Bosch, as worldwide leading automotive Tier 1, is also providing SiC trench technology to support the EV ramp-up in China.

Since 2021 Bosch successfully achieved serial launch of automotive level SiC MOSFETS at the Chinese leading OEM customers.

Based on the patented trench technology, so far Bosch delivered over 42 Mio. pieces high quality and high performance SiC chips to the automotive market.

Starting from 2025, Bosch mastered the transition to 8-inch manufacturing, providing scaled capacity to support Chinese EV customers’ demand expansion.

In a nutshell, Bosch Semiconductors provides a holistic power semiconductor portfolio to the customers, offering chips, discretes and power modules.