Education:

• PhD in Chemical Engineering
• MBA

Experience:

• Executive Vice President, Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation
• Vice President, Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation
• Senior Fellow, Global Applications and Business Development at Ajinomoto Fine-Techno USA Corporation.

Habib Hichri is an Executive Vice President, Senior Fellow Global Applications and Business Development at Ajinomoto Fine-Techno Corporation USA. Prior to joining AFT USA, Habib was Director of Applications Engineering at SUSS MicroTec Photonics Systems USA where he provided patterning solutions for advanced semiconductors packaging customers. Before joining SUSS MicroTec, Habib spent about 12 years with IBM Semiconductors Research and Development Center (IBM SRDC) in East Fishkill, NY where he worked as lead process integration engineer for microprocessor (IBM), games and communications chips. He later was promoted to management positions within IBM on process development in the front end of line area for microprocessor fabrication. Habib holds over 40 U.S. patents and authored over 75 publications and presentations and a book chapter in “Advances in Embedded and Fan-Out Wafer Level Packaging Technologies” (Wiley – IEEE) first Edition. Habib received Master and PhD degrees in Chemical Engineering from the Claude Bernard University at Lyon, France, and an MBA degree from the State University of New York at Buffalo. Habib is the chair of the Orange County California IEEE/Electronic Packaging Society (EPS) Chapter. He is also a member of the technical committees of Electronic Components and Technology Conference (ECTC), International Microelectronics Assembly and Packaging Society (IMAPS). He was the general chair of IMPAS 2020. Habib is IMAPS Society Fellow. He is currently member of the IMAPS executive council. Habib is Board member of International Electronics Manufacturing Initiative (iNEMI) since April 2024 and International Semiconductor Industry Group (ISIG) since April 2025.

Ole Gerkensmeyer is VP Sales EMEA at Nexperia, a leading semiconductor manufacturer for essential and power semiconductors. He started his semiconductor career over 25y ago with Texas Instruments, where he held several management positions over his 17year tenure. He then became General Manager of Future Electronics’ distribution business in Central Europe. Most recently, he spend over 5 years with Wolfspeed, where he not only led their EMEA Automotive business but also was influencial in establishing corporate business development projects. – Next to Nexperia, Ole is also active as an advisory board member at the world’s power electronics conference: PCIM. His interest is focussed on semiconductor business growth as well as power electronics.

An award-winning entrepreneur, Eric Aguilar is a visionary leader in the field of advanced sensor systems for complex systems, such as robotics and autonomous platforms.

Throughout his distinguished two-decade career, Eric’s passion for sensor design and innovation has made him a key player in the industry. His expertise includes leading teams at renowned companies such as Tesla, where he managed a crew of 300 engineers on the firmware for Model 3, and at X, where he spearheaded the development of Google Project Wing, an autonomous drone delivery service.

Eric’s expertise in sensor integration includes leadership positions at autonomous vehicle and robotics companies. His role in steering product development for a sensor company later acquired by Google — as well as for his pioneering work building sensors for drones at US Navy Research Labs — further showcases his depth of experience.

Eric earned a BS in Electrical Engineering from California State Polytechnic University and has pursued advanced studies in Electrical and Electronics Engineering at the University of Southern California. His work continues to shape the future of MEMS and sensor technology, making him a sought-after thought leader and speaker in the field.

Dr. Abdullah earned his undergraduate degree from the University of Brighton and pursued both his Master’s and PhD at King Abdullah University of Science and Technology (KAUST), specializing in circuit design and developing low-power, high-performance ASICs for MEMS sensors. He is currently an Assistant Professor at Umm Al Qura University and serves on the KAUST Saudi Alumni Executive Committee. Dr. Abdullah has authored and co-authored more than 10 research papers, co-founded TRYSL Tech and DeepCARES, and leads the Business Development Unit at the Saudi Electronics Material Company, with professional experience collaborating with Aramco, STC, and Cadence.

Mo Maghsoudnia is the visionary Founder and dedicated CEO at the helm of UltraSense Systems, a pioneering company in the technology and manufacturing sector. With a track record of transformative leadership and innovation, Mo has been instrumental in shaping the industry landscape.

Before founding UltraSense, Mo Maghsoudnia made significant contributions as the Vice President of Technology & Manufacturing at InvenSense. In this influential role, he oversaw global operations and spearheaded the development of cutting-edge Process Technology. Under his guidance, InvenSense achieved remarkable success, culminating in its acquisition by TDK for a staggering $1.4 billion in 2017.

Prior to his tenure at InvenSense, Mo Maghsoudnia served as the Vice President of Manufacturing at NetLogic MicroSystems. Here, he demonstrated his exceptional ability to steer manufacturing operations, elevating the company from a single product line to a diversified product portfolio powerhouse. His adept leadership, combined with a diverse product range, paved the way for Broadcom’s acquisition of NetLogic MicroSystems for a
remarkable $4 billion in 2012.

Mo’s expertise is firmly rooted in his academic pursuits, holding a Master of Science in Electrical Engineering from Santa Clara University. His passion for innovation is further underscored by his impressive intellectual property portfolio, boasting 12 patents, and an extensive list of research papers that he has authored.

Mo Maghsoudnia’s unwavering commitment to technological advancement and his exceptional leadership have left an indelible mark on the tech and manufacturing sectors, solidifying his status as a true industry luminary.

Over 35 years in Semiconductor and high-tech industry,
President & CEO ZCE Group Energy Innovation & Decarbonation
President & CEO Novasensing, Neuromorphic ML/AI Edge AI company
President of International Semiconductor Executive Summits as of end on June 2024.
ATLANT3D as a CCO, ALD Process direct deposition,

Worked at Applied Material on the advance packaging corporate business on Hybrid bonding Cluster, Digital Lithography and Metrology & Inspection.

Prior to AMAT he served as CEO of Unity SC, inspection, and Metrology company where he reengineered the company from the product and organization to alignment with tiers 1 customers,

Prior to Unity, Kamel Served Amkor Technology as a President and General manager for Europe & Singapore over 18 years aligning and growing the company with European key players and starts up.

Started in the industry over 35 years ago as RF and Microwave R&D Engineer designing product & Modules for Aerospace, Military, and telecom markets, then served managing internal and external Operations Front end and Back end.

Kamel holds a Bachelor in Electronics from University HB in Algeria and a master’s in electronic from Reims University France.

Dr. Ara Philipossian has been a professor of Chemical Engineering at the University of Arizona since 2001, where he holds the Koshiyama Chair of Planarization. Since its establishment in 2004, he has also been the Co-Founder, President, and CEO of Araca Incorporated, the premier provider of services and equipment to the polishing and planarization industry worldwide. He received his BS, MS, and PhD in Chemical Engineering from Tufts University in 1983, 1985, and 1992, respectively. From 1992 to 2001, he was the Materials Technology Manager at Intel Corporation (Santa Clara, CA, USA), responsible for the development, characterization, implementation, and sustaining of new and existing CMP and post-CMP cleaning consumables, low-k dielectrics, and electroplating chemicals. From 1986 to 1992, he worked at Digital Equipment Corporation (Hudson, MA, USA) as a process development manager focusing on thermal silicon oxidation, diffusion, LPCVD of dielectric and gate electrodes, and wafer cleaning technology. Dr. Philipossian has authored approximately 180 archival journal publications and 210 conference proceedings articles. He holds 36 patents in semiconductor processing and device fabrication.

Dr. Mohssen Moridi is an expert in microtechnology with over 20 years of experience in the development of MEMS devices. He holds a Master’s and Ph.D. in Microtechnology from École Polytechnique Fédérale de Lausanne (EPFL), Switzerland. After completing his doctoral studies, he held various research positions in Switzerland, contributing to advancements in microsystems technology. In 2016, he moved to Austria to lead the Microsystem Division at CTR AG, where he established a MEMS department and managed the development of a new cleanroom dedicated to industrial R&D. Since 2019, he has been part of Silicon Austria Labs (SAL) and currently serves as Senior Executive Director and Head of the Microsystems Research Division. In this role, he leads a team of over 60 researchers, driving innovation in thin-film technologies, integrated photonics, and magnetic and piezoelectric microsystems. With extensive experience at the intersection of research and industry, Dr. Moridi plays a key role in shaping cutting-edge microsystem technologies, bridging fundamental research with industrial applications.

Oleh Krutko is a Senior Vice President of Design and Systems R&D at imec. In this role, he leads global research and engineering organization responsible for developing systems and circuits IP and solutions as well as managing ASIC volume production operations. Previously he was a General Manager of IC-Link by imec, imec division that offers ASIC solution development and manufacturing services.

Prior to joining imec, Oleh Krutko was a Senior Director of Engineering at AMD, managing Analog and Digital RF organization responsible for developing SOCs and ASICs for wireless infrastructure, defense, aerospace, test, and measurement applications. Previously, he was a Director of Engineering at Qorvo Texas, where he was responsible for RF, millimeter wave, broadband and power product development organization, and RF Design Specialist at Nokia North America R&D, where he was working on high efficiency power amplifiers and transmitters for wireless infrastructure.

Oleh Krutko has PhD in Electrical Engineering from the University of Cincinnati, Ohio, USA. He co-authored 40 journal and conference papers and has 7 patents. Oleh Krutko is a senior member of IEEE and Technical Program Committee member of IEEE RFIC conference.

Sam Bordbar is a Sr Account Technical Executive with nearly three decades of experience shaping the semiconductor and electronic design automation (EDA) landscape. His career spans the full evolution of digital back-end design, from the early days of EDA to today’s advanced multi-die architectures, that gives him a unique view on the industry’s transformation.

As a recognized Implementation Solutions Leader and a key member of the Global Account Management team, Sam has driven strategic partnerships and delivered implementation excellence across Semiconductor, AI, Cloud, and Data Center ecosystems. In his current role at Cadence, he leads business development and strategic initiatives across the Middle East, helping customers on rapidly evolving technology areas.

Sam holds a BS in Electronic and Computer Engineering from the KTH Royal Institute of Technology in Stockholm. His blend of technical depth and practical industry insight, developed over 26 years in EDA, makes him an influential voice in conversations about the future of semiconductor design.

吴桐，安森美（onsemi）中国区汽车市场负责人，上海交通大学半导体物理专业，数学专业辅修本科毕业，美国田纳西大学电气工程博士学位。吴博士在半导体封装，碳化硅设计应用方面拥有 10 余年的研发和工业经验。 目前在安森美负责中国区汽车技术与市场，覆盖产品设计，制造，市场及应用，了解新能源行业的市场、供应链、开发流程以及解决方案。与国内多家车厂、Tier 1 保持着深度合作以及技术支持。曾就职于美国田纳西州橡树岭橡树岭国家实验室（ORNL），以及车厂研发团队，共在国际会议和期刊上发表了 40 多篇论文，同时获得了多项 半导体方面的美国专利。

Dr. Tong Wu is onsemi SiC Expert & Leader of China Auto Marketing & Technical Team, responsible for developing the SiC market in China, as well as providing technical support for car OEMs and Tier1s, and participating in multiple NPIs. He has more than 10 years of R&D and industrial experience in wide band-gap devices and its applications. Prior to joining onsemi, Dr. Wu conducted his research at Oak Ridge National Laboratory(ORNL) for multiple DOE-funded SiC-related projects.

Dr. Wu received his B.S. degree from Shanghai Jiao Tong University, majoring in semiconductor physics and minoring in mathematics. Dr. Wu received his Ph.D. in Power Electronics from the University of Tennessee, USA. He conducted his doctoral research at the Power Electronics and Electric Machinery Research Center of Oak Ridge National Laboratory(ORNL). Dr. Wu has authored/co-authored more than 40 papers in international conferences and journals and awarded several U.S. patents in SiC area.