The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS), funded by the EU Chips Act, advances Europe’s semiconductor manufacturing and chiplet innovation. With €730 million over 4.5 years, it enhances EU technological resilience by bridging application-oriented research with innovative chiplet technologies. APECS focuses on chiplet system design for computing, AI, and MEMS sensors/actuators, using 3D stacking, 2.5D wafer-level integration, and quasi-monolithic integration. It aims to be Europe’s hub for advanced packaging, fostering collaboration among RTOs, industry, and academia to accelerate progress from research to scalable manufacturing.