09:00 – 09:30
Keynote
Unleash Product Innovations with 3DFabric
With the development of 3DIC and associated packaging technologies, semiconductor industry has extended performance and density optimization to system level, complementary to traditional chip scaling. Amid broader adoption of TSMC’s advanced 2.5D/ 3D packaging solutions along with growing chiplet complexity and form factor, the interaction between Si, packaging and components become increasingly crucial and requires continue innovations on design, process development and manufacturing.
With 3DFabric Alliance, we are extending OIP collaboration to packaging/ testing and working with industry partners on substrate and memory technology development for integrated system-level design solution to customers, together with the ecosystem of OSATs, material and equipment suppliers. In parallel, we also establish the worldwide first fully automated factory to offer best flexibility for our customers to optimize their packaging solution with better cycle time and quality control.
Dr. Jun He
TSMC
Dr. Jun He is Vice President of Quality & Reliability as well as Advanced Packaging Technology & Service at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). His responsibility spans across TSMC foundry eco-system and the Company’s backend business and operations management. Within the Q&R scope, his function covers incoming materials qualification, reliability and certification of new process technology & design IP, manufacturing quality as well as enabling customers for their product qualification and ramp. Besides overseeing all TSMC advanced packaging and testing manufacturing, his backend team is also accountable for key building blocks including bump/passivation/RDL process innovations and test technology development. Seamless collaboration and joint development with external partners across material, OSAT and substrate supply chain is one of his focus areas to enable customers’ product innovations at system level.
Prior to joining TSMC, Dr. He was a senior director at Intel Corporation, leading overall quality and reliability of process technology development and manufacturing. His scope included research & development of Si, advanced packaging and test along with Intel worldwide manufacturing operations.
Dr. He holds over 40 patents globally and published 50 papers in international conferences and peer-reviewed technical journals. He received his B.S. degree in Physics and Ph.D. in Materials Science from University of California, Santa Barbara.
Company Profile
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,878 products for 522 customers in 2024 by providing the broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
