The ever-growing demand for AI computing power is propelling rapid advancements in packaging technology. AMD is at the forefront of these innovations, leading the way in 2.5D, 3D, and 3.5D packaging technologies. Beyond these advancements, we are pioneering the transformation of packages into complete systems by integrating components such as co-packaged optics. This presentation will delve into the limitations of wafer-scale and explore the emerging trend of panel-scale packages that integrate entire systems. The discussion will emphasize the intersection of architecture, optics, and thermal design, illustrating how these elements converge to meet the increasing demands of high-performance, energy-efficient applications.