Glass offers unique properties and opportunities for advanced packaging. Research institutes and the advanced packaging industry have been working for years to integrate glass into next-generation IC substrates. Applications such as glass cores with ABF buildup on both sides, glass interposers with RDL, and other innovative glass-based solutions are continuously evolving.

Leveraging its expertise in PCP and IC substrates, along with a strong track record in turnkey solutions for photovoltaic fabs, SCHMID has developed advanced equipment and processes for TGV formation, glass core metallization, Embedded Trace Technology, and more. These innovations provide the industry with effective solutions for integrating glass into future IC substrates.