Enabling Intelligence at the Edge: MEMS and Sensors Powering the AI Era

07:30 – 08:30

Registration

08:30 – 08:45

M.S.W.S. & I.S.I.G. Welcome

08:50 – 09:10

Keynote

Ken Diest

Research Manager and Tech Lead

Meta

09:15 – 09:35

Keynote

Stefan Kimmerle, Ph.D.

VP Engineering

Bosch Sensortec

09:40 – 10:00

Keynote

Gunar Lorenz, Ph.D.

Senior Director Technical Marketing Sensors

Infineon Technologies AG

10:05 – 11:05

Networking Break

11:10 – 11:30

MEMS Infinity supports device commercialization in AI Era

MEMS Infinity, Sumitomo Precision Products has an alliance with A.M.Fitzgerald to provide an integrated product development support of PZT MEMS to customers in various markets, and AI is certainly one of them. We can shorten the time to market and reduce the cost of development. MEMS can play an important role in AI Era, not only in edge AI but also in cloud-based AI. Some examples for the different AI applications will be presented to stimulate the audience to have various new ideas for the future.

Hiroshi Miyajima, Ph.D.

Fellow ICT Division

MEMS Infinity / Sumitomo Precision Products

11:35 – 11:55

Senni Laaksonen

VP Research and Development

Murata Manufacturing Co., Ltd.

12:00 – 12:20

Do AI Factories Dream of MEMS Sheep?

From the dystopian nanobots dreaded by the cyberpunk authors of 70s to the trillion-sensor networks dreamed by the market analysts of the 2010s, the miniaturization potential afforded by the electronics industry to the sensor world has sparked imaginations. With AI impacting the world around us, where do sensors fit, and where will the next growth come from? Due to physical limitations, the trend will be increasing component functionality and intelligence rather than further reducing footprint. Amkor has a strong presence worldwide and continuously invests, to always be ready to support the next industry expansion!

Nick Renaud-Bezot

Senior Manager, MEMS and Sensor BU

Amkor Technology, Inc.

12:25 – 12:45

Micro Machines, Macro Impact: Powering Societal Change with European MEMS

Kees Wesdorp, Ph.D.

Chairman of the Board XIVER Group

XIVER Mems Foundry

12:50 – 13:50

Buffet Lunch

13:55 – 14:15

From Sensing to Thinking: The Evolution of MEMS with Embedded AI

2024 was a welcome turning point for the MEMS industry, with global revenue estimated at $15.4 billion. This is primarily due to the winding down of the inventory stockpiling in the second quarter of 2024. The race for innovation is crucial to maintaining a high sensor value and stabilizing the average selling price (ASP). Implementing first-stage data processing at the sensor level is one possible solution that brings several advantages, from power consumption to versatile applications and ease of integration.
The presentation will provide an overview of the current status of the MEMS industry, key trends expected over the next five years, and insights into the evolution of the MEMS ecosystem within the global economic context.

Pierre-Marie Visse

Senior Technology & Market Analyst, MEMS & Sensing

Yole Group

14:20 – 14:40

Beyond the Sensor: How Driver ASICs Unlock Next-Gen MEMS Performance in HMI Applications

Sensors are the cornerstone of modern HMI interfaces—from touch controls to gesture recognition. Yet their full potential hinges on a critical, often overlooked component: high-performance driver ASICs. In this session, GlobalFoundries explores how advanced analog/mixed-signal and BCD process technologies solve key MEMS challenges: signal integrity, power efficiency, system integration, and reliability. Discover how optimized ASIC-MEMS co-design enables smaller form factors, lower latency, and enhanced functionality in automotive, industrial, and consumer HMI systems. We’ll showcase real-world applications and outline a collaborative framework for MEMS designers to leverage GF’s silicon leadership—proving that the right interface is just as vital as the sensor itself.

Ruby Yan

Business Unit Director – Display, Sensor, Security

GlobalFoundries

14:45 – 15:05

Microchannel particle deposition for MEMS & Sensors Applications

Mesoline has developed a new microfabrication technology: Microchannel particle deposition (MPD). The MPD process offers several advantages over other deposition technologies such as inkjet & screen-printing. MPD uses a polymeric stamp containing microchannels to transfer ink onto a wafer.
This technology can be used for various applications including metal oxide gas sensors, deposition of glass frit, bio sensors, quantum sensors and moisture/hydrogen getters.
In this talk, the MPD will be showed and explained in detail and afterwards several key applications will be highlighted.

Thomas Russell

CEO and Co-Founder

Mesoline

15:10 – 15:40

Networking Break

MEMS & Sensor Testing

15:45 – 15:55

Coping with complexity – a flexible test system for a wide range of digital sensors

As MEMS sensor technologies evolve and MEMS sensor applications increase in complexity to offer more and more functions also sensor interfaces have become a constantly changing target. To be able to cope with the already existing variety of sensor interface parameters as well as be ready for future advancements in sensor protocols and data rates IDM’s and test service providers need to make smart decisions towards proper test equipment. In this presentation a flexible and cost efficient solution for testing digital sensors will be presented.

Ingolf Leidert

Product Manager Device Testing

SPEKTRA GmbH Dresden

16:00 – 16:10

Ari Kuukkala

Development Manager

Pentamaster

16:15 – 16:25

Navigating the Complexities of Wafer Level Chip Scale Package (WLCSP) MEMS Testing

The rapid adoption of Wafer Level Chip Scale Package (WLCSP) technology is revolutionizing MEMS manufacturing, enabling unprecedented miniaturization, higher integration, and cost efficiencies critical for the next generation of smart devices, automotive systems, and IoT applications. However, this advancement introduces significant challenges in device testing, particularly concerning precision handling, accurate probing, and addressing device-specific environmental sensitivities.

 

This presentation will delve into the critical hurdles faced in WLCSP MEMS testing, emphasizing solutions that ensure quality and reliability in high-volume production. We will explore the imperative for ultra-accurate pick-and-place mechanisms that prevent ‘stuck devices’ and safeguard delicate surfaces, alongside advanced probing techniques for fine-pitch contacts. Furthermore, the session will highlight specialized test considerations for challenging device families: from the necessity of isolated test environments for inertial sensors to mitigate acoustic and mechanical noise, to stringent contamination control measures for imaging sensors that demand pristine surfaces. The discussion will also cover the advantages of integrated test processes, where a single machine handles devices from diced wafer to tape and reel, significantly boosting efficiency and minimizing the risk of damage due to handling processes. Finally, we’ll touch upon the role of auto-maintenance functions in enhancing handler reliability and optimizing preventive maintenance schedules.

 

Attendees will gain valuable insights into the latest innovations and best practices for overcoming the unique complexities of WLCSP MEMS testing, contributing to robust and cost-effective manufacturing workflows for a rapidly expanding market.

Oleg Fotteler

International Sales & Support – Management

SPEA

16:30 – 16:40

Faster MEMS Development: Reducing Tapeouts

MEMS development is time-consuming and costly. As mechanical structures—whether accelerometers, gyros, or micromirrors—become more complex, meeting specifications grows increasingly difficult. Process Design Kits (PDKs) are also more sophisticated, adding to the challenge. This presentation demonstrates how to significantly reduce the number of tapeouts needed to develop a production-ready sensor. Learn how advanced modeling and simulation can accelerate development, cut costs, and improve first-time-right success. Whether you’re designing next-generation inertial sensors or or revise existing designs, this talk provides practical methods to streamline your design process and shorten time-to-market.

Jan Mehner

Managing Director

i-ROM GmbH

16:45 – 16:55

Marc Isabelle photo

Marc Isabelle, Ph.D.

Founder & CEO

european economics

17:00 – 17:45

Panel Session: Breakthrough Innovations, Industry Collaborations and Roadmap

Panelist

Ken Diest

Research Manager and Tech Lead

Meta

Panelist

Alastair Attard

Director of Business Development

UTAC

Panelist

Volker Herbig

VP BU Microsystems

X-FAB

Panelist

Fraunhofer Institute for Photonic Microsystems

Panelist

STMicroelectronics

Panelist

Silex Microsystems

Panelist

Northrop Grumman LITEF GmbH

18:00 – 21:30

Cocktail Networking Reception & Gala Dinner at Hilton Dresden

Awards Ceremony 

End of content

End of content