Enabling Intelligence at the Edge: MEMS and Sensors Powering the AI Era

07:30 – 08:30

Registration

08:30 – 08:45

M.S.W.S. & I.S.I.G. Welcome

08:50 – 09:10

Keynote

MEMS-based Laser Scanning Displays for Augmented Reality

MEMS based laser-scanning is a technology platform that enables a wide range of applications including LIDAR, optical switching, and optical projectors. Within the field of optical projectors, this technology has been explored as a display solution for Augmented Reality (AR) headsets. This solution has several strengths including high brightness, high contrast, and compact form factor. At the same time, challenges exist around spatio-temporal perceptual artifacts, image quality, and MEMS performance. In this talk, I will discuss novel methods for addressing the perception challenges as well as MEMS requirements needed to enable these solutions.

Ken Diest

Research Manager and Tech Lead

Meta

09:15 – 09:35

Keynote

Clear Sound, Clean Air: How disruptions in MEMS speakers and particulate matter sensors make our lives more comfortable and healthier.

MEMS already brought several disruptive innovations in the past from pressure sensors to inertial measurement units. With MEMS speakers, wide band accelerometers and ultra-small particle sensors new technologies enable new use cases. We will have a close look on these fascinating technologies and use cases that make our lives more comfortable and healthier.

Stefan Kimmerle, Ph.D.

VP Engineering

Bosch Sensortec

09:40 – 10:00

Keynote

Wired for Intelligence: SWI3S—The New Interface Standard for Ambient AI

As voice becomes the natural interface for AI systems, especially in wearables and edge devices, the limitations of legacy audio protocols like PDM are increasingly exposed. These older standards lack the scalability, synchronization, and embedded control required for intelligent, multi-microphone architectures.

Enter SoundWire-I3S (SWI3S)—the next-generation interface standard designed to meet the demands of ambient AI. With support for up to 12 peripherals on a single 2-wire bus, dynamic scheduling, and integrated control signaling, SWI3S enables compact, power-efficient microphone arrays that are purpose-built for voice-first interaction.

This talk will explore how SWI3S is already unlocking new possibilities in smart glasses, where products like Meta Ray-Ban and Oakley frames integrate 5+ microphones per unit. These wearables represent a shift toward seamless, conversational AI—where synchronized audio capture and reduced wiring complexity are no longer optional, but foundational.

By aligning MEMS innovation with the rise of ambient intelligence, SWI3S is not just a technical upgrade—it’s the new interface standard for AI communication.

Gunar Lorenz, Ph.D.

Senior Director Technical Marketing Sensors

Infineon Technologies AG

10:05 – 11:05

Networking Break

11:10 – 11:30

MEMS Infinity supports device commercialization in AI Era

MEMS Infinity, Sumitomo Precision Products has an alliance with A.M.Fitzgerald to provide an integrated product development support of PZT MEMS to customers in various markets, and AI is certainly one of them. We can shorten the time to market and reduce the cost of development. MEMS can play an important role in AI Era, not only in edge AI but also in cloud-based AI. Some examples for the different AI applications will be presented to stimulate the audience to have various new ideas for the future.

Hiroshi Miyajima, Ph.D.

Fellow ICT Division

MEMS Infinity / Sumitomo Precision Products

11:35 – 11:55

Senni Laaksonen

SVP Research and Development

Murata Manufacturing Co., Ltd.

12:00 – 12:20

Do AI Factories Dream of MEMS Sheep?

From the dystopian nanobots dreaded by the cyberpunk authors of 70s to the trillion-sensor networks dreamed by the market analysts of the 2010s, the miniaturization potential afforded by the electronics industry to the sensor world has sparked imaginations. With AI impacting the world around us, where do sensors fit, and where will the next growth come from? Due to physical limitations, the trend will be increasing component functionality and intelligence rather than further reducing footprint. Amkor has a strong presence worldwide and continuously invests, to always be ready to support the next industry expansion!

Nick Renaud-Bezot

Senior Manager, MEMS and Sensor BU

Amkor Technology, Inc.

12:25 – 12:45

Micro Machines, Macro Impact: Powering Societal Change with European MEMS

At the MEMS & Sensors World Summit in Dresden, Kees Wesdorp will present how MEMS and photonics technologies are essential in solving major global challenges—from driving access to healthcare to reducing AI energy consumption. Representing XIVER, he will highlight the company’s evolution from its Philips legacy into a nimble, high-impact European foundry serving global markets. The talk includes real-world examples in healthcare, AR/VR, and photonic integration, emphasizing Europe’s strategic opportunity and XIVER’s ecosystem role. With a call to accelerate lab-to-fab pathways, the presentation frames MEMS not just as tiny components—but as miniature engines of massive, planetary-scale change.

Kees Wesdorp, Ph.D.

Chairman of the Board XIVER Group

XIVER Mems Foundry

12:50 – 13:50

Buffet Lunch

13:55 – 14:15

From Sensing to Thinking: The Evolution of MEMS with Embedded AI

2024 was a welcome turning point for the MEMS industry, with global revenue estimated at $15.4 billion. This is primarily due to the winding down of the inventory stockpiling in the second quarter of 2024. The race for innovation is crucial to maintaining a high sensor value and stabilizing the average selling price (ASP). Implementing first-stage data processing at the sensor level is one possible solution that brings several advantages, from power consumption to versatile applications and ease of integration.
The presentation will provide an overview of the current status of the MEMS industry, key trends expected over the next five years, and insights into the evolution of the MEMS ecosystem within the global economic context.

Pierre-Marie Visse

Senior Technology & Market Analyst, MEMS & Sensing

Yole Group

14:20 – 14:40

Beyond the Sensor: How Driver ASICs Unlock Next-Gen MEMS Performance in HMI Applications

Sensors are the cornerstone of modern HMI interfaces—from touch controls to gesture recognition. Yet their full potential hinges on a critical, often overlooked component: high-performance driver ASICs. In this session, GlobalFoundries explores how advanced analog/mixed-signal and BCD process technologies solve key MEMS challenges: signal integrity, power efficiency, system integration, and reliability. Discover how optimized ASIC-MEMS co-design enables smaller form factors, lower latency, and enhanced functionality in automotive, industrial, and consumer HMI systems. We’ll showcase real-world applications and outline a collaborative framework for MEMS designers to leverage GF’s silicon leadership—proving that the right interface is just as vital as the sensor itself.

Ruby Yan, Ph.D.

Business Unit Director – Display, Sensor, Security

GlobalFoundries

14:45 – 15:05

Microchannel particle deposition for MEMS & Sensors Applications

Mesoline has developed a new microfabrication technology: Microchannel particle deposition (MPD). The MPD process offers several advantages over other deposition technologies such as inkjet & screen-printing. MPD uses a polymeric stamp containing microchannels to transfer ink onto a wafer.
This technology can be used for various applications including metal oxide gas sensors, deposition of glass frit, bio sensors, quantum sensors and moisture/hydrogen getters.
In this talk, the MPD will be showed and explained in detail and afterwards several key applications will be highlighted.

Thomas Russell

CEO and Co-Founder

Mesoline

15:10 – 15:40

Networking Break

MEMS & Sensor Testing

15:45 – 15:55

Coping with complexity – a flexible test system for a wide range of digital sensors

As MEMS sensor technologies evolve and MEMS sensor applications increase in complexity to offer more and more functions also sensor interfaces have become a constantly changing target. To be able to cope with the already existing variety of sensor interface parameters as well as be ready for future advancements in sensor protocols and data rates IDM’s and test service providers need to make smart decisions towards proper test equipment. In this presentation a flexible and cost efficient solution for testing digital sensors will be presented.

Ingolf Leidert

Product Manager Device Testing

SPEKTRA GmbH Dresden

16:00 – 16:10

Demands for sensor test from development to high-volume manufacturing

Basic needs for MEMS and sensor test and calibration systems remains the same from product development to manufacturing, there’s significant differences on detail level. Presentation describes Pentamaster approach of transferring from laboratory system to mid- and high-volume production using the example of a ambient light sensor (ALS).

Ari Kuukkala

Development Manager

Pentamaster

16:15 – 16:25

Navigating the Complexities of Wafer Level Chip Scale Package (WLCSP) MEMS Testing

The rapid adoption of Wafer Level Chip Scale Package (WLCSP) technology is revolutionizing MEMS manufacturing, enabling unprecedented miniaturization, higher integration, and cost efficiencies critical for the next generation of smart devices, automotive systems, and IoT applications. However, this advancement introduces significant challenges in device testing, particularly concerning precision handling, accurate probing, and addressing device-specific environmental sensitivities.

 

This presentation will delve into the critical hurdles faced in WLCSP MEMS testing, emphasizing solutions that ensure quality and reliability in high-volume production. We will explore the imperative for ultra-accurate pick-and-place mechanisms that prevent ‘stuck devices’ and safeguard delicate surfaces, alongside advanced probing techniques for fine-pitch contacts. Furthermore, the session will highlight specialized test considerations for challenging device families: from the necessity of isolated test environments for inertial sensors to mitigate acoustic and mechanical noise, to stringent contamination control measures for imaging sensors that demand pristine surfaces. The discussion will also cover the advantages of integrated test processes, where a single machine handles devices from diced wafer to tape and reel, significantly boosting efficiency and minimizing the risk of damage due to handling processes. Finally, we’ll touch upon the role of auto-maintenance functions in enhancing handler reliability and optimizing preventive maintenance schedules.

 

Attendees will gain valuable insights into the latest innovations and best practices for overcoming the unique complexities of WLCSP MEMS testing, contributing to robust and cost-effective manufacturing workflows for a rapidly expanding market.

Oleg Fotteler

International Sales & Support – Management

SPEA

16:30 – 16:40

Faster MEMS Development: Reducing Tapeouts

MEMS development is time-consuming and costly. As mechanical structures—whether accelerometers, gyros, or micromirrors—become more complex, meeting specifications grows increasingly difficult. Process Design Kits (PDKs) are also more sophisticated, adding to the challenge. This presentation demonstrates how to significantly reduce the number of tapeouts needed to develop a production-ready sensor. Learn how advanced modeling and simulation can accelerate development, cut costs, and improve first-time-right success. Whether you’re designing next-generation inertial sensors or or revise existing designs, this talk provides practical methods to streamline your design process and shorten time-to-market.

Jan Mehner

Managing Director

i-ROM GmbH

16:45 – 16:55

Public funding opportunities for the semiconductors industry in the EU

The semiconductors industry is among the highest beneficiaries of public funding in the EU. Grants target R&D activities, first industrial deployment of breakthrough innovations and first of a kind manufacturing facilities. Securing such State aid and EU funding is a highly competitive process which requires a thorough understanding of the numerous opportunities and associated regulations. Based on several use cases, Marc Isabelle’s presentation will provide a valuable first dive into public funding opportunities for the semiconductors industry in the EU.

Marc Isabelle, Ph.D.

Founder & CEO

european economics

17:00 – 17:45

Panel Session: Breakthrough Innovations, Industry Collaborations and Roadmap

Jörg Amelung photo

Moderator

Jörg Amelung

Deputy Institute Director Division, Director Engineering, Manufacturing & Test

Fraunhofer Institute for Photonic Microsystems

Panelist

Ken Diest

Research Manager and Tech Lead

Meta

Panelist

Alastair Attard

Director of Business Development

UTAC Group

Panelist

Volker Herbig

VP BU Microsystems

X-FAB

Panelist

STMicroelectronics

Panelist

Silex Microsystems

18:00 – 21:30

Cocktail Networking Reception & Gala Dinner at Hilton Dresden

Awards Ceremony 

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