15:30 – 15:40
Plating of Through-Glass-Vias
玻璃通孔电镀
The IC substrate industry is the foundation of the semiconductor ecosystem, with its innovation and advancements directly affecting the performance, reliability, and efficiency of electronic products. Glass Through-Via (TGV) technology is one of the most promising advancements in this field, offering high electrical performance, improved thermal management, and significant miniaturization potential. However, achieving these advantages entails numerous technical and manufacturing challenges. Glass, as a substrate material, has excellent electrical insulation, low dielectric constant, and better CTE values compared to organic cores, but its brittleness presents significant challenges. Ensuring the mechanical integrity of glass substrates throughout the stages of via formation, metallization, and subsequent stacking requires innovative methods and precise control of processing parameters.
Marcus Elmar Lang
Simetric Semiconductor Solutions Co., Ltd.
Mr. Marcus Elmar Lang, co-founder and CTO of Simetric Semiconductor Solutions, has over 30 years of expertise in PCB and IC substrate manufacturing. Holder of 20+ inventions and several technology awards, he played a leading role in enabling mass production of 9/12μm substrates at a top IC substrate company. He has also provided key process support to global equipment manufacturers and, together with a major OEM, successfully advanced Panel Level Packaging (PLP) technology into industrial production.
Simetric Semiconductor Solutions Co., Ltd.
Company Profile
Simetric Semiconductor Solutions Co., Ltd., founded in June 2020 and headquartered in Shenzhen, is a high-tech enterprise dedicated to advanced IC manufacturing. The company focuses on electrochemical deposition (ECD), etching, and micropore processing equipment, and has independently developed cutting-edge electroplating and etching technologies. With proven capabilities in 5-micron fine line electroplating, TGV precision hole filling, and micro copper pillar processes, Simetric has successfully introduced corresponding mass production equipment. As an independent Chinese enterprise, the company provides comprehensive solutions that integrate both equipment and process technologies, serving customers in domestic and international markets.
The IC substrate industry plays a critical role as the foundation of the semiconductor ecosystem. Its technological innovations directly impact the performance, reliability, and efficiency of electronic products. Within this field, Glass Through-Via (TGV) technology represents one of the most promising advancements, enabling superior electrical performance, enhanced thermal management, and significant miniaturization potential. At the same time, TGV presents unique challenges due to the brittle nature of glass substrates. Ensuring mechanical integrity throughout via formation, metallization, and stacking requires precise process control and innovative engineering approaches—areas where Simetric continues to deliver industry-leading expertise and solutions.
Company Products & Services
Founded in 2020 and headquartered in Shenzhen, Simetric is a high-tech enterprise specializing in advanced IC substrate manufacturing solutions. The company focuses on electrochemical deposition (ECD), etching, and micropore processing, with proven expertise in 5-micron fine line electroplating, Through-Glass Via (TGV) precision hole filling, and micro copper pillar processes.
Simetric designs and develops mass production equipment alongside proprietary process technologies, enabling customers to achieve high-yield, high-reliability manufacturing. Its integrated solutions cover the full chain from equipment innovation to process optimization, supporting both domestic and international clients in scaling next-generation IC substrates.
With TGV and advanced substrate technologies at the core, Simetric is helping drive miniaturization, improved electrical performance, and thermal efficiency in semiconductor packaging. By combining independent R&D with deep process know-how, the company continues to deliver breakthrough solutions that strengthen the global semiconductor ecosystem.
