27-28 August 2025
Suwon
14:40 – 15:20
Opportunities and Challenges for Power Semiconductor Industry. How can Taiwan Supply Chain Help?
Moderator
Andy Chuang
Mr. Chuang received his M.S. degrees in Electrical Engineering of National Tsinghua University. After graduated, he joined UMC R&D to start his professional career. Starting from R&D to give him sold knowledge in wafer manufacturing. Technical Marketing let him connect wafer manufacturing and product application jointly. Gradually involving sales and expat to Europe to manage key customers. Completely training to make him realize wafer business and supply chain. After UMC, he joined EDA vendor, Synopsys. This experience helped him connecting chip design to wafer manufacturing. After that, he joined CSMC in China as VP of marketing and sales. He led company to have creative ideas to customize BCD processes targeting to specific application and won the China market, such as Class A/B, Class D, Charger, PMIC, LED display, and LED lighting. In 2013, he joined Episil, started business in compound semiconductor (SiC and GaN-on-Si). He is the one who run both SiC and GaN-on-Si at the same, and delivered supreme manufacturing cycletime, production yield to customers. He started new career in GaN Systems from 2022. GaN Systems is a trusted company which can deliver GaN devices to Automotive and High Rel application. GaN Systems enables power conversion companies to revolutionize their industries and transform the world.
Panelist
Walter Chen
Amkor Technology, Inc.
Walter joined Amkor in 2020 and currently serves as Senior Vice President of Sales & Marketing for Greater China. Before Amkor, he spent 17 years at Cree, Inc., where he was Vice President of Global LED Chips Marketing and LED Component Marketing for Asia. He also represented Cree as a Board member at Lextar. Walter’s career includes 6 years at an IC design house, bringing his total semiconductor industry experience to 28 years, primarily in Sales & Marketing. He holds a Master’s degree in Engineering Business Management from the University of Warwick, UK.
Company Profile
Amkor Technology, Inc. is the world’s largest US headquartered OSAT (outsourced semiconductor assembly and test). Since its founding in 1968, Amkor has pioneered the outsourcing of IC packaging and test services and is a strategic manufacturing partner for the world’s leading semiconductor companies, foundries, and electronics OEMs. Amkor provides turnkey services for the communication, automotive and industrial, computing, and consumer industries, including but not limited to smartphones, electric vehicles, data centers, artificial intelligence and wearables. Amkor’s operational base includes production facilities, product development centers and sales and support offices located in key electronics manufacturing regions in Asia, Europe and the United States. Learn more at https://amkor.com
Panelist
Ian Chan
Cyntec
Education
Professional Experience:
Company Profile
Since 1991 Cyntec’s team of scientists and engineers have been known to lead the way in the research and development of the miniaturized and highly integrated products and solutions. The product lines consist of magnetic components, passive components, power modules, RF & optical modules which serve the client, cloud computing equipment, automotive, IOT, industry, and other market segments.
Using our insight into market trends and the in depth knowledge of electronic materials and processes, we have been able to produce a wide variety of products with the highest levels of performance, high power handling, high density packaging and tight accuracy.
Panelist
Stephen Coates
GaN Systems
Stephen has previously held executive level engineering & operations roles in silicon & compound semiconductor & displays technology companies including VP Operations at DigiLens, VP Operations at Symmorphix Thin Films Inc, VP Operations at Fultec Semiconductor Inc/Bourns & VP Production Engineering at MaxQ Technology heading up power module design & manufacture. A seasoned technology executive with 30 years’ experience in engineering, manufacturing operations, supply chain management and quality. Stephen has substantial experience in establishing and developing strategic supply chain relationships to support full product commercialization and high volume manufacturing, while also being an expert in device packaging, process development and integration. Stephen also previously held lead assessor qualifications for 3rd party audit to ISO 9000 & equivalent standards (eg TS16949/AS9100).
Panelist
Wei-Chung Lo, Ph.D
Industrial Technology Research Institute (ITRI)
Dr. Lo received his Ph.D. from National Taiwan University and joined Industrial Technology Research Institute to work in advanced electronic packaging, such as WLP, 3D IC/3D stacking, fan-out, heterogeneous integration technology for more than 20 years, 85 papers and 40 patent granted. Currently, he also serves as TWG chair of IoT Chapter of IEEE Heterogenous Integration Roadmap(HIR) and chairman of International Microelectronics Assembly and Packaging Society (IMAPS)-Taiwan chapter.
Company Profile
ITRI is a world-leading applied technology research institute with more than 6,000 outstanding employees. Its mission is to drive industrial development, create economic value, and enhance social well-being through technology R&D. Founded in 1973, it pioneered in IC development and started to nurture new tech ventures and deliver its R&D results to industries. ITRI has set up and incubated companies such as TSMC, UMC, Taiwan Mask Corp., Epistar Corp., Mirle Automation.