Power modules are core components of inverters and converters in solar power plants, data center power supplies and in electric vehicles. Their packaging technology has a critical impact on system performance, reliability and lifetime.
Nexperia has introduced the copper clip interconnect technology for robust high-power cascode GaN devices. Further cutting-edge power module concepts have been introduced in recent times with embedded GaN dies that allow operation at much higher frequencies, as well as new cooling methods that are pushing today’s performance limits.