- 13:45 – 14:35
Panel Session: Standardization for Chiplet / Advanced Packaging
Dr. Kuan-Neng Chen is Chair Professor of Institute of Electronics in National Yang Ming Chiao Tung University (NYCU) in Taiwan. He received his Ph.D. degree in Electrical Engineering and Computer Science, and M.S. degree in Materials Science and Engineering, both from Massachusetts Institute of Technology (MIT). He was Vice President for International Affairs and Associate Dean of International College of Semiconductor Technology in NYCU, Program Director of Micro-Electronics Program in National Science and Technology Council in Taiwan, and a Research Staff Member at IBM Thomas J. Watson Research Center.
Dr. Chen is the recipient of IEEE EPS Exceptional Technical Achievement Award, IMAPS William D. Ashmon – John A. Wagnon Technical Achievement Award, National Industrial Innovation Award, MOST Outstanding Research Award (2 times), MOST Futuristic Breakthrough Technology Award, NSTC Futuristic Breakthrough Technology Award, NCTU Distinguished Faculty Awards, NYCU/NCTU Outstanding Industry-Academia Cooperation Achievement Awards (7 times), Pan Wen Yuan Foundation Outstanding Research Award, CIE Outstanding Professor Award, CIEE Outstanding Professor Award, and IBM Invention Achievement Awards (5 times). He has authored more than 300 publications, including 3 books and 67 book chapters, and holds 87 patents. He was Guest Editor of MRS Bulletin and IEEE Transactions on Components, Packaging, and Manufacturing Technology. He served as General Chair of IEEE IITC and Program Co-Chair of IEEE IPFA, and committee member of IEDM, IEEE 3DIC, IEEE SSDM, IEEE VLSI-TSA, and IMAPS 3D Packaging. Dr. Chen is a Fellow of National Academy of Inventors (NAI), IEEE, IET, and IMAPS, and a member of Phi Tau Phi Scholastic Honor Society.
In addition to his faculty position, Dr. Chen is Specially Appointed Professor of Tokyo Institute of Technology (Tokyo Tech) and Adjunct R&D Director in Industrial Technology and Research Institute (ITRI). Dr. Chen’s current research interests are three-dimensional integrated circuits (3D IC), advanced packaging, and heterogeneous integration.
NYCU was founded on the idea that, in a great university, people work across the disciplines to solve real-world problems. At our university, putting this idea into practice requires integrating Chiao Tung’s strengths in information and communications technology with Yang Ming’s strengths in biomedical research. It also requires contributing to fields located at the intersection of these research areas, for example, digital medicine and bioinformatics. And it requires training our students in such a way that the next generation will not be as constrained by disciplinary boundaries as the previous one.
At NYCU, we are striving to be a great university that transcends disciplinary divides to solve the increasingly complex problems that the world faces. We will continue to be guided by the idea that we can achieve something much greater together than we can individually. After all, that was the idea that led to the creation of our university in the first place.View Full Profile
Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier last year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.
TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.View Full Profile
Walter joined Amkor in 2020 and is currently Sr. Vice President responsible for Sales & Marketing in Greater China. Prior to joining Amkor, Walter worked for Cree, Inc 17 years as a position for VP of LED Chips Marketing WW & LED Component Marketing in Asia. Also as a Board member of Lextar representative for Cree. Prior to Cree, he had 6 years of IC design house experience. He has 29 years of Semiconductor industry experience in total, focused on Sales & Marketing field. He holds a Master degree of Engineering Business Management from University of Warwick in UK.
As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.
We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.
As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.View Full Profile