27-28 August 2025
Suwon
Whether Si or SiC is the desired chip technology for an application, advanced packaging is needed to fully utilize and optimize the chip performance. Packaging must be designed for peak loads, though benefits of SiC are at average load. Semikron Danfoss has the technologies needed for the future need of high performance power electronics allowing electrification – in both industry and automotive – to scale up for a sustainable and decarbonized future.
Dr. Dominic Dorfner
Senior Vice President Automotive Division
Semikron Danfoss
Please login or visit our Membership page to sign up.