This presentation explores the pivotal role of semiconductor packaging technologies in driving innovation within the AI era. Key market trends and growth drivers such as 5G, edge AI, and automotive advancements are discussed. The talk delves into the evolution of semiconductor technologies, highlighting the shift towards compute-centric and AI-driven applications. Emphasis is placed on advanced packaging solutions like chiplets, heterogeneous integration, and co-packaged optics, which are essential for meeting the demands of AI data centers and edge computing. The session concludes with insights into the technical challenges and future directions for semiconductor packaging in AI applications.