16:40 – 16:50
Wet Process and TBDB for Heterogeneous Integration
Wet process and TBDB (Temporary Bonding and Debonding) are important and critical for heterogeneous integration and advanced packaging.
Eric Lee
Scientech
Eric Lee is the CEO of Scientech Corp. and Chairman of Yayatech. He joined Scientech in 2004, following nearly a decade at UMC, where he held positions in both Taiwan and Singapore from 1995 to 2004.
In addition to his leadership roles at Scientech and Yayatech, Eric serves as President of the International Semiconductor Executive Summit (ISES) Taiwan. He is also a part-time professor in the Advanced Packaging Master’s Program at National Taiwan University of Science and Technology.
Eric contributes actively to the industry through his roles as a member of the SEMI Taiwan Advanced Packaging Committee and as a director of the Taiwan Electronic Equipment Industry Association.
Company Profile
Scientech Corporation was established in Taipei, Taiwan in 1979.
What we do: Industries we serve: Semiconductor (front-end, back-end and GaAs), Flat Panel Display, LED, Data Storage, Scientific Instruments and high-tech related industries.
Being a leading semiconductor equipment and wafer reclaim supplier in Taiwan, Scientech Corporation has launched the development of wet process equipment in 2003. Scientech has successively supported customers in LED, Mini/Micro LED, compound semi and power components such as IGBT, SiC and GaN industries, as well as advanced packaging process such as Bumping, Fan-out, Chip-On-Wafer and so on. Our wet process equipment has been successfully verified in the latest Chiplet’s 2.5D/3D packaging process technology and smoothly introduced into mass production.
