Company Profile

  • Boschman is a high-tech, engineering driven Dutch company focusing on advanced back-end semiconductor packaging solutions;
  • We provide a unique one-stop-shop concept, from idea to industrialization, for semiconductor packaging activities:
  • Package Development Services
  • Assembly & Test Services
  • Industrial Equipment
  • The Global Energy Transformation is a fact, and the Electric Revolution requires next gen products, technologies, processes and materials.
  • We focus on these opportunities with technology leadership in Pressure Sintering and Advanced Molding, supported by our Patented Technology (DIT, FAM, TPV,…) and unique, unparalleled packaging expertise.

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