Advanced packaging demands ultra-precise material engineering—from hybrid bonding to reliable edge passivation. ATLANT 3D’s patented Direct Atomic Layer Processing (DALP®) technology enables on-demand, localized atomic layer processing of functional materials. Our approach eliminates the need for masks, vacuum chambers, and lithography steps—making it ideal for interface tailoring in advanced packaging. Join us to explore how atomic-scale processing can unlock novel integration schemes, improve device yield, and accelerate lab-to-fab transitions in the era of heterogeneous integration and chiplet architectures.