- 16:25 – 16:30
AICS Solutions to High Value Problems
The “More than Moore” era is upon us, as manufacturers increasingly turn to back-end advances to meet the next-generation device performance gains of today and tomorrow. In the advanced packaging space, heterogeneous integration combines multiple chips with different functionalities and from different silicon nodes inside one package, ranging in size from 75 mm x 75 mm to 175 mm x 175 mm. But as with any new technology, heterogeneous integration comes with its own set of unique challenges for advanced IC substrates. The large package size reduces the number of units per panel, making the panel yield of paramount importance. In addition, with the increasing number of RDL layers, alignment shift per buildup step, due to the process induced substrate distortion can lead to a steady overlay drift and increase the RDL total interconnect length to a point where it exceeds the resistance specification. Solutions to these high value problems will be the subject of this talk.
For more than 35 years, Keith Best has held a range of semiconductor processing and applications positions for both device manufacturing and capital equipment companies, of which 13 years were with ASML where he held the position of Director, Applications Engineering. Most recently, Keith was Advanced Packaging Process Development Engineering Manager at SkyWater Florida. He is currently the Director of Product Marketing, Lithography, at Onto Innovation supporting the JetStep® advanced packaging lithography stepper. Keith holds a B.Sc. Honors Degree in Materials Science from the University of Greenwich, UK. He has numerous publications and holds 22 US patents in the areas of photolithography and process integration.
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Un-patterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization.
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