Bret Street has over three decades of semiconductor packaging experience. He currently holds over 165 issued U.S. patents. He currently serves as Senior Director of Advanced Packaging Technology Development at Micron Technology Inc. in Taiwan. His team focuses on advanced packaging solutions to enable current and future Micron products like Micron’s industry-leading HBM3e and future HBM/Heterogeneous-enabled products. Over his career, Bret has served in technical leadership roles across Assembly, Test, Probe, Product Engineering, and Advanced Package Technology Development. His packaging solutions span Flip Chip, Imager, 3D TSV, Logic/Memory (HMC), High Bandwidth HBM2e, and HBM3e products. Bret has developed a broad skill set enabling products from the design, development, manufacturing, and mass production stages.