• 16:45 – 16:55

Challenges and Solution of FLI Technologies in various HI Packaging Architetures

“More Than Moore” with heterogeneous integrated Chiplets in different Advanced Packaging Architectures are continuously being developed in our Industry.

Along the development of these Advanced Packaging Architectures with the objectives of delivering the same or even better device performance as if it is in System On Chip (SOC), while at the same time of achieving the best cost of making, it brings challenges to advanced packaging engineer. ASMPT, being the total interconnect solution provider, has determined to collaborate with our customers and partners to overcome these challenges and offer the best-in-class interconnect equipment solutions to address their needs in a timely manner.

ASMPT is aiming to be a Total Interconnect Solution supplier establishing the widest product portfolio in Advanced Packaging Technology, from with thin film interconnect, to first level (die to wafer & substrate) as well as broad level interconnect (package to PCB). I am happy to share more with this presentation.

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Nelson Fan

VP, Head of KPU Advanced Packaging

ASMPT Limited

Nelson, VP of Business Development, Advance Packaging Technology focuses on High Precision Bonding and “Pick & Place” Solutions for Advanced Packaging. He has worked for more than 30 years in Semiconductor Packaging Industry. Prior to joining ASMPT, he held multiple senior management roles in R&D and manufacturing in both OSAT and design house. He has more than 40 US patents in semiconductor packaging technologies. Nelson holds a Bachelor degree in the field of Electrical Engineering from the University of Colorado at Colorado Springs, USA.

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ASMPT, founded in 1975, is headquartered in Singapore and is listed in Hong Kong Stock Exchange since 1989.

ASMPT is the only company in the world that offers high-quality equipment for all major steps in the electronics manufacturing process – from carrier for chip interconnection to chip assembly and packaging to SMT. No other supplier offers a comparable range and depth of process expertise.

Semiconductor Solutions Segment Business of ASMPT offers a diverse product range from bonding to molding and trim & form to the integration of these activities into complete in-line systems for the microelectronics, semiconductor, camera modules, advanced packaging, photonics, and optoelectronics industries.

The group has successfully established itself as the leading player in the back-end assembly and packaging market with its innovative solutions and constant focus on customer value creation.

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