Advanced packaging requires new approaches to achieve heterogeneous integration, energy efficiency, and performance scaling beyond conventional methods. ATLANT 3D’s proprietary Direct Atomic Layer Processing (DALP®) technology delivers a breakthrough by enabling localized, maskless material processing with atomic precision. This unique capability provides unmatched flexibility for next-generation packaging architectures, including 2.5D and 3D integration. By combining speed, cost efficiency, and material versatility, DALP® paves the way for transformative advances in semiconductor manufacturing and packaging innovation.