• 09:45 – 10:05

Chiplets and System Integration – Key Concepts and Implementation

In this presentation, Jianmin Li, Director of R&D at Amkor Technology – China, discusses the key concepts and implementations of chiplets and system integration. Li highlights the strong trends in chiplets and heterogeneous integration products, which offer new ways to achieve innovative product architectures while maintaining optimal Performance/Power/Area/Cost (PPAC) ratios for the future of the industry. Li emphasizes the need for advanced IC packaging capabilities to support these approaches, and notes that OSATs and Foundries are actively responding to enable this integration.

The presentation emphasizes the importance of starting with a 2D module and augmenting it with 3D as necessary for enhanced performance and differentiation. Additionally, Li mentions Amkor’s involvement as a contributor member of the UCIe™ ecosystem, which aims to define next-generation computing standards. Overall, this presentation provides valuable insights into the evolving landscape of chiplets and system integration, positioning the speaker as a seasoned professional in the field.

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Jianmin Li photo

Jianmin Li

Packaging R&D Director, Amkor Technology China, Inc.

Amkor Technology, Inc.

Jianmin joined Amkor in 2013, and is currently packaging R&D director in Amkor Assembly & Test (Shanghai) Co. Ltd, responsible for developing various package type including memory SCSP, flip chip package, SiP and optical sensor packages. He has more than 20 years of experience in assembly process engineering area. Prior to joining Amkor, Jianmin was an assembly process engineer in Intel and IBM. He holds a Master degree in Material Engineering from Fudan University.

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