As FLI pitch scaling advances toward the single-micron range, traditional flux-based Thermocompression Bonding (TCB) faces challenges in oxide removal and residue elimination, impacting underfill quality and long-term reliability. To address these limitations, TCB equipment manufacturers are developing fluxless Thermal Compression Bonding technology with key customers to enable further pitch scaling.

Two possible fluxless TCB technologies—formic acid vapor and atmospheric plasma—are being integrated into TC Bonding equipment to remove native metal oxide grown onto the bonding interface. While both methods achieve similar oxide removal performance, only plasma Active Oxide Reduction (AOR) is entirely residue-free.

This presentation will compare these fluxless TCB technologies and highlight the advantages of plasma AOR in achieving superior metal oxide reduction for high-reliability TCB processes.