14:25 – 14:30
Advanced Silicon Wafers for Optimized MEMS and RF Device Performance
Advanced silicon wafers can greatly improve MEMS and RF device performance and precision, and they can also effectively remove some of the burden in the front-end operations.
Bonded Silicon-On-Insulator (SOI) wafers’ high degree of device layer specification flexibility and high thickness uniformity drive for improved MEMS device performance and precision, design freedom and miniaturization. The use of hermetically sealed structures enabled by Cavity SOI (C-SOI®) wafers also enable more streamlined MEMS manufacture and cost-savings.
High resistivity wafers with highly efficient trap-rich layer and optional ultra-flat wafer geometries provide optimized wafer solution even for the most demanding RF filter and device requirements. They enable RF filters to reach superior performance in terms of very low second harmonics and IMD3 levels, low insertion losses and excellent Q values.
Dr. Atte Haapalinna
Okmetic Oy
Dr. Atte Haapalinna is chief technical officer at Okmetic, the leading supplier of advanced silicon wafers. He has published two dozen papers on various applications of advanced silicon substrates, silicon damage characterization and silicon photodetectors. Dr. Haapalinna has been with Okmetic since 1998, holding various positions including senior vice president of products, senior vice president of customer support and senior manager of new business development. He has participated in development of C-SOI® wafers, ultra-low resistivity wafers for power devices and engineered high resistivity wafers for RF filters and devices. Dr. Haapalinna received his Ph.D. at the Helsinki University of Technology (now Aalto University), Finland.
Company Profile
Okmetic, established in 1985, is the 7th largest silicon wafer manufacturer in the world. The company specializes in 150-200 mm silicon and SOI wafers, serving power, MEMS, and RF device industries. Okmetic is a key player in the power device sector, offering optimized silicon wafers for discrete power devices, power management applications, and GaN growth.
Okmetic has worldwide sales organization and headquarters located in Finland, where the majority of its silicon wafers is manufactured. The company’s fab expansion set to be operational in early 2025 will increase 200 mm wafer capacity significantly. Okmetic operations are certified under ISO 9001:2015, ISO 14001:2015, and IATF 16949:2016, highlighting its commitment to quality and sustainability.
Company Products & Services
Okmetic is the leading supplier of advanced, high value-added silicon wafers for the manufacture of MEMS and sensors, RF filters and devices as well as power devices. We have the most extensive 150 to 200mm wafer portfolio in the market comprising of comprehensive lines of SOI wafers and High Resistivity RFSi® wafers as well as Patterned wafers, SSP and DSP wafers, TSV wafers, Wafers for Power devices and GaN-on-Si applications.
Okmetic’s silicon wafers are tailored to the customer’s product, process and technology needs, and produced in volume production. This ensures optimum wafer performance leading to multiple customer benefits: increased device performance and functionality, more advanced design possibilities, improved yield as well as streamlined and cost-effective manufacturing. Our silicon wafer solutions can be found e.g. in smartphones, portable devices and automotive electronics, and they support applications related to industrial process control, healthcare, the Internet of Things, and power and efficiency improvement.
