• 15:55 – 16:05

Not All Nanograined Copper Is Created Equal

Previously we have demonstrated that electroplated copper could be engineered to have microstructures at um and nm scales. This paper shows that not all nanograined copper is created equal. Through systematic investigations, significant insight is obtained into the necessary conditions to create a stable nanograined copper that meets the following criteria: 1. microstructure stable over 9 months at ambient storage conditions, 2. textures of the electrodeposited copper do not depend on substrate types and their textures, 3. grain growth increases to micron scale at temperatures above 150 C. Furthermore, we shall introduce a concept of nanograin threshold in the context of RT microstructure stability.

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Dr. Yun Zhang photo

Dr. Yun Zhang

Founder & CEO

Shinhao Materials

Dr Yun Zhang, founder and CEO of Shinhao Materials LLC, has been active in materials innovation, R&D, marketing and sales for over 28 years, holding 34 granted patents, and numerous peer-reviewed journal publications and awards. She started her career at AT&T Bell labs in 1994, carrying out materials research and development. Her work on tin whisker growth won international recognition for demonstrating experimentally for the first time its driving force and for developing mitigation solutions. In 2002, she was appointed global R&D director by Cookson Electronics Enthone for its electronics business. In the subsequent 10 years, her insight and leadership in fundamental understanding of electrodeposition process at a molecule level, combined with a deep appreciation of technology trends and customer needs has won Dr. Zhang many friends and willing partners at top tier equipment manufacturers and key customers. Those close and collaborative partnerships resulted in win-win to all parties for RDL, copper pillar and TSV plating. She received a BS in chemistry from Nanjing University, and a PhD in chemistry from Brown University.

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Shinhao Materials LLC is located in Suzhou China. Its mission is to invent and produce new materials to meet the ever-changing needs of the semiconductor industry, to service its customers in timely and cost-effective way. Being technology heavy, asset light, it has focused on technology innovation. Through its relatively short life, it has developed several unique classes of copper plating additives that have shown to be effective in addressing electrical, thermal, and stress challenges we are facing today. Its IntraCu® products are patent-protected in US, Korea, Taiwan and mainland China. In 2019, Shinhao Materials formed a strategic partnership with Umicore EP to sell and service its customers better internationally.

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