With the development of 3DIC and associated packaging technologies, semiconductor industry has extended performance and density optimization to system level, complementary to traditional chip scaling. Amid broader adoption of TSMC’s advanced 2.5D/ 3D packaging solutions along with growing chiplet complexity and form factor, the interaction between Si, packaging and components become increasingly crucial and requires continue innovations on design, process development and manufacturing.

With 3DFabric Alliance, we are extending OIP collaboration to packaging/ testing and working with industry partners on substrate and memory technology development for integrated system-level design solution to customers, together with the ecosystem of OSATs, material and equipment suppliers. In parallel, we also establish the worldwide first fully automated factory to offer best flexibility for our customers to optimize their packaging solution with better cycle time and quality control.