Advance Packaging for Automotive MEMS and Sensors

ISES Docs:

Automotive MEMS based Actuator / Sensor and Optical Sensor devices continue to enable new exciting functionalities and applications in the automotive market — in Safety, Entertainment, Passenger Convenience and Advance Driver Assistance Systems (ADAS).

Increasing autonomous levels in the Automotive market requires higher performance for positioning and localization, inertial navigation and object detection / recognition while meeting government recommended or mandated implementation dates. These new functions and applications require more Advance Packaging Technologies, Heterogenous integration and Standard platforms.

The MEMS and Sensor Industry is evolving from a discrete single MEMS/sensor (leadframe + wirebond based packages) towards new packaging and interconnection technologies – such as a new standard Optical Packaging Platform or the use of Cu Pillars to interconnect devices. And increasing complexities require closer collaboration between the different stakeholders in the MEMS Actuator / Sensor and Optical Sensor Ecosystem.

Stefan Martens

Sr Director, MEMS and Sensor BU

Amkor Technology, Inc.

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