13:45 – 14:05
Memory and Processors for Chiplet Designs
Recent application of AI drives strong demand for HPC chip, and in the latest technology, 2.5D& 3D package solution provides the best electrical performance for these type chips; In this presentation, speech will focus on the CHIPLET design challenge which focus on the HBM& Logic chip multi connection.
Simon Zhang
Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd.
VP of JSSI with 20+ years R&D and PM experience in advanced package area, full global OSAT operation experience. He holds more than 25+ patents in 2.5D PKG area and worked in global enterprise like SPIL, TI.
Company Profile
JSSI, registered in Sep’2020 in Nanjing，Jiangsu Province, P.R.C, and factory located in the same industry park with TSMC-12inch Nanjing Plant. JSSI business focus on Semiconductor Assembly & Test service including Bumping/WLCSP/eWLB/WB-FCQFN/LGA/BGA/2.5D package solution. JSSI core management and R & D team worked in advanced package area more than 20 years, and company committed to provide first-class technology services for customers; JSSI factory has 1700+ employees and obtained ISO9001, QC080000, ISO14001, ISO27001，TS16949 and other system certifications. JSSI R&D team worked with several key GPU/CPU design house to focus on the 2.5D PKG design and test vehicle sample manufacturing now.
