ISES SEA 2023

7-8 November, 2023 – Penang, Malaysia

  • Shangri-La’s Rasa Sayang Resort & Spa
  • Jalan Batu Ferringhi, Kampung Tanjung Huma, 11100 Batu Ferringhi, Pulau Pinang, Malaysia

Sponsors

Agenda Day 1 – November 7, 2023

Registration

07:45 – 08:35

Welcome Speech

08:40 – 09:00

Salah Nasri

President

ISES

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Opening Address

09:05 – 09:20

YAB Chow Kon Yeow

Chief Minister of Penang

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Opportunities in the Southeast Asian Semiconductor Industry

Panel Discussion: Opportunities & Challenges Arising From the Changing Semiconductor Geopolitical Climate

09:25 – 09:55

Kamel Ait Mahiout

President

ISES

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Networking Coffee/Tea Break & Business Meeting

10:00 – 11:00

Challenges for SEA to Move Towards Advanced Packaging Technology

Unleash Product Innovations with 3DFabric

11:05 – 11:30

Kam Lee

Deputy Head of TSMC Advanced Packaging Technology and Service

TSMC

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Future Opportunities: Semiconductors Packaging

11:35 – 12:00

Amarjit Sandhu

CVP of Assembly and Test, NAND Operations

Micron Technology, Inc.

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Lunch Break

12:00 – 13:00

Evolution of Manufacturing Factory – From Assembly Test to Advanced Packaging

13:05 – 13:20

Teng Chow Ooi

Sr Director Program Office

Intel Corporation

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MIMOS BERHAD Initiatives in Advancing the Semiconductor Industry in Malaysia

13:25 – 13:40

Thiagesh K Lingam

Senior Director

MIMOS

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System-level Packaging: Challenges and Solutions

13:45 – 14:05

Dr. JinYoung Khim

Sr. Vice President Global R&D Strategy

Amkor Technology, Inc.

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Panel Discussion: Challenges for SEA to Move Towards Advanced Packaging Technology

14:10 – 14:40

Fouzun Naseer

Director R&D, Technology, Industry

CREST

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Exploring Innovations and Growth in the SEA Semiconductor Industry – Competitive Advantages & Challenges

Western Digital’s Semiconductor Odyssey: Charting a Course for Innovation and Business Growth

14:45 – 15:05

YT Chin

Senior Director, Flash Backend Engineering

Western Digital

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Exploring Innovations and Growth in the SEA Semiconductor Industry – Competitive Advantages & Challenges

15:10 – 15:30

Dr. Abderrazzaq Ifis

Engineering Director

AT&S

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Networking Coffee/Tea Break & Business Meeting

15:35 – 16:05

Silicon Photonics and its Challenges

16:10 – 16:30

Arjun Kumar Kantimahanti

R&D Engineer

Broadcom

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The Challenges Facing Workforce for the Growing Semiconductor Industry

Panel Discussion: Empowering the Next Generation of Semiconductor Talent in SEA

16:35 – 17:15

Noorazidi Che Azib

Deputy Vice President

Inari Amertron Berhad

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Update From Equipment & Material Manufacturers

Panel Level Packaging Requires the Same Wet Process Performance As Wafer Level Packaging

17:20 – 17:30

Herbert Oetzlinger

VP Business Development

Lam Research Corporation

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Closing Address

17:30 – 17:40

Networking & Cocktail Reception

17:45 – 19:00

Gala Dinner Hosted by InvestPenang

Agenda Day 2 – November 8, 2023

Registration

08:30 – 08:55

EV Opportunities and What it Means for the Semiconductor & Sensors Industry

Zero Emission Becomes Real in Next-Generation Mobility

09:00 – 09:25

CS Chua

President & Managing Director

Infineon Technologies AG

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Global Vehicle Electrification Trends and BEV Opportunities in the Developing World

09:30 – 09:50

Dr. Yik Yee Tan

Sr. Market and Technology Analyst

Yole Intelligence

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Networking Coffee/Tea Break & Business Meeting

09:55 – 10:55

MEMS & Sensors to Support the Growing Demands of EV

More than Moore Emerging Technologies for the Sensing Needs in EV

11:00 – 11:20

Dr. Eloi Marigo Ferrer

Member of Technical Staff

SilTerra Malaysia Sdn. Bhd

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Piezoelectric MEMS Platform for Sensing and RF Applications

11:25 – 11:45

Dr. Yul Koh

Senior Scientist

A*Star IME

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SingleDieTM MEMS-Based SAW MEMS on CMOS Reference Clock for Automotive and Industrial Applications

11:50 – 12:10

Ayman Ahmed

CEO

Pearl Semiconductor

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Progress of Wafer Level Advanced Packaging Technology for MEMS and Sensor Integration

12:15 – 12:35

Jovin Li

Technical Marketing Director

Xiamen Sky Semiconductor Technology Co., Ltd.

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Lunch Buffet

12:35 – 13:55

Power Semiconductors to Support the Growing Demands of EV

Innovative Power Solutions in Industrial Applications driving towards Carbon Neutrality and Greener Future

14:00 – 14:20

Francesco Muggeri

VP Marketing & Applications, Power Discrete & Analog, APeC/China

STMicroelectronics

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Wolfspeed’s SiC Optimized Power Module Approach

14:25 – 14:45

Sascha Dern

Director of Product Line

Wolfspeed

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Intelligent Power and Sensing Packaging Solutions for a Sustainable Future

14:50 – 15:10

Jerome Teysseyre

VP Package Development & Engineering

onsemi

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Closing Remarks

15:15 – 15:25

Speakers

Venue

Shangri-La’s Rasa Sayang Resort & Spa

Jalan Batu Ferringhi, Kampung Tanjung Huma, 11100 Batu Ferringhi, Pulau Pinang, Malaysia

Advisory Board