27-28 August 2025
Suwon
In this presentation, we will outline our vision for deeply integrating optical interconnects into the package, interposer, and wafer level, leveraging scaled Silicon Photonics and 3D technologies to implement high-density sub-pJ/bit optical transceivers. We will share some recent results from our ongoing research and development efforts on advanced optical devices, packaging and assembly.
Joris Van Campenhout
R&D Program Director
imec
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