Boschman is a high-tech, engineering driven Dutch company focusing on advanced back-end semiconductor packaging solutions;
We provide a unique one-stop-shop concept, from idea to industrialization, for semiconductor packaging activities:
Package Development Services
Assembly & Test Services
Industrial Equipment
The Global Energy Transformation is a fact, and the Electric Revolution requires next gen products, technologies, processes and materials.
We focus on these opportunities with technology leadership in Pressure Sintering and Advanced Molding, supported by our Patented Technology (DIT, FAM, TPV,…) and unique, unparalleled packaging expertise.
