• 07:45 – 08:35

Registration

  • 08:40 – 09:00

Welcome Speech

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Salah Nasri photo

Salah Nasri

President

ISES

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International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

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ISES
  • 09:05 – 09:20

Opening Address

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YAB Chow Kon Yeow photo

YAB Chow Kon Yeow

Chief Minister of Penang

Penang State Government

Mr. Chow Kon Yeow is Penang’s fifth Chief Minister. He assumed the State’s top leadership role after Pakatan Harapan’s thumping victory in Malaysia’s 14th General Elections in May 2018. He has also been a Penang State Executive Councilor since 2008.

Born in November 1958, Mr. Chow holds a Bachelor’s degree in Social Sciences (Honours) from the University of Science, Malaysia (USM). He is married to Madam Tan Lean Kee and blessed with two children.

Mr. Chow started out as a journalist before becoming the political secretary of DAP’s former Secretary-General and Member of Parliament for Tanjong, YB Lim Kit Siang from October 1986 to 1990. After winning the Pengkalan Kota state seat in 1990, he became Member of Parliament for Tanjong in 1999. He defended Tanjong for another two terms (2004 and 2008). The 2008 elections, which ushered in the new DAP administration under the then Pakatan Rakyat, also saw him winning the Padang Kota state seat and his appointment as the State Executive Councilor overseeing the Local Government and Traffic Management portfolios.

DAP’s continued triumph in the 2013 elections saw Mr. Chow retaining his Padang Kota constituency. He continued to serve as the State Executive Councilor with Flood Mitigation added to his existing portfolios.

In the historic 14th General Elections, Mr. Chow successfully defended his Padang Kota state seat and won the Tanjong parliamentary seat. He has been the DAP Penang State Chairman since 2000 and DAP National Vice-Chairman since 2004.

In a recent interview after his swearing-in, the fifth Chief Minister of Penang reiterated his administration’s commitment to ensure delivery of three mega projects, namely the Penang Transport Master Plan, flood mitigation and affordable housing. Undaunted by the higher expectations, he takes this as a challenge to serve Penangites and find ways to make this state, a better home for all.

Besides that, Mr. Chow also aims to transform Penang into ‘A Family-Focused Green and Smart State that Inspires the Nation’ with the Penang2030 Vision and this is the current focus of the State Government.

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Coming soon…

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Opportunities in the Southeast Asian Semiconductor Industry

  • 09:25 – 09:55

Panel Discussion: Opportunities & Challenges Arising From the Changing Semiconductor Geopolitical Climate

Moderator
Kamel Ait Mahiout photo

Kamel Ait Mahiout

President

ISES

ISES

Kamel Ait Mahiout is a seasoned professional with over 30 years of experience in the electronics industry. His expertise spans from RF and Microwave engineering to executive roles in prominent companies such as Unity SC and Amkor Technology, where he significantly contributed to the growth and alignment of the businesses with key industry players.

View Full Profile

International Semiconductor Executive Summits (ISES) holds a significant position within the semiconductor industry. Since 2010 we have scaled 8 major successful regional events globally. Our initiatives to date have been fully supported by local governments. For e.g., ISES USA is hosted in partnership with the Greater Phoenix Economic Council, ISES Taiwan is hosted in partnership with ITRI, ISES EU is hosted in partnership with the EU Commission, ISES Southeast Asia in partnership with Invest in Penang. We serve as a platform where senior executives in technology, manufacturing and R&D from various semiconductor companies, technology providers, and related industries gather to exchange information, shape strategies, and discuss the industry’s direction. Our summits have influenced industry trends and decisions due to the high-level discussions that take place.

View Full Profile
Panelist
Wee Seng Ang photo

Wee Seng Ang

Executive Director

Singapore Semiconductor Industry Association (SSIA)

Singapore Semiconductor Industry Association (SSIA)

Wee Seng counts over 20 years of experience in the semiconductor industry, across fab start up, process integration, technology development, yield improvement, manufacturing, equipment engineering, cost management and program management. Helming the SSIA Secretariat team since 2018, Wee Seng has redefined the association’s strategic directions and operations, to better deliver its mission and vision. Embracing a holistic approach to driving business transformation in Singapore and the region, he concurrently sits on several Advisory Committees, such as in Singapore Polytechnic’s School of Electrical and Electronics Engineering (SEEE), the government and industry-backed Industrial Transformation Asia-Pacific (ITAP) platform, as well as ESG’s Smart Manufacturing Technical Committee (SMTC) and Environment and Resources Standards Technical Committee for Energy. Wee Seng holds a Bachelor’s degree in Electrical and Electronics Engineering from Nanyang Technological University and a Masters (MSc) in Management of Technology from National University of Singapore.

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Singapore Semiconductor Industry Association (SSIA) is the voice of Singapore’s semiconductor industry and is committed to support this important sector in Singapore in order to facilitate substantial growth of the whole semiconductor economy of the country. SSIA brings together industry players, academia, and government agencies. Major activities focus on industry and talent outreach and continuing education, as well as to collectively address industry needs. SSIA is a platform for members to reach out to new business opportunities, industry alliances, and partners. It provides networking and relationship opportunities beyond the boundaries of Singapore. SSIA members today include companies and organizations throughout all parts of the complex and comprehensive value chain – IC design companies, Manufacturers, Fabless companies, Equipment suppliers, Photovoltaic and LED companies, EDA and material suppliers. Training and service providers, IP companies, Research institutes and Academia, as well as individual members.

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Panelist
Dato’ Seri Siew Hai Wong photo

Dato’ Seri Siew Hai Wong

President

Malaysia Semiconductor Industry Association (MSIA)

Malaysia Semiconductor Industry Association (MSIA)

Dato’ Seri Wong Siew Hai has 29 years of working experience in the electronics industry. He served Intel for most of his illustrious career and retired from Intel after 27 years of service. His last position with Intel was Vice President of Technology and Manufacturing Group (TMG) and General Manager of Assembly and Test Manufacturing (ATM), responsible for all assembly test factories worldwide. He also served as the Vice President and Managing Director of Dell’s Asia Pacific Customer Centre for approximately 2 years. Currently, Dato’ Seri Wong is involved in the electronics industry as Champion of the E&E Productivity Nexus (EEPN) and President of the newly formed Malaysia Semiconductor Industry Association (MSIA).

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Coming soon…

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Panelist
Siobhan Das photo

Siobhan Das

CEO

American-Malaysian Chamber of Commerce (AMCHAM)

American-Malaysian Chamber of Commerce (AMCHAM)

SIOBHAN DAS Chief Executive Officer American Malaysian Chamber of Commerce Siobhan Das joined the American Malaysian Chamber of Commerce (AmCham Malaysia) as its Executive Director in 2016 and was promoted in 2020 to become the organization’s first Chief Executive Officer in its 43 year history. Siobhan has created an action-oriented policy platform at the Chamber that is designed to address both the strategic concerns of American multinational companies and the tactical day-to-day challenges faced by operations on the ground. By working closely with business leaders and various stakeholders in the Malaysian and U.S. governments, Siobhan has been able to represent the membership and ensure that AmCham Malaysia fulfills its role as the Voice of U.S. Businesses in Malaysia. Siobhan spent 11 years in Shanghai, five of which as a director at AmCham Shanghai. Siobhan is a Sloan Fellow from London Business School with a Masters in Leadership and Strategy; she also holds two undergraduate degrees from Boston University in Broadcasting and Film, and English. She enjoys golf and is still reveling in her first hole-in-one (2023)!

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The American Malaysian Chamber of Commerce (AMCHAM) was founded in 1978 as an international, non-profit, private-sector business association. It comprises more than 1200 members representing about 290 American, Malaysian, and other international companies. The Chamber is a member of the AmChams of Asia Pacific (AAP) a non-governing association of 27 AmChams in the region that come together to support engagement in the Asia Pacific.

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Panelist
Sivasuriyamoorthy Sundara Raja photo

Sivasuriyamoorthy Sundara Raja

Deputy CEO, Investment Promotion and Facilitation

MIDA

MIDA

A Business Administration graduate from the University of Malaya, Sivasuriyamoorthy Sundara Raja joined Malaysian Investment Development Authority (MIDA) in 1989 as an Assistant Director in the Food, Beverages and Chemical Division. Over the last 33 years he had served in the Strategic Planning and Policy Advocacy Division, Investment Promotion Division and Incentive Coordination and Collaboration Office (ICCO). Mr.Siva was posted to Germany twice to head MIDA’s office in Cologne (2006-2009) and Frankfurt (2013-2017). He was responsible to move MIDA’s office from Cologne to Frankfurt and to establish MIDA’s second office in Germany in Munich. As an overseas Director in Germany, Mr.Siva was responsible to attract foreign direct investments from Germany and the Benelux countries, namely Belgium, the Netherlands and Luxembourg. Throughout most of his 33 years career with MIDA, Mr.Siva was involved in various projects on Malaysia’s industrial development, such as the 2nd and 3rd Industrial Master Plans (IMP), 8th-10th Malaysia Plans, equity liberalisation of the manufacturing sector, formulation of investment incentives and policies, and empowerment of MIDA. Mr.Siva was also responsible for the coordination of the Study on Exit Strategy for Foreign Labour Intensive Industries, formulation of policies and guidelines for the establishment of Domestic Investment Strategic Fund (DISF) to accelerate the shift of Malaysian-owned companies in high technology industries, as well as the establishment of One Stop Centre and Business Travellers Centre for Short Term Business Travellers during COVID 19 Pandemic. Mr.Siva was promoted as the Executive Director (Investment Promotion) on 1st November 2018 and moved to his current position as the Deputy Chief Executive Officer (Investment Promotion & Facilitation) effective 1st May 2021.

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MIDA is the government’s principal investment promotion and development agency under the Ministry of Investment, Trade and Industry (MITI) to oversee and drive investments into the manufacturing and services sectors in Malaysia. Headquartered in Kuala Lumpur Sentral, MIDA has 12 regional and 21 overseas offices. MIDA continues to be the strategic partner to businesses in seizing the opportunities arising from the technology revolution of this era.

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  • 10:00 – 11:00

Networking Coffee/Tea Break & Business Meeting

Challenges for SEA to Move Towards Advanced Packaging Technology

  • 11:05 – 11:30

Keynote

Unleash Product Innovations with 3DFabric

With the development of 3DIC and associated packaging technologies, semiconductor industry has extended performance and density optimization to system level, complementary to traditional chip scaling. Amid broader adoption of TSMC’s advanced 2.5D/ 3D packaging solutions along with growing chiplet complexity and form factor, the interaction between Si, packaging and components become increasingly crucial and requires continue innovations on design, process development and manufacturing.

With 3DFabric Alliance, we are extending OIP collaboration to packaging/ testing and working with industry partners on substrate and memory technology development for integrated system-level design solution to customers, together with the ecosystem of OSATs, material and equipment suppliers. In parallel, we also establish the worldwide first fully automated factory to offer best flexibility for our customers to optimize their packaging solution with better cycle time and quality control.

Kam Lee photo

Kam Lee

eputy Head of TSMC Advanced Packaging Technology and Service.

TSMC

Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier last year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.

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TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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TSMC
  • 11:35 – 12:00

Keynote

Future Opportunities: Semiconductors Packaging

Semiconductor is at the heart of future technologies such as data economy, artificial intelligence, autonomous and electrical vehicles and consumer products to name a few. Memory and storage are fueling the growth of these technologies, and there is a need for a portfolio with faster, persistent platforms of mainstream storage for read focus workloads to higher performance mixed-use workloads. Micron is at the forefront of solutions to these challenges with memory innovation and is scaling up to capture future growth opportunities.

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Amarjit Sandhu photo

Amarjit Sandhu

CVP of Assembly and Test, NAND Operations

Micron Technology, Inc.

Mr Amarjit Singh Sandhu is the Corporate Vice President, Assembly and Test NAND Operations for Micron Technology. He has 30 years of Operations Management expertise in locations such as Singapore, China and Malaysia. He currently oversees 4 Assembly and Test captive sites namely in Micron Singapore, Muar (Johor) and Penang engaged in manufacturing NAND and DRAM components, Solid State Devices (SSD) and Memory Modules. He is currently leading the new state-of-the-art Batu Kawan semiconductor plant that will process wafers into semiconductor components and subsequently shipping it out as SSD or Memory Module to major customers worldwide. He has pioneered 4 Green field manufacturing startups in different geographies and led 3 successful turnarounds of matured organizations in the last 10 years in China, Singapore and Malaysia. Amarjit built up his career in the semiconductor industry with Texas Instruments Singapore, United Test and Assembly Center (UTAC), Western Digital Corporation (WDC) prior to joining Micron Semiconductor Asia in 2018. He earned his MBA from the Warwick Business School and Bachelor degree in Mechanical Engineering from the National University of Singapore.

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Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

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Micron Technology, Inc.
  • 12:00 – 13:00

Lunch Break

  • 13:05 – 13:20

Evolution of Manufacturing Factory – From Assembly Test to Advanced Packaging

  • The anticipated growth of Semiconductor Industry by 2030
  • The role of Advanced Packaging to support the scale of Moore’s Law
  • Roadmap for advanced packaging for Intel
  • How is advanced Packaging factory setup different vs traditional Assembly Test Factory
  • Challenges in building a fab in Malaysia
  • Collaboration opportunities for vendors and Malaysia to make the industry more effective and level the playing field
  • Conclusion
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Teng Chow Ooi photo

Teng Chow Ooi

Sr Director Program Office

Intel

Teng Chow joined Intel Disaggregation Manufacturing Operations in 2021 as the Senior Director of the Program Office. In his role, his is responsible for overlooking the start-up of the Advanced Packaging Factory from design review, hiring, supplier readiness, technology transfer to factory operations.

As an industry veteran, Teng Chow has more than 20 years of various experience including FPGA and ASIC IC design, lead Product Test Development engineering and lead automotive qualification for generations of FPGA products. Teng Chow holds a bachelor’s degree on EE engineering from University of Technology Malaysia.

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Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

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Intel
  • 13:25 – 13:40

MIMOS BERHAD Initiatives in Advancing the Semiconductor Industry in Malaysia

Malaysia’s electrical and electronics (E&E) industry, particularly the semiconductor segment, is a vital contributor to exports but lags in its GDP share (6.85%) due to limited high-value activities. The global E&E industry is poised for 6-8% annual growth until 2030, driven by electric vehicles, renewable energy, AI, and smart devices. Malaysia should establish a visionary plan for the E&E sector, aiming for 2-3x GDP growth in the next two decades. This can be achieved by boosting local content, exploring adjacencies like chip design, and emphasizing value-added activities. To succeed, the focus should be on domestic capacity building in areas like design, R&D, and brand ownership, supported by industrial policies, strategic foreign investments, R&D funding, and institutional support. Coordination and policy interventions are crucial to creating an ecosystem conducive to E&E sector growth. In summary, Malaysia needs a long-term vision for the E&E sector emphasizing local content, value addition, and capacity building, supported by coordinated policies and investments

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Thiagesh K Lingam photo

Thiagesh K Lingam

Senior Director

MIMOS

Thiagesh K Lingam is the Senior Director for Industrial Development and Technology Transfer at MIMOS Berhad. He plays a crucial role in engaging the Electrical and Electronics industry in Malaysia and globally. His focus is on facilitating technical and commercial interactions to enhance the industry’s competitiveness. With degrees in Electrical and Electronics Engineering and Materials Engineering from the University of Sunderland, UK, and a Lead Auditor qualification, he brings a strong educational background. Over his 25-year career, Mr. Lingam excelled in IC Design, wafer fabrication, Analytical Services, Product Reliability, Embedded Technology, and Rapid Prototyping, working at Chartered Semiconductor and Hitachi Nippon Steel. His proactive, strategic, and problem-solving skills make him a standout leader in the field.

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MIMOS is a leading innovation center in Semiconductors, Microelectronics, and ICT technologies, operating under Malaysia’s Ministry of Science, Technology, and Innovation (MOSTI). It plays a pivotal role in Malaysia’s socio-economic advancement by developing patentable technology platforms, products, and solutions. With over 1,300 filed patents, MIMOS contributes to Malaysia’s international digital transformation efforts and rebranded as MIMOS Global in 2022. The organization focuses on research excellence in Semiconductor & Thin Film Research, Embedded Microelectronics, Manufacturing, and Smart Nation technologies. MIMOS collaborates with strategic partners, explores new opportunities, nurtures technology ventures, and prioritizes innovation, trust, and high performance.

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MIMOS
  • 13:45 – 14:05

System-level Packaging: Challenges and Solutions

The trend of connecting heterogeneous circuits/subsystems and integrating them into a system using packaging technology has been an ongoing effort in many semiconductor applications, including computing, networking, artificial intelligence (AI), mobile and automotive. In the computing, networking and AI domains, technologies such as chiplets have emerged in the market to achieve increased yield in wafer fabrication. In addition, newpackaging solutions like interposer technologies have been actively developed in semiconductor packaging areas, enabling chiplet device integration in packages. In the mobile sector, as the demand for miniaturization, low power consumption and low cost continues to rise, ongoing systemization efforts are centered around processors, memories, and RF front-end devices. At the same time, efforts to pursue high-speed, high-memory capacities are driven by the emerging market demand for AI services. Finally, automobiles are becoming more of an electronic product than a mechanical one withmany built-in electronic components. Today’s vehicles require a variety of electronic products, such as central processing units (CPUs) for data processing, microcontroller units (MCUs) for powertrain control, sensors for comfort and driving convenience, and power modules for driving motors. Some of these components require systemization. However, automotive components operate in a rugged environment and require a high level of reliability for safe driving, so verified technology and platforms should be implemented in system integration. This presentation will review the technical requirements and challenges that arise during the systemization process for each of these applications and discuss potential solutions.

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Dr. JinYoung Khim photo

Dr. JinYoung Khim

Sr. Vice President Global R&D Strategy

Amkor Technology, Inc.

JinYoung joined Amkor Technology in 2000 and is currently Sr. Vice President, Global R&D Strategy. He has more than 23 years’ experience in semiconductor package development and design including Wafer Level, Flip Chip, and MEMS & Sensors. JinYoung has been awarded thirty-five patents and published fifteen papers on advanced packaging technologies at several industry conferences. He holds a Ph.D. in mechanical engineering from Korea Advanced Institute of Science and Technology (KAIST) in Daejeon, Korea.

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As one of the world’s largest providers of high-quality semiconductor packaging and test services, Amkor has helped define and advance the technology landscape.

We deliver innovative solutions and believe in partnering with our customers to bring 5G, AI, Automotive, Communications, Computing, Consumer, IoT, Industrial and Networking products to market.

As a truly global supplier, Amkor has manufacturing and test capabilities as well as product development and support offices in Asia, Europe and the US.

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Amkor Technology, Inc.
  • 14:10 – 14:40

Panel Discussion: Challenges for SEA to Move Towards Advanced Packaging Technology

Moderator
Fouzun Naseer photo

Fouzun Naseer

Director R&D, Technology, Industry

CREST

CREST

Fouzun Naseer had been involved in semiconductor industry over 30 years with wide ranging experience on assembly, test, packaging, manufacturing systems, quality, reliability, material and supplier management. He was previously at Hitachi Semiconductor and Altera Corporation prior to joining CREST. In his current role, he leads R&D group at CREST, and he is also involved in E&E technology and industry development related to Industry 4.0, IC Design, Smart City and Precision Agriculture. He is often engaged for formulation and advocacy of E&E related eco system and directions for various government agencies.

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Collaborative Research in Engineering, Science and Technology (CREST) established in 2012 to catalyst triple helix collaboration between industry, academia and government on E&E technology and ecosystem development. In over 10 years, CREST also undertake talent development initiatives to support E&E industry. Recently, CREST had become an agency under Ministry of Investment, Trade and Industry.

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Panelist
Kam Lee photo

Kam Lee

eputy Head of TSMC Advanced Packaging Technology and Service.

TSMC

TSMC

Kam is currently the Deputy Head of TSMC Advanced Packaging Technology and Service. He joined TSMC earlier last year in March 2022 from Intel, where he served for 27 years in various roles in technology development, product development and high-volume manufacturing. Previously, he held the role as the Vice President and General Manager in Intel’s product engineering development group. At TSMC, Kam is actively working with his colleagues to advance the TSMC advanced packaging and testing technologies to serve its foundry customers.

View Full Profile

TSMC pioneered the pure-play foundry business model when it was founded in 1987 and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 281 distinct process technologies and manufactured 11,617 products for 510 customers in 2020 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 3-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan.

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Panelist
Amarjit Sandhu photo

Amarjit Sandhu

CVP of Assembly and Test, NAND Operations

Micron Technology, Inc.

Micron Technology, Inc.

Mr Amarjit Singh Sandhu is the Corporate Vice President, Assembly and Test NAND Operations for Micron Technology. He has 30 years of Operations Management expertise in locations such as Singapore, China and Malaysia. He currently oversees 4 Assembly and Test captive sites namely in Micron Singapore, Muar (Johor) and Penang engaged in manufacturing NAND and DRAM components, Solid State Devices (SSD) and Memory Modules. He is currently leading the new state-of-the-art Batu Kawan semiconductor plant that will process wafers into semiconductor components and subsequently shipping it out as SSD or Memory Module to major customers worldwide. He has pioneered 4 Green field manufacturing startups in different geographies and led 3 successful turnarounds of matured organizations in the last 10 years in China, Singapore and Malaysia. Amarjit built up his career in the semiconductor industry with Texas Instruments Singapore, United Test and Assembly Center (UTAC), Western Digital Corporation (WDC) prior to joining Micron Semiconductor Asia in 2018. He earned his MBA from the Warwick Business School and Bachelor degree in Mechanical Engineering from the National University of Singapore.

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Micron is a world leader in innovative memory solutions that transform how the world uses information. For over 40 years, our company has been instrumental to the world’s most significant technology advancements, delivering optimal memory and storage systems for a broad range of applications.

View Full Profile
Panelist
Teng Chow Ooi photo

Teng Chow Ooi

Sr Director Program Office

Intel

Intel

Teng Chow joined Intel Disaggregation Manufacturing Operations in 2021 as the Senior Director of the Program Office. In his role, his is responsible for overlooking the start-up of the Advanced Packaging Factory from design review, hiring, supplier readiness, technology transfer to factory operations.

As an industry veteran, Teng Chow has more than 20 years of various experience including FPGA and ASIC IC design, lead Product Test Development engineering and lead automotive qualification for generations of FPGA products. Teng Chow holds a bachelor’s degree on EE engineering from University of Technology Malaysia.

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Intel (Nasdaq: INTC) is an industry leader, creating world-changing technology that enables global progress and enriches lives. Inspired by Moore’s Law, we continuously work to advance the design and manufacturing of semiconductors to help address our customers’ greatest challenges. By embedding intelligence in the cloud, network, edge and every kind of computing device, we unleash the potential of data to transform business and society for the better.

To learn more about Intel’s innovations, go to newsroom.intel.com and intel.com.

View Full Profile
Panelist
Thiagesh K Lingam photo

Thiagesh K Lingam

Senior Director

MIMOS

MIMOS

Thiagesh K Lingam is the Senior Director for Industrial Development and Technology Transfer at MIMOS Berhad. He plays a crucial role in engaging the Electrical and Electronics industry in Malaysia and globally. His focus is on facilitating technical and commercial interactions to enhance the industry’s competitiveness. With degrees in Electrical and Electronics Engineering and Materials Engineering from the University of Sunderland, UK, and a Lead Auditor qualification, he brings a strong educational background. Over his 25-year career, Mr. Lingam excelled in IC Design, wafer fabrication, Analytical Services, Product Reliability, Embedded Technology, and Rapid Prototyping, working at Chartered Semiconductor and Hitachi Nippon Steel. His proactive, strategic, and problem-solving skills make him a standout leader in the field.

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MIMOS is a leading innovation center in Semiconductors, Microelectronics, and ICT technologies, operating under Malaysia’s Ministry of Science, Technology, and Innovation (MOSTI). It plays a pivotal role in Malaysia’s socio-economic advancement by developing patentable technology platforms, products, and solutions. With over 1,300 filed patents, MIMOS contributes to Malaysia’s international digital transformation efforts and rebranded as MIMOS Global in 2022. The organization focuses on research excellence in Semiconductor & Thin Film Research, Embedded Microelectronics, Manufacturing, and Smart Nation technologies. MIMOS collaborates with strategic partners, explores new opportunities, nurtures technology ventures, and prioritizes innovation, trust, and high performance.

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Panelist
Charng Yee Heng photo

Charng Yee Heng

CEO

Globetronics

Globetronics

Heng Charng Yee is the CEO of Globetronics Technology Berhad. For the past 10 years, she led technology roadmap, product developing, quality and efficiency innovation in the organization’s fastest growing optoelectronics segments. Charng Yee held various role in global strategy, regional expansion and operations, digitalization and operation excellence during her tenure in Tyco Fire and Security. She is current the committee member of FREPENCA and FMM as well as the Industrial Advisor for the Faculty of Business and Finance of UTAR ( University Tunku Abdul Rahman).

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Globetronics Technology Berhad provides Design, Development and Outsource Semiconductor Assembly and Test services. Product portfolio include highly miniaturised optoelectronics, sensors, IC devices and timing devices for mobile, networking, automotive and emerging medical segments. The company is collaborating with leading technology partners in the areas of wafer level packaging, silicon photonics and wafer level MEMS.

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Exploring Innovations and Growth in the SEA Semiconductor Industry – Competitive Advantages & Challenges

  • 14:45 – 15:05

Western Digital’s Semiconductor Odyssey: Charting a Course for Innovation and Business Growth

The semiconductor industry in Southeast Asia (SEA) has undergone significant expansion in recent years, establishing itself as a prominent player in the global tech arena. With the continued surge in demand for semiconductors, SEA stands poised to maintain its pivotal role in this ever-evolving industry. This presentation offers an insightful exploration of Western Digital’s remarkable journey, beginning as a start-up with vertically integrated Solid State Drives (SSD) manufacturing facilities, and charts the course it envisions for future advancements in manufacturing excellence.

Furthermore, this presentation delves into Western Digital’s pioneering efforts in harnessing Industry 4.0 capabilities, marked by automation and data analytics, solidifying its status as the inaugural World Economic Forum’s Lighthouse factory in the region. It underscores the paramount importance of innovation within Western Digital’s growth strategy, and addresses the challenges it encounters on this transformative path.

A forward looking approach extends beyond traditional manufacturing embracing a holistic vision that encompasses capabilities in the area of product design and advanced packaging. This presentation underscores the company’s commitment to nurturing talent and resources to ensure a sustainable future in a rapidly evolving industry landscape.

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YT Chin photo

YT Chin

Senior Director, Flash Backend Engineering

Western Digital

Dr. YT Chin is a seasoned executive leading Western Digital SSD Operations in Batu Kawan, Penang. With 27 years of experience in Manufacturing and R&D, specializing in Advanced Packaging, Package Development, and Operations in the semiconductor industry, he is recognized for his expertise. Dr. Chin’s passion for advancing manufacturing in the Industry Revolution 4.0 era earned him the prestigious WEF Global Lighthouse award. He is a Chartered Engineer and Chartered Scientist, known for successfully delivering complex technical programs in advanced packaging. As a speaker, Dr. YT Chin brings valuable insights into advanced packaging, manufacturing, and the transformative potential of Industry Revolution 4.0. YT Chin holds the titles of Chartered Engineer, Chartered Scientist and a Fellow of IOM3 (uk).

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Western Digital Corporation is an American data storage company renowned for its innovative solutions. With a wide range of products including hard drives, solid-state drives, and data center solutions, Western Digital prioritizes data security and protection, consistently pushing the boundaries of storage technology to meet evolving customer needs.

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Western Digital
  • 15:10 – 15:30

Exploring Innovations and Growth in the SEA Semiconductor Industry – Competitive Advantages & Challenges

In the semiconductor value chain, ASEAN countries have always played the role of OEM production hubs focusing on cost and mature technologies. Shifting from this role to a technology powerhouse involves a huge leap that requires the creation of a vibrant R&D environment (such as those found in Japan, Taiwan, South Korea and China who have recently achieved). This kind of R&D environment typically involves high capital expenditure, intense technology knowledge and a pool of highly educated talents that usually define the completeness of the whole supply-chain (for instance and it does not only apply for IC Design). On this note, ASEAN countries shall then concentrate their limited resources in covering this all-round industrial chain integrity (from infrastructure to talents). Our suggestion is therefore to focus on not only clustering regional readiness (for instance the infrastructure and the talents) but also on chocking points of the semiconductor value chain.

We, AT&S, believe that ICSubstrates is one of these few vehicles that would create a far reaching impact in Malaysia. As ICSubstrates is an essential element of Advance Packaging (reference More than Moore front-end Vs. Back-end nodes developments). With the technology of AT&S’s high end IC Substrates, it will bridge gap of the semiconductor value chain and to shift Malaysia from OEM producer to a powerhouse of R&D with a focus on high end IC substrate.

In our presentation we will show how by bringing into Malaysia AT&S proprietary technology of high end IC Substrates, we will develop and create high-tech knowledge that can be benefitical for all the surrounding countries, besides developing a more complete ecosystem for Advance packaging in Malaysia. This is what we trust AT&S would bring to Malaysia to enhance its position as a prominent player in semiconductor in ASEAN.

Dr. Abderrazzaq Ifis photo

Dr. Abderrazzaq Ifis

Engineering Director

AT&S

As Engineering Director, Dr. Abderrazzaq Ifis is leading the new AT&S IC-Substrate plant qualification and ramp-up in Kulim. He has over 13 years of engineering experience in developing and manufacturing innovative and high-end technologies and products. Dr. Ifis hold a Ph.D. in Mechanics of Materials and Ing. degree in Processes Engineering from prestigious Moroccan and French institutions. Abderrazzaq and his family have been relocated to Malaysia in 2022, seeking not only career development but also exploring life in a joyful, rich and diversified culture and environment here.

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AT&S has chosen Malaysia for its pioneer production site in Southeast Asia. With a planned total investment of €1.7 billion (RM8.5 billion) over the next 6 years, this is by far the largest investment in the corporate history of AT&S. The new campus of AT&S is being built at Kulim Hi-Tech Park, which is approximately 350km north of the capital city, Kuala Lumpur. The ongoing construction work started in November 2021 and the start of series production is tentatively scheduled for the end of 2024.

At AT&S Kulim site, there are 3,000 – 4,000 construction workers performing different tasks at site to deliver the fast track construction progress. This manufacturing facility, once completed, will be responsible for the production of high-end IC substrates for high-performance processors at the location in Southeast Asia. These processors are primarily used in high-performance computers, data centres, gaming, 5G, automotive and Artificial Intelligence (AI).

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AT&S
  • 15:35 – 16:05

Networking Coffee/Tea Break & Business Meeting

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