• 09:20 – 09:40

Chiplets and Advanced Heterogeneous Integration

With the ever-increasing demand for computing performance for mobile, IoT, AI, Big Data and automotive applications, the need for new solutions is growing due to the slowdown of Moore’s Law and computing power solutions. Heterogeneous integration is one of the key platforms to enable higher bandwidth and density for HPC and AI systems. This presentation will discuss how chiplets and advanced heterogeneous integration are enabling next generation computing.

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Dr. Terry Wu photo

Dr. Terry Wu

Director

Samsung Electronics

Dr. Wu is currently working as Director of Business Development Team, AVP, Samsung Electronics. Prior to joining Samsung, he was CTO of Chengdu ESWIN System IC. He had also held several key positions in SJSemi and TSMC. Wu received DPhil in Inorganic Chemistry from Oxford University, and MS & BS degree in Chemical Engineering from National Taiwan University & National Chung Hsing University, respectively. Dr Wu was granted several awards in recognition of his contribution in Advanced Packaging, including 2018 Jiangshu Innovative & Entrepreneurial Talent Award, 2019 Wuxi Taihu Talent Award, 2021 Chengdu Golden Panda Talent Program, and 2022 CSTIC Best Young Engineer Award from SEMICON China. He has 14 journal and conference papers, with over 680 citations and H-index of 11. He also holds 40 US patents and 144 China patents on microelectronic packaging.

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Samsung Electronics Co., Ltd. engages in the manufacturing and selling of electronics and computer peripherals. The company operates through following business divisions: Consumer Electronics, Information Technology & Mobile Communications and Device Solutions. The Consumer Electronics business division provides cable television, monitor, printer, air-conditioners, refrigerators, washing machines and medical devices. The Information Technology & Mobile Communications business division offers handheld products, communication systems, computers and digital cameras. The Device Solutions business division comprises of memory, system large scale integrated circuit and foundry. The company was founded on January 13, 1969 and is headquartered in Suwon, South Korea.

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