Vehicle electrification, autonomous driving, renewable energy and big data are enabling unprecedent changes in human life, and are pushing the technology to new limits. Those major evolutions require power electronics and sensing solutions, driven by optimum technology and packaging solutions to deliver maximum product efficiency.

This talk will review recent progress in front end technology , packaging (discrete, power modules) and highlight the importance of system integration.

It will illustrate the challenges of simultaneously meeting a wide range of power density, product scalability , cost and reliability requirements, and are made possible by the ongoing progress in semiconductor research, engineering and manufacturing.