Next-Generation Silicon Photonics and 3-D Technologies for Scaling AI Systems

ISES Docs:

In this presentation, we will outline our vision for deeply integrating optical interconnects into the package, interposer, and wafer level, leveraging scaled Silicon Photonics and 3D technologies to implement high-density sub-pJ/bit optical transceivers. We will share some recent results from our ongoing research and development efforts on advanced optical devices, packaging and assembly.

Joris Van Campenhout

R&D Program Director

imec

ISES Members Only

Please login or visit our Membership page to sign up.