09:20 – 09:40

Chiplets and Advanced Heterogeneous Integration

With the ever-increasing demand for computing performance for mobile, IoT, AI, Big Data and automotive applications, the need for new solutions is growing due to the slowdown of Moore’s Law and computing power solutions. Heterogeneous integration is one of the key platforms to enable higher bandwidth and density for HPC and AI systems. This presentation will discuss how chiplets and advanced heterogeneous integration are enabling next generation computing.

Dr. Terry Wu photo

Dr. Terry Wu

Director

Samsung Electronics