13:40 – 14:00
AI-driven Advanced Packaging – trends, market view and a Japanese perspective
This presentation examines genAI’s impact on the semiconductor industry with a focus on advanced packaging, from 2.5D (HBM) to emerging 3D (logic–memory stacking), hybrid bonding, glass-core, etc.
Dimitrios Damianos Ph.D.
Yole Group
Dimitrios Damianos is a Senior Manager for Consulting Services at Yole Group.
With over 10 years of experience in the fields of nanotechnology, semiconductors, market research and strategy consulting, Dimitrios provides strategic insights and tailored solutions/consulting projects to clients across the whole semiconductor value chain and emerging technologies, and is also responsible for commercial & customer relationships.
Dimitrios has successfully managed and authored multiple market reports and client projects, including market analysis, competitive intelligence, marketing/go-to-market studies, technology assessments, strategy, Due Diligence and tech M&A for clients ranging from startups and R&D institutes to Fortune 500 companies and governments.
He holds a BSc in Physics and MSc in Photonics, as well as a PhD in optics & microelectronics.
Yole Group
Company Profile
Yole Group is a leading international market research and strategy consulting firm, delivering in-depth analyses across market trends, technology developments, teardowns, and reverse costing. Leveraging deep semiconductor expertise, its team of analysts also provides custom consulting services, offering strategic, technical, and market insights tailored to address specific business challenges and opportunities.
