The Challenges in Heterogeneous Integration: Warpage, Singulation Defects, ESD/EOS/EMI, and Wet Process Issues
Heterogeneous integration (HI) combines multiple chip technologies within a single package, pushing the limits of materials, manufacturing, and reliability. Among the key challenges are warpage, singulation defects (such as Si chipping and cracking), electrostatic discharge (ESD), electrical overstress (EOS), electromagnetic interference (EMI), and issues related to wet process etching and cleaning.