
  • 2011 – 2016 General manager in MicRiver Information Systems
  • 2001- 2010 AP Manager, BP, PM in Delphi Packard Electric Systems

Study

Graduated from Automotive Engineering Department of Tsinghua University in 1999, and Olin Business School of Washington University in St. Louis in 2008.

Other information

Senior engineer in management domain; Member of JS-SAE automobile intelligent manufacturing committee & Industry Standard Committee of Automotive Intelligent Manufacturing

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Automotive Research Institute (Suzhou), Tsinghua University (TSARI)
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Dr. Xiaoxin Qiu

Xiaoxin Qiu received her BE and ME degrees from Tsinghua University, P. R. China, in 1990 and 1991, respectively; and her Ph.D. from University of Southern California, Los Angeles, in 1996, all in Electrical Engineering.

From 1996 to 2001, she was with the Broadband Wireless Systems Research Department of AT&T Laboratories in Middletown, NJ, USA. In January 2001, she joined Mobilink Telecom Inc, which became a part of Broadcom Corporation in 2002. During her tenure in Broadcom, she served as the Vice President of Systems Design Engineering, and was responsible for cellular modem development and productization as well as developing next generation cellular IoT/M2M/NB-IoT devices and platforms.

In 2016, she joined WNC, a Taiwanese ODM company, serving as the CTO of Software and Vice President of Technical Marketing. In this capacity, Xiaoxin was in charge of creating the 5G product line from scratch and was responsible for the successful product design-ins in Verizon and a handful of European operators.

In 2018, Xiaoxin joined UniSoC Corp in China as Chief Technology Officer, responsible for defining the company technology and product roadmaps, and leading the R&D effort.

In 2019, she started and served as CEO of Axera Technology Co. Ltd., a start-up company focusing on creating AI enabled, high performance vision processing chips for a variety of public safety, smart city, smart home, smart industrial applications.

Xiaoxin is a senior member of the IEEE, and was elected Broadcom Distinguished Engineer in 2008 due to her outstanding contributions in cellular technology development in Broadcom.

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Axera Technology Co., Ltd

Axera is a high-tech semiconductor company focused on developing world class Artificial Intelligence (AI) SoCs, for high-performance low-power computer vision applications. These chips are particularly suitable for today’s AIoT products, extending the AI intelligence from the cloud to the edge as well as end devices. They can be used in a vast array of applications such as smart cities, smart transportation, smart manufacturing and smart homes, with the goal to convenience people’s life and make our society a better and safer place.

AX630A:A high-performance low-power Computer Vision AI SoC

axerapr@axera-tech.com
https://www.axera-tech.com/

Add: 4th Floor, Raycom Info Tech Tower A, No. 2 Kexueyuan South Road, Haidian District, Beijing, 100190 PRC

General phone number and fax 010-82622584

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Dr. Alan Zhou

Dr. Zhou Zhenhong (Dr. Alan Zhou) has over 30 years of executive experience in multinational and startup companies within the semiconductor industry. A graduate of the Massachusetts Institute of Technology, he earned a doctorate in microelectronics and computer science. Currently serving as the CEO of BelGaN and the Chairman of GaNcool Semiconductor, he is dedicated to establishing the “GaN Valley”. Formerly, he was a managing partner and Chief Strategy Officer (CTO) at the National Integrated Circuit Industry Investment Fund’s Fujian Anxin Capital, overseeing global investments and acquisitions for the third-generation compound semiconductors; an Executive Vice President (EVP) of Pixelworks and the President of its China subsidiary, he was responsible for corporate restructuring, financing, acquisitions, and preparations for a STAR Market listing; a Corporate Vice President at Qualcomm in charge of the smartphone chipset business worth over $3 billion; and a Managing Director at Lucent Technologies, where he led the development and design of China’s first local brand GSM mobile phone chipset. In 1998, he co-founded MEMSIC, a MEMS sensor company listed on NASDAQ; and in 1994, he returned to China to serve as the General Manager of AT&T Bell Laboratories in Wuxi, managing the technology transfer and construction of China’s first sub-micron very large scale integrated circuit (VLSI) manufacturing line for the national 908 Project, which led to the establishment of CSMC went public in HongKong, then acquired by China Resources Group, now known as China Resources Microelectronics listed in the STAR exchange, often hailed as the “Huangpu Military Academy” of the Chinese semiconductor industry.

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BelGaN

Be a leading automotive qualified open foundry in the Wide Band Gap ecosystem.

Enabling our customers to develop and manufacture unique solutions for a sustainable electrified future.

Creating value through our employees’ enthusiasm, talents and commitment.

BelGaN, as a WBG foundry in Europe, enables and services a rapidly expanding GaN-ecosystem in Europe (‘GaN-Valley’) and beyond with innovative and high-quality WBG semiconductor technologies and a highly efficient value-add 6 and 8 inch manufacturing facility. BelGaN adds unique services such as customer-driven Technology-as-a-Service (customized processes), Manufacturing-as-a-Service, and Quality-as-a-Service to the traditional foundry business model whereas we cooperate with suppliers and customers to deliver automotive quality products to the market. BelGaN develops and bring-to-market a rich roadmap of GaN & SiC platforms, driven by our customers’ needs and our core strengths and vision. We partner with leading universities and RTO’s in an Open Innovation model to prepare our innovation roadmap and bring differentiating innovations to our customers.

Manufacturing Facility: Wafer fab with over 4500 m2 of clean room space, located on a 44.000 m2campus.

Fab: 6 & 8 inch (planned).

Production: GaN Technologies & 0.35 µm to 2 µm Low, Medium, and High Voltage Analog CMOS and BCD Technologies.

BelGaN BV
Westerring 15
9700 Oudenaarde
Belgium

www.belgan.be

+32 55 332211

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Martin Weigert

  • VP & GM Industrial Fiber Products Division
  • Broadcom

Martin Weigert is the Vice President & General Manager of the Industrial Fiber Products Division which manufactures fiber optic and sensor products targeting the industrial, automotive and medical market. Martin Weigert worked for Siemens/Osram/Infineon/Avago for over 20 years and has held various development & marketing positions in the company’s fiber optic and LED product divisions. Martin has many years of experience in leading positions for development and marketing of optoelectronic components for the automotive and fiber optic markets. He is currently in charge of the P&L for the Industrial Fiber Product Division at Broadcom. Martin studied Micro System Technology and has a technical background in MEMS, Optoelectronics and Semiconductors. He is the managing director of the Avago Technologies GmbH in Munich, Avago Technologies Fiber Austria GmbH in Vienna and a member of the supervisory board at CISES (Chinese International Semiconductor Executive Summit).

20 years experience in Fiber Optics

1994 -1997 – Process development MEMS
1997 -1998 – Task force leader production ramp-up
1998 –1999 – Project leader optical SMD devices
1999 –2000 – Marketing Manager Automotive LED
2001 –2004 – Director Development Fiber Optics
2004 –2006 – Director Marketing POF
2006 –2007 – Director Product Line Manager (R&D+Marketing) at Infineon
Since 2008 – General Manager Industrial Fiber Optics at Avago Technologies
Since 2009 – Managing Director “Avago Technologies Fiber GmbH”
2011-2017 – Member of the supervisory board at MIC AG
Since 2012 – Managing Director “Avago Technologies Fiber Austria GmbH”
2014-2016 – Vice President & General Manager at Avago Technologies
Since 2016 – Vice President & General Manager at Broadcom

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Broadcom

Coming soon…

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Amy Leong

  • Chief Marketing Officer and Senior Vice President, Mergers and Acquisitions
  • Formfactor

Amy Leong has been with FormFactor since October 2012. Prior to this, Amy was the VP of Marketing at MicroProbe from April 2010 through the October 2012 closing of FormFactor’s acquisition of MicroProbe. Before joining MicroProbe, Ms. Leong worked at Gartner, Inc. as a Research Director from 2008 to 2010 and covered the ASSP system-on-chip and microcontroller markets. From 2003 to 2008, Ms. Leong worked at FormFactor where she served as Senior Director of Corporate Strategic Marketing and Director of DRAM Product Marketing. Prior to FormFactor, Ms. Leong worked in a variety of semiconductor process engineering and product marketing roles at KLA-Tencor and IBM.

Ms. Leong holds an M.S. in Material Science and Engineering from Stanford University and a B.S. in Chemical Engineering from the University of California, Berkeley.

 

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Formfactor

FormFactor is a leading provider of essential test and measurement technologies along the full IC life cycle – from metrology and inspection, characterization, modeling, reliability, and design debug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge.

FormFactor’s leading-edge probe stations, probes, probe cards, optical metrology and inspection, advanced thermal subsystems, quantum cryogenic systems, and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing of high-speed and high-density semiconductor chips.

Visit www.formfactor.com.

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Dr. Qingchun Zhang

Dr. Q. Jon Zhang is currently the distinguished professor in Fudan University. He was the Principal Engineer for WBG technologies in Alpha and Omega Semiconductors (AOS), USA, leading R&D and production activities on SiC devices, working with a world-leading CMOS foundry to commercialize MOSFETs and Diodes on SiC. Prior to AOS, he was the director of power device technology at the PowerAmerica Institute reviewing the technical proposals and managing wide bandgap power devices, modules and power electronics projects in order to accelerate the adoption of next generation SiC and GaN power electronics. He also served as the adjunct professor of the Department of Electrical and Computer Engineering at NC State University. Before joining NCSU, he has been the Senior Scientist at Wolfspeed, a Cree company for 13 years, leading various projects in both R&D and production in SiC power devices, playing a critical role in the commercialization of all generations of SiC Schottky diodes and MOSFETs. Among his many milestones are demonstrating the industry’s first reported SiC trench MOSFET, 12 kV IGBTs, trench Schottky diode, drift-free BJT, 12 kV GTOs, SiC CIMOSFETs with the record device performance, latest generation of 650V and 1700V SiC MOSFETs for power modules, etc. He received his B.S. and M.S. degrees from Tsinghua University, China, respectively, and a Ph.D. degree from the University of South Carolina. He is the co-author of over 100 technical papers and conference presentations, and is the first or co-inventor on more than 80 US patents. He serves as a technical committee member of ISPSD, reviewer of various journals, and IEEE member.

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Fudan University
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Dr. Yongxiang Wen

Process Technology Director of Hangzhou Silan Microelectronics Co., LTD., responsible for the manufacturing and development of IC products, With 35 years of experience in integrated circuit manufacturing, responsible for the development of SL’s BICMOS\BCD products and processes, VDMOS, IGBT 、SIC products and processes. There are 6 patents (No.1 writer)authorized in the United States and 70 patents authorized in China.

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Hangzhou Silan Microelectronics Co., Ltd.
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Chang Fu

  • Advanced Module R&D Dep., Deputy Director
  • HLMC

Chang Fu, current Deputy Division Director in Shanghai Huali Microelectronics / Integrated Circuit Corporation , member of Huahong Group, plays a role in Advanced Module Technology Development.

Prior to Huali, Mr. Fu has over 30 years of experiences regarding module process development, R&D, fab operations in multiple fabs. He had made critical contribution to the fab establishment in ASMC Shanghai, Chartered Semiconductor Manufacturing Singapore (now Global Foundry), UMCi (Singapore), convert new technologies into mass production and continuous developing. He also engaged in the Technology Development in GSMC (HHGrace now), another member of Huahong Group.

Mr. Chang Fu obtains a Bachelor’s degree in Electrical Engineering from FuDan University, and a Master of Science degree in Electrical Engineering from National University of Singapore.

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HLMC
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Yaojian Lin

Mr. Lin, Yaojian holds B.S. degree in Metal Materials & Heat Treatment from Huazhong University of Science and Technology with Honor of Outstanding Graduate, M.S. degree in Composite Materials from Shanghai Jiaotong University, and M.S. degree in Materials Science from University of Rochester, NY, United States. He once worked at Shanghai Jiaotong University, Lucent Bell Labs/Sychip, and STATS ChipPAC (Singapore), and is now VP of Corporate & GM of Technology R&D Center. He has over 20 years R&D and Technology Transfer Experience in Materials and Semiconductor Packaging development, especially in wafer level package and advanced packaging. He has hands-on experiences in end-to-end technology & product development from conceptual to high volume manufacturing in IPD, Wafer Bumping, WLCSP, eWLB/eWLCSP, 2.5D Fan-out & fcBGA, fcCSP and advanced SiP. He is the inventor/co-inventor of 200+ granted US patents in semiconductor packaging.

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JCET Group Co., Ltd.

JCET Group is the world’s leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world.

Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the world, providing close technology collaboration and efficient supply-chain manufacturing to our global customers.

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Prof. Shaojun Wei

Dr. Shaojun Wei is the professor of Tsinghua University; Member of the National Integrated Circuit Industry Development Advisory Committee; Vice President of China Semiconductor Industry Association (CSIA) and President of Fabless Chapter CSIA. Dr. Wei was the President & CEO of Datang Telecom Technology Co., Ltd. and the CTO of Datang Telecom Industry Group between 2001-2006.

Dr. Wei has been working on VLSI design methodologies research and reconfigurable computing technology research. He has published more than 200 peer-reviewed papers and 6 monographs. He owns more than 130 patents, including 18 US patents. Dr. Wei is the IEEE Fellow, the Fellow of Chinese Institute of Electronics (CIE), the Fellow of Asia-Pacific AI Association, and the academician of the International Eurasian Academy of Science (IEAS).

Dr. Wei had won many awards including China National Second Award for Technology Invention (2015), China National Second Award for Technology Progress (2001), SIPO & WIPO Patent Golden Award (2003, 2015), First Award for Science and Technology of Ministry of Education (2014, 2019), China, First Award for Technology Invention of CIE (2012, 2017, 2020), EETimes China IC Design Achievement Award (2018), Aspencore Outstanding Contribution Award of the Year/Global Electronic Achievement Awards (2018), SEMI Special Contribution Award (2019) and IEEE CAS Industrial Pioneer Award (2020).

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IME, Tsinghua University

The campus of Tsinghua University is situated in northwest Beijing on the site of the former imperial gardens of the Qing Dynasty, and surrounded by a number of historical sites.

Tsinghua University was established in 1911, originally under the name “Tsinghua Xuetang”. The school was renamed “Tsinghua School” in 1912. The university section was founded in 1925. The name “National Tsinghua University” was adopted in 1928.

The faculty greatly valued the interaction between Chinese and Western cultures, the sciences and humanities, the ancient and modern. Tsinghua scholars Wang Guowei, Liang Qichao, Chen Yinque and Zhao Yuanren, renowned as the “Four Tutors” in the Institute of Chinese Classics, advocated this belief and had a profound impact on Tsinghua’s later development.

Tsinghua University was forced to move to Kunming and join with Peking University and Nankai University to form the Southwest Associated University due to the Resistance War against the Japanese Invasion in 1937. In 1946 The University was moved back to its original location in Beijing after the war.

After the founding of the People’s Republic of China, the University was molded into a polytechnic institute focusing on engineering in the nationwide restructuring of universities and colleges undertaken in 1952. In November 1952, Mr. Jiang Nanxiang became the President of the University. He made significant contributions in leading Tsinghua to become the national center for training engineers and scientists with both professional proficiency and personal integrity.

Since China opened up to the world in 1978, Tsinghua University has developed at a breathtaking pace into a comprehensive research university. At present, the university has 20 schools and 59 departments with faculties in science, engineering, humanities, law, medicine, history, philosophy, economics, management, education and art.

With the motto of “Self-Discipline and Social Commitment” and the spirit of “Actions Speak Louder than Words”, Tsinghua University is dedicated to the well-being of Chinese society and to world development. As one of China’s most prestigious and influential universities, Tsinghua is committed to cultivating global citizens who will thrive in today’s world and become tomorrow’s leaders. Through the pursuit of education and research at the highest level of excellence, Tsinghua is developing innovative solutions that will help solve pressing problems in China and the world.

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Prof. Tianchun Ye

Secretary General of China Integrated Circuit Innovation Alliance

Academician of the International Eurasian Academy of Sciences

President of IC branch of China Semiconductor Industry Association

 

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Institute of Microelectronics of the Chinese Academy of Sciences

The Institute of Microelectronics (IME) of the Chinese Academy of Sciences (CAS) was established in 1958 as the CAS No. 109 Semiconductor Factory under the former CAS Institute of Applied Physics. Its original goal was to meet the nation’s strategic need to develop a high-frequency transistor computer. After numerous changes and mergers, it assumed its current name in 2003.
The IME is the only comprehensive scientific research institution in China, capable of carrying out full-chain research and development from microelectronic principal devices, integration processes, high-end chips, advanced packaging, and manufacturing equipment to applications.
IME comprises a national key laboratory, two CAS key laboratories, 11 research departments, and three technology research centers, covering all the main research areas of microelectronics. IME has a Ph.D. program in electronics and information; two master’s degree programs in IC engineering, and electronic and communication engineering, respectively; and a postdoctoral program in microelectronics.
IME has established long-term cooperative relationships with many national research institutions, universities, and companies in such countries as the United States, the United Kingdom, Germany, Japan, and Singapore, etc. A large number of delegations visit the institute every year, giving lectures, conducting academic exchange, and undertaking cooperative research projects.

Company website: www.ime.ac.cn

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JY Zhang

JingYang Zhang is Founder, Chairman and CEO of MooreElite since 2015. MooreElite is a leading IC Ecosystem company providing “IC design service, supply chain management, talent service”, with mission of “Make IC Design Easy & Efficient”. Mr. Zhang is a Member of Pudong Youth Federation, Pudong Top Ten Outstanding Young Entrepreneurs and Vice President of Southeast University IC Alumni Association.

Mr. Zhang started his career as RFIC Designer of Institute of RF-&OE-ICs; he then joined IBM Microelectronics as Foundry Technical Solution AP Team Lead and moved into IBM Foundry BD Manager. Mr. Zhang was Senior Manager of SEMI (Semiconductor Equipment and Materials International) from 2013 to 2014; Director of Business Development at Shanghai Industrial Technology Research Institute from 2014 to June 2015.

Mr. Zhang holds an M.S. EE from Southeast University, and EMBA of Economics and Management from Tsinghua University.

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MooreElite

“MooreElite” under the brand of MooreElite Integrated Circuit Industry Development (Hefei) Co., Ltd. is a leading IC design accelerator, providing IC design service, supply chain management, talent services and enterprise services for over 1500 fabless and 500,000 semiconductor professionals. Our mission is “Make IC Design Easy & Efficient”. We are committed to providing ASIC design and Turnkey solutions, from Spec/FPGA/Algorithm to chip delivery, including chip architecture planning, IP selection, front-end design, DFT, digital verification, physical design, layout, tape out, packaging and testing services to help our customer succeed in the market. Since 2012, our team has been serving customers with knowledge of how to get the most out of silicon, offering flexible service models such as Turnkey, NRE, consulting and onsite support. Head-quartered in Shanghai, China, MooreElite has over 300 employees worldwide, with offices in Beijing, Shenzhen, Hefei, Chongqing, Suzhou, Guangzhou, Chengdu, Xi’an, Nanjing, Xiamen, Hsinchu and San Jose.

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Santosh Kumar

Santosh Kumar formerly worked as Director & Principal Analyst at Yole Développement, where he was involved in the market, technology and strategic analysis of the microelectronic assembly and packaging technologies. His main interest areas are advanced IC packaging technology including equipment & materials. He is the author of several reports on fan-out / fan-in WLP, flip chip, and 3D/2.5D packaging.

He received the bachelor and master’s degree in engineering from the Indian Institute of Technology (IIT), Roorkee and University of Seoul respectively. He has published more than 40 papers in peer reviewed journals and has obtained 2 patents. He has presented and given talks at numerous conferences and technical symposiums related to advanced microelectronics packaging.

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Reliance India Ltd.
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Dr. Tim Yeh

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Sanan IC
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Dr. Dong Yemin

Dong Yemin graduated from the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences in 2004, obtaining a doctoral degree in engineering. He has worked in research and development at Huali Semiconductor (Hua Hong Semiconductor) and GlobalFoundries in Singapore, with rich experience in integrated circuit research and product manufacturing. In March 2016, he joined the Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, successively serving as the director of the High-Reliability Device Collaborative Innovation Design Center, director of the Silicon-Based Materials and Integrated Devices Laboratory, and deputy director of the State Key Laboratory of Functional Materials for Information. From January 2021 to June 2023, he served as the chief engineer of the Department of Industry and Information Technology of Guangdong Province. He has undertaken several national and provincial major scientific research projects, engaging in the development and industrialization of chips such as extreme microelectronics and high-performance analog. He has published over 60 academic papers, applied for more than 80 invention patents, and supervised nearly 20 master’s and doctoral students.

董业民,2004年毕业于中国科学院上海微系统与信息技术研究所,获工学博士学位,先后在宏力半导体(华虹宏力)和新加坡特许半导体(GlobalFoundries)从事研发工作,具有丰富的集成电路研发和产品量产经验。2016年3月加入中国科学院上海微系统所,曾先后担任高可靠器件协同创新设计中心主任、硅基材料与集成器件实验室主任、信息功能材料国家重点实验室(集成电路材料全国重点实验室)副主任等职务,2021年1月-2023年6月在广东省工业和信息化厅挂职,担任总工程师。承担多项国家和省部级重大科研项目,从事极端微电子和高性能模拟等芯片研发和产业化工作,发表学术论文60余篇,申请发明专利80余项,培养硕士和博士研究生近20名。

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Shanghai Industrial uTechnology Research Institute (SITRI)

Shanghai Micro-Technology Industrial Research Institute (SITRI) was established in 2013 by Shanghai Science and Technology Commission, Jiading District Government and Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. It is a R&D and transformation functional platform integrating R&D, engineering, industrialization and cultivation, providing in-depth process technology support and services for innovative enterprises and partners. SITRI was established under the guidance of Shanghai Lianhe Investment Co., Ltd.’s strategic mission of serving the national strategy and being a pioneer in scientific and technological development. It relies on the “three-in-one” innovation architecture model of Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences. With the support of the technical strength of Shanghai Institute of Microsystem and the investment and operation model of Shanghai Xinwei Technology Group, it has established close cooperative relations with many domestic and foreign production, learning and research organizations, realized the efficient industrialization of innovative achievements, and accelerated the establishment of the “More than Moore” industrial ecosystem.

· SITRI has the first 8-inch “More than Moore” R&D pilot line in China, providing “More than Moore” core process technologies such as MEMS, silicon photonics, and biochips, and providing efficient R&D, pilot and verification services for semiconductor companies such as design, equipment and materials, realizing seamless connection from R&D to small batch production.

· Up to now, SITRI has applied for 877 patents, 697 invention patents, including 56 PCT (international patent) patents. · SITRI is based in Shanghai, facing the Yangtze River Delta, and radiating across the country, and has initially formed an industrial ecosystem in the field of “More Than Moore”.

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Dr. Key Chung

C. Key Chung received his BSc degree from Nanyang Technological University, Singapore, and PhD degree from National Taiwan University, both in materials science and engineering. He is currently the CTO of Advanced Packaging R&D at TFME responsible for advanced chiplet packaging pathfinding, development, and initial ramp-up. Dr. Chung has successfully certified multiple advanced packaging including ultra-thin FO-PoP, FOMCM, FOEB, 2.1D, 2.5D, and 3DIC packaging. He has been involved in electronic assembly for 27 years, and having also worked at Intel, HP and SPIL. He is a recognized expert in electronic interconnection and a standing reviewer for the Journal of Alloys and Compounds from which he received the outstanding reviewer award. He has authored over 40 patents, over 50 journal and conference papers, and multiple invited talks at international conferences.

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TongFu Microelectronics Co., Ltd

Tongfu Microelectronics Co.,Ltd. was established in October 1997 and listed on the Shenzhen Stock Exchange in August 2007. Its total assets are more than 16 billion yuan. Headquartered in Nantong, Jiangsu Province, Tongfu Microelectronics specializes in integrated circuit packaging and testing. Nantong Tongfu Microelectronics Co., Ltd. (Nantong Tongfu), Hefei Tongfu Microelectronics Co., Ltd. (Hefei Tongfu), Xiamen Tongfu Microelectronics Co., Ltd. (Xiamen Tongfu), Suzhou Tongfu Super Micro Semiconductor Co., Ltd. (TF-AMD Suzhou), TF AMD Microelectronics (Penang) Sdn. Bhd. (TF-AMD Penang) six major production bases. Through its own development and acquisitions, the company has become a local semiconductor multinational group company, China’s integrated circuit packaging and testing leader, the total number of employees of the group is more than 13,000 .

As a key undertaking unit of the National Major Science and Technology Projects (” 02 “Project), Tongfu Micro-Power has a state-recognized enterprise technology center, national post-doctoral research station, Jiangsu Provincial Engineering Technology Research Center and Advanced Information Technology Research Institute and other high-level research and development platforms, with a technical management team of more than 2000 people .

Tongfu Microelectronics is the first company in the industry to pass ISO9001, ISO/TS16949 and other quality systems. Adopt SAP, MES, equipment automation, EDI and other information systems, which can automatically control the production process according to the personalized specifications of customers, and carry out real-time information exchange with customers. Implement the “Tongfu Micro-electric Industry 4.0” project, comprehensively build a smart factory based on the Internet of Things, establish a flexible automated assembly line, and achieve a win-win situation with customers .

The development goal of Tongfu Microelectronics is to become a world-class integrated circuit sealing and testing enterprise. With the support of national policy and market, the demand of system manufacturers, the coordinated development of industrial chain, and the support of national industry fund and national major projects, Tongfu Micro will continue to march toward the goal of the world-class integrated circuit sealing and testing enterprise .

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Dariusz Czaja

Dariusz Czaja joined TRUMPF Huettinger in 2007, used to work in Poland and Germany. He holds the General Manager position at TRUMPF Huettinger China since 2017. Dariusz Czaja has over ten years working experience in the market management in various industry segments such as Solar, Display, Glass as well as Semiconductor. He studied Electrical Engineering at the Radom University of Technology.

Since from July 2022 until now Dariusz Czaja as Managing Director at TRUMPF Huettinger Asia.

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TRUMPF Huettinger Electronics (Taicang) Co., Ltd.

TRUMPF Hüttinger, headquartered in Germany, is the global market leader for process power, semiconductor, display, and solar supplies.

We are developing, manufacturing plasma power supplies for a wide range of deposition and dry-etch processes. Our products offer best in class uptime, energy efficiency, coating quality and high productivity. TRUMPF Hüttinger has sales and service subsidiaries in Asia, Europe and America.

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